Method of constructing a membrane probe using a depression

Abstract

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

1 . A method of constructing a membrane probe comprising:
 (a) providing a substrate;   (b) creating a depression within said substrate;   (c) locating conductive material within said depression;   (d) connecting a flexible conductive trace to said conductive material, said trace comprising a first length portion having a first width and a second length portion having a second width, said first width varying from said second width; and   (e) removing said substrate from said conductive material.   
   
   
       2 . The method of constructing a membrane probe of  claim 1  wherein said first length portion of said conductive trace is proximate said connection of said trace to said conductive material and said second length portion is more remote from said connection to said conductive material than said first length portion and said first thickness is less than said second thickness. 
   
   
       3 . The method of constructing a membrane probe of  claim 1  wherein said first length portion of said conductive trace is proximate said connection of said trace to said conductive material and said second length portion is more remote from said connection to said conductive material than said first length portion and said first width is less than said second width.