Methods and mechanisms for thermal semi conduction

Abstract

Thermal semi conductor is a mechanism for the control of conduction heat flux between two or more bodies with differing temperatures, promoting the unidirectional heat flux. It consists of composite slabs composed of materials with high and low thermal conductivity appropriately set, granting the thermal semi conduction. These slabs are able to displace allowing the contact between materials with high thermal conductivity respectively in order to promote higher heat flux or, in opposite, to displace facilitating the contact between materials with low thermal conductivity respectively to promote lower heat flux. The control of the heat transfer through the mechanism is defined by positioning the slabs appropriately. External devices can be used to promote the relative displacement of the slabs. On the other hand, an adequate design of the slabs can be used to promote or to avoid their thermal contact through thermal expansion or contraction. In this case, the control of the process can be reached automatically by the temperature gradient.

1 . A method of conceiving an object with semi conduction heat transfer properties, the method provide a object comprising adjustable composite slabs formed of good conductor material and good insulator material appropriately set and adjusted enabling the unidirectional heat transfer as well the control of the heat flux in presence of temperature gradient 
   
   
       2 . A heat transfer device forming a compound layer, wherein the composition comprises: at least a pair of parallel composite slideable slabs set in contact as one adapted for positioning at respective locations of differing temperature between which it is desired to transfer heat, wherein the relative longitudinal displacement between the composite slabs is allowed, wherein each composite slab has at least one segment having good thermal conductor material and one segment having poor thermal conductor material alternately; 
   
   
       3 . A heat transfer device forming a compound layer, wherein the composition comprises: at least a pair of internally finned slideable parallel slabs having a good thermal conductor material adapted for positioning at respective locations of differing temperature between which it is desired to transfer heat, wherein the relative longitudinal and transversal displacements between the slabs are allowed, wherein the empty internal space is filled with a poor thermal conductor material allowing however the relative longitudinal displacement the slabs, wherein the remaining empty internal space is filled with a compressible fluid allowing the slabs displacement and the contact between the corresponding fin internal faces, wherein a poor thermal conductor material is set between the fin extremity of one slab and the internal face of the corresponding slab in order to avoid the direct contact between them; 
   
   
       4 . A heat transfer device forming a compound layer, wherein the composition comprises: at least a pair of internally finned parallel slabs having a good thermal conductor material adapted for positioning at respective locations of differing temperature between which it is desired to transfer heat, wherein the fins of one slab are confined by the corresponding fins of the related slab, wherein relative longitudinal thermal expansion and contraction for the slabs is allowed, wherein the empty internal space is filled with a poor thermal conductor material allowing however the relative longitudinal displacement the slabs, wherein the remaining empty internal space is filled with a compressible fluid with low thermal conductivity allowing the slabs displacement and the contact between the corresponding fin internal faces, wherein a poor thermal conductor material is set between the fin extremity of one slab and the internal face of the corresponding slab in order to avoid the direct contact between them; 
   
   
       5 . A heat transfer device in accordance with  claims 1 ,  2 ,  3  and  4 , wherein said good and poor thermal conductor material can be a liquid, a solid, a gas or a composite material; 
   
   
       6 . A heat transfer device in accordance with  claims 1 ,  2 ,  3  and  4 , wherein said the contact between the corresponding fin internal surfaces establishes a relative low thermal contact resistance.