Substrate processing apparatus and manufacturing method for semiconductor devices

Abstract

A substrate processing apparatus comprises a storage container for storing multiple substrates and whose substrate loading and unloading opening is shut by a lid, a loading and unloading port for carrying the storage container into and out of the case, a placement unit for placing the storage container in the loading and unloading port, a storage chamber provided adjacent to the loading and unloading port for storing the storage container, an opening and closing device for opening and closing the substrate loading and unloading opening of the storage container placed in the placement unit, a transfer device containing a holding mechanism for supporting the bottom of the storage container and transferring the storage container supported in the holding mechanism, over the opening and closing device between the inside and outside of the storage chamber, and an elevator mechanism for raising and lowering the placement unit between the placement unit height position where the opening and closing device opens and closes the storage container, and a height position where the transfer device gives and receives the storage container.

1 - 16 . (canceled) 
   
   
       17 . A method for transferring a storage container comprising the steps of:
 carrying a storage container for storing multiple substrates and whose substrate loading and unloading opening is shut by a lid, into a loading and unloading port from the outside of a case, and placing the storage container in a placement unit;   detaching and attaching the lid of the storage container placed in the placement unit by an opening and closing device to open and close the substrate loading and unloading opening;   raising the placement unit placing the storage container by an elevator mechanism;   carrying a holding mechanism by a transfer device, over the opening and closing device;   delivering the storage container to the holding mechanism from the placement unit by the elevator mechanism and the transfer device.   
   
   
       18 . The method for transferring a storage container according to  claim 17 , wherein the opening and closing step comprises a step of removing the lid from the storage container, and detecting a substrate layout state within the storage container with the substrate loading and unloading opening open by a substrate status sensing device. 
   
   
       19 . The method for transferring a storage container according to  claim 17 , wherein the holding mechanism supports the bottom of the storage container in the delivering step. 
   
   
       20 . The method for transferring a storage container according to  claim 17 , wherein a cover for covering a lower section of the placement unit is raised according to the operation of the elevator mechanism in the raising step. 
   
   
       21 . The method for transferring a storage container according to  claim 17 , wherein a cover for covering an outer surface of the case that is positioned at a lower section of the placement unit is raised along with the placement unit in the raising step. 
   
   
       22 . A method for manufacturing a semiconductor device comprising the steps of:
 carrying a storage container for storing multiple substrates and whose substrate loading and unloading opening is shut by a lid, into a loading and unloading port from the outside of a case, and placing the storage container in a placement unit;   detaching and attaching the lid of the storage container placed in the placement unit by an opening and closing device to open and close the substrate loading and unloading opening;   raising the placement unit placing the storage container by an elevator mechanism;   carrying a holding mechanism by a transfer device, over the opening and closing device;   delivering the storage container to the holding mechanism from the placement unit by the elevator mechanism and the transfer device;   picking up the substrate from the storage container, loading the substrate into a process chamber, and processing the substrate within the process chamber.   
   
   
       23 . The method for manufacturing a semiconductor device according to  claim 22 , wherein the opening and closing step comprises a step of removing the lid from the storage container, and detecting a substrate layout state within the storage container with the substrate loading and unloading opening open by a substrate status sensing device. 
   
   
       24 . The method for manufacturing a semiconductor device according to  claim 22 , wherein the holding mechanism supports the bottom of the storage container in the delivering step. 
   
   
       25 . The method for manufacturing a semiconductor device according to  claim 22 , wherein a cover for covering a lower section of the placement unit is raised according to the operation of the elevator mechanism in the raising step. 
   
   
       26 . The method for manufacturing a semiconductor device according to  claim 22 , wherein a cover for covering an outer surface of the case that is positioned at a lower section of the placement unit is raised along with the placement unit in the raising step.