Cooling device

Abstract

Provided is a cooling apparatus, which has its cooling ability improved by liberating the thermal energy of a coolant from expansion means to the outside. The cooling apparatus includes a compressor, a condenser, an evaporator, a capillary tube and a blower fan. Moreover, a portion of the capillary tube corresponding to that expansion means is arranged to abut against the casing of the blower fan. Here, the portion of the capillary tube is arranged so helically or spirally as to abut against the upper face of the casing of the blower fan. Thus, the heat can be dissipated from the capillary tube to the casing of the blower fan.

1 . A cooling device to be used in an electronic device comprising:
 compressing means for compressing a refrigerant;   condensing means for radiating heat from the refrigerant compressed by the compressing means to outside and to liquefy the refrigerant;   expanding means for expanding the refrigerant liquefied by the condensing means; and   evaporating means for evaporating the refrigerant which is expanded by the expanding means and receives heat from an exothermic body, wherein   thermal energy contained in the refrigerant is radiated from an entire region of the expanding means to any of ambient air around the electronic device and air inside the electronic device.   
   
   
       2 . The cooling device to be used in an electronic device according to  claim 1 , wherein
 the expanding means is a capillary tube.   
   
   
       3 . The cooling device to be used in an electronic device according to  claim 1 , wherein
 temperature of the refrigerant to be introduced from the expanding means to the evaporating means is higher than that of outside atmosphere surrounding the expanding means.   
   
   
       4 . The cooling device to be used in an electronic device according to  claim 1 , wherein
 temperature of the refrigerant incorporated in an entire section of the expanding means is higher than that of outside atmosphere surrounding the expanding means.   
   
   
       5 . The cooling device to be used in an electronic device according to  claim 1 , wherein
 the expanding means is allowed to contact any of air blowing means and a casing of an electronic device to radiate thermal energy from the expanding means to any of the ambient air around the electronic device and the air inside the electronic device by thermal diffusion.   
   
   
       6 . The cooling device to be used in an electronic device according to  claim 1 , wherein
 at least one portion of the expanding means is disposed in a region where wind generated by air blowing means passes through to radiate thermal energy from the expanding means to any of the ambient air around the electronic device and the air inside the electronic device by forced convection.   
   
   
       7 . The cooling device to be used in an electronic device according to  claim 6 , wherein
 the air blowing means blows air to the condensing means and/or the compressing means.