US2009188359A1PendingUtilityA1

Block-Molded Semiconductor Device Singulation Methods and Systems

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Assignee: TEXAS INSTRUMENTS INCPriority: Feb 14, 2007Filed: Apr 3, 2009Published: Jul 30, 2009
Est. expiryFeb 14, 2027(~0.5 yrs left)· nominal 20-yr term from priority
Inventors:Mohamad Ashraf Bin Mohd ArshadYue Seng Fatt
H10P 72/7418H10P 72/7416H10P 72/7402H10P 72/0436H10P 72/0428H10P 72/74H10W 74/00H10W 74/014H10W 72/0198H10P 54/00Y10T83/222
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Claims

Abstract

The invention discloses methods and systems for singulation of block-molded arrays of semiconductor devices. Preferred embodiments include methods and associated systems for securing a block-molded array of semiconductor devices into a mounting ring with light-sensitive tape. Tape-deactivating is used to render exposed regions of the light-sensitive tape less tacky. The mounting ring containing the block-molded array is secured on a cutting table and the array is singulated into individual devices. Aspects of the invention also include the use of tape-deactivating light for making the light-sensitive tape less tacky to facilitate removal of the individual devices after singulation.

Claims

exact text as granted — not AI-modified
1 . A system for singulating block-molded arrays of semiconductor devices comprising:
 a mounting ring for receiving a block-molded array of semiconductor devices;   a block-molded array of semiconductor devices secured to the mounting ring by light-sensitive tape;   a tape-deactivating light source whereby exposed regions of the light-sensitive tape may be made less tacky by the action of the tape-deactivating light;   cutting apparatus having a cutting table for securing the mounting ring containing the block-molded array and having a cutting tool for cutting individual devices from the block-molded array.   
     
     
         2 . A system according to  claim 1  wherein the cutting tool further comprises a rotating saw blade. 
     
     
         3 . A system according to  claim 1  wherein the cutting table further comprises a vacuum table. 
     
     
         4 . A system according to  claim 1  wherein the light-sensitive tape further comprises UV tape. 
     
     
         5 . A system according to  claim 1  wherein the light-sensitive tape further comprises infra-red sensitive tape. 
     
     
         6 . A system according to  claim 1  wherein the light-sensitive tape further comprises visible-light sensitive tape. 
     
     
         7 . A system according to  claim 1  wherein the cutting tool further comprises a laser cutting tool.

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