US2009173931A1PendingUtilityA1

Methods of Making, Positioning and Orienting Nanostructures, Nanostructure Arrays and Nanostructure Devices

Assignee: NANOSYS INCPriority: Apr 2, 2002Filed: Feb 12, 2009Published: Jul 9, 2009
Est. expiryApr 2, 2022(expired)· nominal 20-yr term from priority
Inventors:David Stumbo
H10K 85/221B81C 99/008H10D 30/6755Y10S977/857B82Y 40/00Y10S977/858Y10S977/89B82Y 10/00B81C 3/005B01J 23/52B82Y 30/00G11C 2213/81B81B 2203/0361B81B 2207/015Y10S977/762B82B 3/00Y10S977/856G11B 5/743B81C 2203/057Y10S438/962H10K 10/701
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Claims

Abstract

Nanostructure manufacturing methods and methods for assembling nanostructures into functional elements such as junctions, arrays and devices are provided. Systems for practicing the methods are also provided. In one embodiment, a substrate is disclosed which comprises a first substrate region and a nanowire element attached to the first substrate region at a first position, the nanowire element comprising a first semiconductive region and a second region disposed between the first semiconductive region and the first position, wherein the second region comprises a material that is etchable under conditions that do not substantially etch the first semiconductive region.

Claims

exact text as granted — not AI-modified
1 . A nanowire that has been etched from a substrate, the nanowire comprising a first semiconductive region and a second region comprising a material that is etchable under conditions that do not substantially etch the first semiconductive region, wherein the second region comprises a substantially faceted etched end of the nanowire. 
     
     
         2 . The nanowire of  claim 1 , wherein the first semiconductive region and the second region of the nanowire are differently doped. 
     
     
         3 . The nanowire of  claim 2 , wherein the first semiconductive region and the second region of the nanowire comprise the same semiconductive material. 
     
     
         4 . The nanowire of  claim 3 , wherein the first semiconductive region and the second region of the nanowire comprise silicon. 
     
     
         5 . The nanowire of  claim 1 , wherein the first semiconductive region comprises germanium and the second region of the nanowire comprises silicon. 
     
     
         6 . The nanowire of  claim 1 , wherein the first semiconductive region comprises one or more P-N junctions. 
     
     
         7 . A flexible substrate comprising the nanowire of  claim 1  deposited thereon. 
     
     
         8 . A population of free-standing inorganic nanowires dispersed in solution, each of the nanowires in said population having substantially the same length. 
     
     
         9 . The population of nanowires of  claim 8 , wherein each of the nanowires in the population have an etched end. 
     
     
         10 . The population of nanowires of  claim 9 , wherein the nanowires in the population each include at least one P-N junction along a length of the nanowires. 
     
     
         11 . The population of nanowires of  claim 9 , wherein each of the nanowires in the population have a substantially faceted etched end.

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