Coating liquid for gate insulating film, gate insulating film and organic transistor
Abstract
To provide a coating fluid for a gate insulating film, which can be baked at a low temperature of at most 180° C.; a gate insulating film having excellent solvent resistance and further having good characteristics in e.g. specific resistance or semiconductor mobility; and an organic transistor employing the gate insulating film. A coating fluid for a gate insulating film, which comprises a polyimide obtainable by cyclodehydration of a polyamic acid having repeating units of a specific structure, a gate insulating film employing the coating fluid, and the organic transistor employing the gate insulating film.
Claims
exact text as granted — not AI-modified1 . A coating fluid for a gate insulating film, which comprises a polyimide obtainable by cyclodehydration of a polyamic acid having repeating units represented by the following formula (1):
wherein A is a tetravalent organic group, B 1 is at least one bivalent organic group selected from the following formulae (2) to (9), and B 2 is a bivalent organic group other than the following formulae (2) to (9):
(wherein each R 5 independently is hydrogen, a methyl group or a trifluoromethyl group),
each of b1 and b2 represents a compositional ratio, and b1 and b2 have a relationship of 0.5≦(b1/(b1+b2))≦1 in ratio (mol).
2 . A gate insulating film made of a polyimide film, wherein the polyimide film is a film obtained by applying and baking a solution containing an organic solvent-soluble polyimide, and further the organic solvent-soluble polyimide is a polyimide obtained by cyclodehydration of a polyamic acid having repeating units represented by the following formula (1), and the baking temperature for the polyimide film is at most 180° C.,
wherein A is a tetravalent organic group, B 1 is at least one bivalent organic group selected from the following formulae (2) to (9), and B 2 is a bivalent organic group other than the following formulae (2) to (9):
(wherein each R 5 independently is a hydrogen, a methyl group or a trifluoromethyl group),
each of b1 and b2 represents a compositional ratio, and b1 and b2 have a relationship of 0.5≦(b1/(b1+b2))≦1 in ratio (mol).
3 . The gate insulating film according to claim 2 , wherein in the formula (1), A is a tetravalent organic group having an alicyclic structure.
4 . The gate insulating film according to claim 3 , wherein the tetravalent organic group having an alicyclic structure is at least one member selected from the group consisting of the following formulae (10) to (14):
(in the formula (10), each of R 1 , R 2 , R 3 and R 4 which are independent of one another, is hydrogen, fluorine or a C 1-4 organic group.)
5 . The gate insulating film according to any one of claims 2 to 4 , wherein in the formula (1), B 1 represents the above formula (2), (4), (6) or (8).
6 . The gate insulating film according to any one of claims 2 to 5, wherein in the formula (1), R 5 in B 1 represents a methyl group or a trifluoromethyl group.
7 . The gate insulating film according to any one of claims 2 to 6 , wherein the baking temperature for the polyimide film is at most 150° C.
8 . The gate insulating film according to any one of claims 2 to 7 , wherein the organic solvent-soluble polyimide has an imidated ratio of at least 50%.
9 . The gate insulating film according to any one of claims 2 to 8 , wherein the solvent in the solution containing an organic solvent-soluble polyimide has a boiling point of at most 200° C.
10 . An organic transistor employing the gate insulating film as defined in any one of claims 2 to 9 .Join the waitlist — get patent alerts
Track US2009184347A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.