Integrated Circuit Package Contact Cleaning

Abstract

The invention provides methods and apparatus for automated contamination removal in association with integrated circuit manufacturing and testing. Disclosed embodiments include methods for cleaning electrical contacts of integrated circuit packages with steps for transporting the package from a first position to a second position and, during the transit, bringing the electrical contacts into engagement with one or more cleaning station. Aspects of the disclosed apparatus include a package transit chute for moving packages from a first position to a second position and one or more cleaning stations between the first and second positions. The cleaning stations further include one or more cleaning mats positioned for cleaning electrical contacts of packages transported in the chute.

1 . A method for cleaning electrical contacts of an integrated circuit package, comprising the steps of:
 transporting the package from a first position to a second position; and   while the package is in transit, bringing the electrical contacts into physical contact with one or more cleaning station.   
   
   
       2 . The method of  claim 1  wherein the step of transporting the package further comprises causing the package to move using primarily the force of gravity. 
   
   
       3 . The method of  claim 1  wherein the step of transporting the package further comprises causing the package to move using primarily the force of compressed air. 
   
   
       4 . The method of  claim 1  wherein the step of transporting the package from a first position further comprises receiving the package from the output of package manufacturing equipment. 
   
   
       5 . The method of  claim 1  wherein the step of transporting the package to a second position further comprises inputting the package to testing equipment. 
   
   
       6 . A system for cleaning integrated circuit package electrical contacts comprising:
 a package transit chute for moving packages from a first position to a second position; and   at least one cleaning station located in the package transit chute between the first and second positions, the cleaning station further comprising one or more cleaning mats positioned for engaging electrical contacts of packages transported in the chute, whereby engagement between the electrical contacts and the one or more cleaning mats acts to clean contaminants from the electrical contacts.   
   
   
       7 . The system of  claim 6  wherein the package transit chute is configured for the transportation of DIP packages. 
   
   
       8 . The system of  claim 6  wherein the package transit chute is configured for the transportation of QFN packages. 
   
   
       9 . The system of  claim 6  wherein the package transit chute is configured for the transportation of QFP packages. 
   
   
       10 . The system of  claim 6  wherein the one or more cleaning mats further comprise pliable material having embedded abrasive particles. 
   
   
       11 . The system of  claim 6  wherein the one or more cleaning mats further comprise an adhesive layer on one side of a polyethylene terephthalate film and polyurethane foam on the opposing side of the polyethylene terephthalate film, wherein abrasive particles are secured to the polyurethane foam with suitable resin. 
   
   
       12 . The system of  claim 6  wherein the one or more cleaning mats further comprise pliable material having embedded alumina particles. 
   
   
       13 . A system for cleaning integrated circuit package electrical contacts comprising:
 an idle stage for receiving packages in transit from a first position to a second position; and   at least one cleaning station located in the idle stage, the cleaning station further comprising one or more cleaning mats positioned for engaging electrical contacts of packages placed in the idle stage, whereby engagement between the electrical contacts and the one or more cleaning mats acts to clean contaminants from the electrical contacts.   
   
   
       14 . The system of  claim 13  wherein the idle stage is configured for receiving one or more DIP packages. 
   
   
       15 . The system of  claim 13  wherein the idle stage is configured for receiving one or more QFN packages. 
   
   
       16 . The system of  claim 13  wherein the idle stage is configured for receiving one or more QFP packages. 
   
   
       17 . The system of  claim 13  wherein the one or more cleaning mats further comprise pliable material having embedded abrasive particles. 
   
   
       18 . The system of  claim 13  wherein the one or more cleaning mats further comprise an adhesive layer on one side of a polyethylene terephthalate film and polyurethane foam on the opposing side of the polyethylene terephthalate film, wherein abrasive particles are secured to the polyurethane foam with a suitable resin. 
   
   
       19 . The system of  claim 13  wherein the one or more cleaning mats further comprise pliable material having embedded alumina particles.