Air ventilation system

Abstract

The present invention is directed at an air ventilation system for use with semiconductor manufacturing equipment. Specifically, the ventilation system of the present invention adjusts vents or outlets located on an enclosure used for semiconductor manufacturing between a restricted state and an open state. When the vents and/or outlets are in an open state, a high flow rate through the enclosure is able to properly scavenge toxic and volatile gasses to safely remove them. When the vents and/or outlets are in a restricted state, the flow rate of gases therethrough is substantially or fully restricted. Upon the sensing of a condition (or the lack thereof) or the manual operation of an operator, the vents and/or outlets are selectively adjusted between the restricted and open states.

1 . A semiconductor processing tool comprising:
 an enclosed space through which air flows;   an outlet in fluid communication with said enclosed space; and   an inlet in fluid communication with said enclosed space wherein at least one of said inlet or said outlet is operable between a restricted state and an open state based on the presence or absence of a condition.   
   
   
       2 . The semiconductor processing enclosure according to  claim 1 , further comprising an access panel configured to grant access to said enclosed space, wherein the presence of the condition occurs when said access panel is in an open position. 
   
   
       3 . The semiconductor processing enclosure according to  claim 2 , wherein said access panel is a door. 
   
   
       4 . The semiconductor processing enclosure according to  claim 3 , wherein said door further comprises a handle and a sensor that is operatively connected to said handle. 
   
   
       5 . The semiconductor processing enclosure according to  claim 4 , wherein said presence of the condition occurs when an operator contacts said handle. 
   
   
       6 . The semiconductor processing enclosure according to  claim 4 , wherein said door further comprises a rod connected to said inlet and movement of said door causes a grate in said inlet to change orientation from a restricted state to an open state. 
   
   
       7 . The semiconductor processing enclosure according to  claim 1 , wherein the condition is a sensed condition that comprises one selected from the group comprising: a change in temperature within said enclosure, a change in pressure within said enclosure, a change of gaseous composition within said enclosure, a change in humidity level within said enclosure, a change in particulate level within said enclosure, a fire within said enclosure, an explosion within said enclosure, an implosion within said enclosure, a change in amount of a particular gas within said enclosure, and a change in percentage of a particular gas within said enclosure. 
   
   
       8 . The semiconductor processing enclosure according to  claim 4 , wherein said sensor can be any one of a chamber presence sensor, a gas leak detection sensor, and emergency power sensor, or a thermal runaway sensor. 
   
   
       9 . The semiconductor processing tool according to  claim 1 , wherein said inlet, said outlet, or a combination thereof, is maintained in said restricted state prior to said presence of a condition. 
   
   
       10 . A semiconductor processing tool with a ventilation system comprising:
 an enclosed space defined by said semiconductor processing tool;   a door connected to said semiconductor processing tool;   a ventilation system in communication with said semiconductor processing tool operable between a restricted state and an open state; and   a sensor in communication with said ventilation system.   
   
   
       11 . The semiconductor processing tool according to  claim 10 , wherein said sensor is in communication with said enclosed space. 
   
   
       12 . The semiconductor processing tool according to  claim 10 , wherein said ventilation system further comprises an actuator. 
   
   
       13 . The semiconductor processing tool according to  claim 12 , wherein said actuator is connected to a movable panel, wherein said movable panel restricts air flow into said enclosed space when said ventilation system is in said restricted state and provides a less restricted air flow into said enclosed space than when said ventilation system is in said open state. 
   
   
       14 . The semiconductor processing tool according to  claim 10 , wherein said sensor senses said integrity of said enclosed space. 
   
   
       15 . A method of selectively moving air through an enclosure used for semiconductor processing comprising:
 enclosing an environment acceptable for semiconductor processing, wherein said enclosed environment further comprises a door and an inlet, wherein said inlet is operable between an open state and a restricted state;   detecting the presence of a condition; and   directing said inlet enter an open state based on the presence of the condition or a restricted state based upon the absence of the condition.   
   
   
       16 . The method according to  claim 15 , wherein the condition comprises one selected from the group comprising: a change in temperature within said enclosure, a change in pressure within said enclosure, a change of gaseous composition within said enclosure, a change in humidity level within said enclosure, a change in particulate level within said enclosure, a fire within said enclosure, an explosion within said enclosure, an implosion within said enclosure, a change in amount of a particular gas within said enclosure, and a change in percentage of a particular gas within said enclosure. 
   
   
       17 . A semiconductor processing tool comprising:
 an enclosed space defined by said semiconductor processing tool;   a movable panel attached to said semiconductor processing tool; and   a ventilation system in communication with said enclosed space and coupled to said movable panel, said ventilation system being operable between an open state and a restricted state.   
   
   
       18 . The semiconductor processing tool according to  claim 17 , wherein movement of said movable panel actuates said ventilation system. 
   
   
       19 . The semiconductor processing tool according to  claim 17 , wherein said moveable panel is a door that can be in an open or a closed position. 
   
   
       20 . The tool according to  claim 19 , wherein said ventilation system is in an open state when said door is in the open position and a restricted state when the door is in a closed position. 
   
   
       21 . A semiconductor processing tool comprising:
 an enclosed space of said semiconductor processing tool through which conditioned air is flowable;   at least one inlet operatively connected to said processing tool, wherein conditioned air external to said enclosed space enters said enclosed space through said at least one inlet;   at least one outlet operatively connected to said processing tool, wherein gases within said enclosure exit said enclosed space through said at least one outlet; and   a ventilating system operatively connected to said processing tool, wherein said ventilating system selectively adjusts said flow rate through one of said at least one inlet or said at least one outlet based on a change of at least one condition.   
   
   
       22 . The semiconductor processing tool according to  claim 21 , wherein the ventilating system maintains said at least one inlet, said at least one outlet, or a combination thereof in said restricted state prior to the change of at least one condition. 
   
   
       23 . The semiconductor processing tool according to  claim 21 , wherein said ventilating system is configured to selectively adjust said state of one selected from the group consisting of only at least one inlet, only at least one outlet, and a combination of at least one inlet and at least one outlet based on the change of at least one condition. 
   
   
       24 . The semiconductor processing tool of  claim 21 , wherein the condition is a sensed condition that comprises one selected from the group comprising a change in temperature within said enclosure, a change in pressure within said enclosure, a change of gaseous composition within said enclosure, a change in humidity level within said enclosure, a change in particulate level within said enclosure, a fire within said enclosure, an explosion within said enclosure, an implosion within said enclosure, a change in amount of a particular gas within said enclosure, and a change in percentage of a particular gas within said enclosure. 
   
   
       25 . The semiconductor processing tool of  claim 21 , wherein said condition comprises a manual adjustment by an operator.