Electrical bonding pad

Abstract

An electrical bonding pad for an integrated circuit, comprising an encapsulation layer for receiving electrical signals and for covering a portion of a stack of conductive layers. The pad further comprises a conductive area in the stack, with the conductive area being at least partially covered by the encapsulation layer. The conductive area is intended for the passage of electrical signals received by the encapsulation layer and traveling towards a circuit core, and is electrically insulated from the encapsulation layer in a manner that at least partially decouples the electrical signals received from the encapsulation layer.

1 . A bonding pad for an integrated electronic circuit, comprising:
 an encapsulation layer for receiving electrical signals; and   a stack of conductive layers including a first conductive area at least partially covered by the encapsulation layer,   wherein said first conductive area is configured to pass to a circuit core electrical signals received by the encapsulation layer, and is electrically insulated from the encapsulation layer so as to at least partially decouple the electrical signals received from the encapsulation layer,   wherein at least one of the conductive layers of the stack comprises:
 the first conductive area; 
 a second conductive area at least partially covered by the encapsulation layer, and 
 a first insulating area insulating the first and second conductive areas from each other, the first insulating area being at least partially covered by the encapsulation layer. 
   
     
     
         2 . The bonding pad according to  claim 1  wherein inside a portion of the stack covered by the encapsulation layer the layers of the stack include a conductive layer, farthest from the encapsulation layer and into which a conductive area at least partially extends, further comprises an insulating area. 
     
     
         3 . The bonding pad according to  claim 1  wherein one of the conductive areas surrounds the other. 
     
     
         4 . The bonding pad according to  claim 1  wherein the stack includes a second insulating area underlying the first conductive area and a third conductive area underlying the second insulated area, the second insulating area insulating the first and third conductive areas from each other and being at least partially covered by the encapsulation layer. 
     
     
         5 . The bonding pad according to  claim 4  wherein the stack includes:
 a fourth conductive area underlying the second conductive area;   a third insulating area that insulates the third conductive area from the fourth conductive area; and   a fifth conductive area positioned between and electrically connecting the second and fourth conductive areas.   
     
     
         6 . The bonding pad according to  claim 1 , further comprising a conductive contact layer positioned on the stack and electrically connecting the second conductive area to the encapsulation layer. 
     
     
         7 . The bonding pad according to  claim 1  wherein the stack includes:
 an electrical connector underlying and contacting the first conductive area; and   an elongated third conductive area connected to the first conductive area by the electrical connector, the third conductive area underlying the first and second conductive areas and being configured to be coupled to the circuit core.   
     
     
         8 . The bonding pad according to  claim 1  wherein the stack includes:
 a spiral conductive area electrically connected to the first conductive area and at least partially underlying the encapsulation layer.   
     
     
         9 . The bonding pad according to  claim 1  wherein the stack includes:
 a balun having first and second elongated conductive areas positioned in the same one of the conductive layers and spaced apart from each other, the first elongated conductive area including an input connector connected to the first conductive area and a first output area configured to be coupled to the core circuit, and the second elongated conductive area including a virtual ground portion and a second output area configured to be coupled to the core circuit.   
     
     
         10 . The bonding pad according to  claim 1  wherein the stack includes:
 a second conductive area electrically coupled to the encapsulation layer; and   an insulating area underlying the second conductive area and overlying the first conductive area, the insulating area insulating the second conductive area from the first conductive area.   
     
     
         11 . An integrated electronic circuit, comprising:
 a circuit core; and   a bonding pad that includes:   an encapsulation layer for receiving electrical signals; and   a stack of conductive layers including a first conductive area at least partially covered by the encapsulation layer, wherein said first conductive area is configured to pass to the circuit core the electrical signals received by the encapsulation layer, and is electrically insulated from the encapsulation layer so as to at least partially decouple the electrical signals received from the encapsulation layer, wherein at least one of the conductive layers of the stack comprises:   the first conductive area;   a second conductive area at least partially covered by the encapsulation layer, and   a first insulating area insulating the first and second conductive areas from each other, the first insulating area being at least partially covered by the encapsulation layer.   
     
     
         12 . The integrated circuit according to  claim 11  wherein inside a portion of the stack covered by the encapsulation layer the layers of the stack include a conductive layer, farthest from the encapsulation layer and into which a conductive area at least partially extends, further comprises an insulating area. 
     
     
         13 . The integrated circuit according to  claim 11  wherein one of the conductive areas surrounds the other. 
     
     
         14 . The integrated circuit according to  claim 11  wherein the stack includes a second insulating area underlying the first conductive area and a third conductive area underlying the second insulated area, the second insulating area insulating the first and third conductive areas from each other and being at least partially covered by the encapsulation layer. 
     
     
         15 . The integrated circuit according to  claim 14  wherein the stack includes:
 a fourth conductive area underlying the second conductive area;   a third insulating area that insulates the third conductive area from the fourth conductive area; and   a fifth conductive area positioned between and electrically connecting the second and fourth conductive areas.   
     
     
         16 . The integrated circuit according to  claim 11 , wherein the bonding pad includes a conductive contact layer positioned on the stack and electrically connecting the second conductive area to the encapsulation layer. 
     
     
         17 . The integrated circuit according to  claim 11  wherein the stack includes:
 an electrical connector underlying and contacting the first conductive area; and   an elongated third conductive area connected to the first conductive area by the electrical connector, the third conductive area underlying the first and second conductive areas and being configured to be coupled to the circuit core.   
     
     
         18 . A method for manufacturing a bonding pad for an integrated electronic circuit, comprising
 creating a conductive area in a stack of conductive layers,   creating an encapsulation layer at least partially covering the conductive area, the encapsulation layer being separated from the conducting area by an insulating area so as to at least partially ensure a decoupling of electrical signals received by the encapsulation layer and traveling through the conductive area for delivery to a circuit core, wherein at least one of the conductive layers of the stack comprises:   the first conductive area;   a second conductive area at least partially covered by the encapsulation layer, and   a first insulating area insulating the first and second conductive areas from each other, the first insulating area being at least partially covered by the encapsulation layer.   
     
     
         19 . An integrated electronic circuit, comprising
 a circuit core; and   an electrical bonding pad that includes:   an encapsulation layer for receiving electrical signals;   a stack of conductive layers that includes a conductive area, said conductive area being at least partially covered by the encapsulation layer, wherein said conductive area comprises an area input, an area output for the passage of electrical signals received by the encapsulation layer and traveling to the circuit core, wherein said conductive area includes a balun and is elongated between the area input and the area output so as to ensure frequency filtering of the electrical signals traveling through said conductive area.   
     
     
         20 . The integrated circuit according to  claim 20 , wherein the elongated conductive area extends so as to form a spiral of more than a quarter turn. 
     
     
         21 . A method for manufacturing a bonding pad for an integrated electronic circuit, comprising:
 creating a conductive area in a stack of conductive layers, said conductive area comprising an area input and an area output for the passage of signals received by the pad and traveling to a circuit core, said conductive area including a balun and being elongated between said area input and said area output so as to ensure frequency filtering of the electrical signals traveling through said conductive area; and   creating an encapsulation layer for receiving and sending electrical signals to the conductive area, said encapsulation layer at least partially covering the conductive area.