Method and apparatus of fabricating liquid crystal display device

Abstract

A method and an apparatus of fabricating a liquid crystal display device adapted to improve a lift-off efficiency are disclosed. The liquid crystal display device is also disclosed. The method includes forming a first thin film on a substrate; forming a photo-resist pattern on the first thin film; etching the first thin film using the photo-resist pattern as a mask; forming a second thin film on the substrate having the photo-resist pattern; forming a plurality of stripper infiltration paths; and removing the photo-resist pattern and the second thin film using a stripper within the stripper infiltration paths. The device includes two substrates facing each other; a liquid crystal layer; data lines and gate lines that cross each other to define pixel regions; thin film transistors; pixel electrodes connected to the thin film transistors; and an inorganic layer in each pixel region, wherein the inorganic layer includes a plurality of cracks.

1 - 16 . (canceled) 
   
   
       17 . An apparatus of fabricating a liquid crystal display device, comprising:
 a first deposition unit to form a first thin film on a substrate;   a photolithography unit to form a photo-resist pattern on the first thin film;   an etching unit to etch the first thin film using the photo-resist pattern as a mask;   a second deposition unit to form a second thin film on the substrate having the photo-resist pattern;   a heat treatment unit to form a plurality of stripper infiltration paths; and   a removing unit to remove the photo-resist pattern and the second thin film using a stripper within at least one of the stripper infiltration paths.   
   
   
       18 . The apparatus of  claim 17 , wherein the photo-resist pattern is formed of an organic material and the second thin film is formed of an inorganic material. 
   
   
       19 . The apparatus of  claim 17 , wherein the first thin film is an insulating film and the second thin film is a conductive layer. 
   
   
       20 . The apparatus of  claim 17 , wherein the second thin film is a transparent conductive layer. 
   
   
       21 . The apparatus of  claim 17 , wherein the photolithography unit is used to bake the photo-resist pattern. 
   
   
       22 . The apparatus of  claim 21 , wherein a temperature of baking is set under a temperature of the heat treatment unit. 
   
   
       23 . The apparatus of  claim 17 , wherein the temperature of baking is approximately 80° C.-120° C. 
   
   
       24 . The apparatus of  claim 17 , wherein the temperature of the heat treatment unit is approximately 120° C.-200° C. 
   
   
       25 . The apparatus of claim  12 , wherein the heat treatment unit is used to perform at least one of a heating method and a light energy irradiating method. 
   
   
       26 . The apparatus of  claim 25 , wherein the heating method includes an infrared heating method. 
   
   
       27 . The apparatus of  claim 17 , wherein the removing unit includes a lift-off unit. 
   
   
       28 . A liquid crystal display device, comprising:
 a first substrate and a second substrate facing each other;   a liquid crystal layer interposed between the first substrate and the second substrate;   data lines and gate lines on the first substrate that cross each other to define pixel regions;   thin film transistors at crossings of each of the data lines and each of the gate lines;   pixel electrodes connected to each of the thin film transistors; and   an inorganic layer in each pixel region, wherein the inorganic layer includes a plurality of cracks.   
   
   
       29 . The device of  claim 28 , wherein the inorganic layer is an insulating material. 
   
   
       30 . The device of  claim 28 , wherein the inorganic layer is a semiconductive material. 
   
   
       31 . The device of  claim 28 , wherein the inorganic layer is a transparent conductive material. 
   
   
       32 . The device of  claim 28 , wherein the inorganic layer is any one of a metal and a metal alloy.