Heat dissipation device with a heat pipe

Abstract

A heat dissipation device includes a base for contacting with a heat-generating electronic component, a fin assembly, a heat pipe connecting with the base and the fin assembly, and a holder connecting with the base and the fin assembly and supporting the heat pipe. The fin assembly includes a plurality of fins far away from the base. The heat pipe includes an evaporation portion thermally engaging with the base, a condensation portion connecting with the fin assembly and a connecting portion connecting with the evaporation portion and the condensation portion. The holder has a profile similar to the connecting portion of the heat pipe.

1 . A heat dissipation device comprising:
 a base having a first surface adapted for contacting with a heat-generating electronic component and a second surface opposite to the first surface;   a fin assembly comprising a plurality of fins far away from the base;   a heat pipe comprising an evaporation portion thermally engaging with the second surface of the base, and a condensation portion connecting with the fin assembly and an elongate connecting portion connecting with the evaporation and the condensation portion; and   a holder connecting with the base and the fin assembly, the holder having a profile similar to the connecting portion of the heat pipe, the connecting portion of the heat pipe being mounted on the holder.   
   
   
       2 . The heat dissipation device as described in  claim 1 , wherein the connecting portion of the heat pipe is soldered on the holder. 
   
   
       3 . The heat dissipation device as described in  claim 1 , wherein the holder comprises a bottom plate and two flanges extending from opposite sides of the bottom plate. 
   
   
       4 . The heat dissipation device as described in  claim 3 , wherein each of the flanges has a height similar to a thickness of the heat pipe. 
   
   
       5 . The heat dissipation device as described in  claim 1 , wherein the holder forms a mounting plate from a free end thereof, a screw extending through the mounting plate and engaging with the fin assembly. 
   
   
       6 . The heat dissipation device as described in  claim 5 , wherein the fin assembly defines two slots, the holder comprising two inserting tabs having two tongues inserting into the slots of the fin assembly. 
   
   
       7 . The heat dissipation device as described in  claim 5 , wherein the base defines a groove at the second surface, the holder having an engaging portion at the other free end received in the groove of the base. 
   
   
       8 . The heat dissipation device as described in  claim 1 , wherein the holder is made of metallic material. 
   
   
       9 . The heat dissipation device as described in  claim 1 , wherein the connecting portion of the heat pipe has a serpentine configuration, the holder having a serpentine configuration corresponding to that of the connecting portion of the heat pipe. 
   
   
       10 . A heat dissipation device comprising:
 a base having a flat surface adapted for contacting with a heat-generating electronic component;   a fin assembly comprising a plurality of fins far away from the base;   a heat pipe comprising an evaporation portion thermally engaging with the base, and a condensation portion connecting with the fin assembly and a connecting portion connecting with the evaporation and the condensation portion; and   a holder firmly connecting with the base and the fin assembly, the holder comprising a bottom plate and two flanges extending from opposite sides of the bottom plate, the connecting portion of the heat pipe being soldered on bottom plate and sandwiched between the bottom plate.   
   
   
       11 . The heat dissipation device as described in  claim 10 , wherein the profile of the bottom plate is substantially the same as that of the connecting portion of the heat pipe in whole. 
   
   
       12 . The heat dissipation device as described in  claim 11 , wherein the heat pipe is elongate and serpentine, the holder being elongate and serpentine corresponding to the heat pipe. 
   
   
       13 . A heat dissipation device adapted for dissipating heat from an electronic component, comprising:
 a heat spreader having a flat bottom surface adapted for contacting with the electronic component;   a plurality of fins remote from the heat spreader;   at least a heat pipe having a first end embedded in the heat spreader at a top surface of the heat spreader, a second end extending through the fins, and a connecting portion interconnecting the first and second ends and located between the first and second ends; and   a strengthening retainer having a first portion embedded in an end of the heat spreader, and a second portion bulked with the fins;   wherein the connecting portion of the at least one heat pipe is received in the strengthening retainer to prevent a deformation of the at least one heat pipe.   
   
   
       14 . The heat dissipation device as described in  claim 13 , wherein the strengthening retainer comprises a bottom plate and a pair of lateral walls extending from two opposite edges of the bottom plate. 
   
   
       15 . The heat dissipation device as described in  claim 14 , wherein the at least one heat pipe contacts with the lateral walls of the strengthening retainer. 
   
   
       16 . The heat dissipation device as described in  claim 14 , wherein the strengthening retainer further comprises an engaging tab parallel to the fins, the engaging tab abutting against an outmost fin to permit a screw to extend through and engage with the outmost fin. 
   
   
       17 . The heat dissipation device as described in  claim 16 , wherein a pair of inserting tabs are formed at two flanks of the engaging tab to buckle with the outmost fin.