Heat dissipation device

Abstract

A heat dissipation device ( 100 ) includes a base ( 300 ), a heat sink ( 200 ) and a heat pipe ( 400 ). The base ( 300 ) includes a bottom surface ( 320 ) for thermally contacting with a heat-generating component, a top surface ( 340 ) and two sloped side surfaces ( 360 ) spanning between the top surface ( 340 ) and the bottom surface ( 320 ). The heat sink ( 200 ) includes a plurality of fins perpendicularly attached on the sloped side surfaces ( 360 ) of the base ( 300 ) with a channel defined between the top surface ( 340 ) of the base ( 300 ) and the heat sink ( 200 ). The heat pipe ( 400 ) includes an evaporator ( 420 ) received in the channel defined by the top surface ( 340 ) of the base ( 300 ) and the heat sink ( 200 ) and a condenser ( 440 ) being inserted into the heat sink ( 200 ) above the evaporator ( 420 ).

1 . A heat dissipation device comprising:
 a base comprising a bottom surface for thermally contacting with a heat-generating component, a top surface and two sloped side surfaces spanning between the top surface and the bottom surface;   a heat sink comprising a plurality of fins attached on the sloped side surfaces of the base with a channel defined between the top surface of the base and the heat sink; and   a heat pipe comprising an evaporator received in the channel defined by the top surface of the base and the heat sink and a condenser being inserted into the heat sink above the evaporator.   
   
   
       2 . The heat dissipation device as described in  claim 1 , wherein the top surface of the base is flat. 
   
   
       3 . The heat dissipation device as described in  claim 1 , wherein the top surface of the base has a size smaller than that of the bottom surface of the base. 
   
   
       4 . The heat dissipation device as described in  claim 1 , wherein a depression is defined in a bottom portion of the heat sink, and a recess is defined in the bottom portion of the heat sink within the depression, wherein the base is embedded in the depression with the top surface of the base covering the recess to form the channel. 
   
   
       5 . The heat dissipation device as described in  claim 4 , wherein the recess is defined by a top wall facing the top surface of the base and two sidewalls extending downwardly from opposite sides of the top wall to the top surface of the base. 
   
   
       6 . The heat dissipation device as described in  claim 5 , wherein the top wall is flat, and the top surface of the base is flat. 
   
   
       7 . The heat dissipation device as described in  claim 6 , wherein the evaporator of the heat pipe is flat and sandwiched between the top wall and the top surface of the base. 
   
   
       8 . The heat dissipation device as described in  claim 5 , wherein the depression is defined by two sloped lateral walls at opposite sides of the recess, and the lateral walls each slant downwardly-outwardly from a bottom edge of one of the sidewalls and terminate in a bottom side of the heat sink. 
   
   
       9 . The heat dissipation device as described in  claim 1 , wherein the heat sink has a W-shaped top portion. 
   
   
       10 . The heat dissipation device as described in  claim 9 , wherein the top portion of the heat sink comprises two platforms, a crest, and two troughs, wherein the platforms are formed at opposite sides of the top portion of the heat sink, the troughs are defined between the two platforms with the crest located between the troughs. 
   
   
       11 . The heat dissipation device as described in  claim 10 , further comprising a fan supported on the platforms, and two plenum chambers are defined beneath the fan by the troughs, respectively. 
   
   
       12 . The heat dissipation device as described in  claim 11 , wherein the heat sink comprises an arm portion extending upwardly from an outer edge of each of the platforms. 
   
   
       13 . The heat dissipation device as described in  claim 12 , wherein the arm portions clamp at opposite lateral sides of the fan. 
   
   
       14 . A heat dissipation device comprising:
 a base;   a heat sink comprising two platforms formed at opposite sides of a top portion of the heat sink and two troughs symmetrically defined in the top portion of the heat sink between the platforms, the heat sink further comprising two sloped lateral walls symmetrically defined in a bottom portion of the heat sink, wherein the lateral walls are inclined toward each other from their bottom ends, and the heat sink is mounted on the base with the lateral walls attached to the base; and   a fan supported on the platforms with two plenum chambers defined beneath the fan by the troughs, respectively.   
   
   
       15 . The heat dissipation device as described in  claim 14 , wherein the heat sink further comprises an arm portion extending upwardly from an outer edge of each of the platforms, and the arm portions are located at opposite lateral sides of the fan. 
   
   
       16 . The heat dissipation device as described in  claim 14 , wherein the heat sink further comprises a recess defined in the bottom portion with the sloped lateral walls located at opposite sides of the recess, the recess extends upwardly towards the top portion of the heat sink, wherein the base is embedded in a depression defined by the lateral walls and the base and the recess together define a channel. 
   
   
       17 . The heat dissipation device as described in  claim 16 , further comprising two heat pipes each having an evaporator received in the channel and a condenser inserted into the top portion of the heat sink. 
   
   
       18 . The heat dissipation device as described in  claim 17 , wherein the base has a trapeziform cross section with two sloped side surfaces attached to the lateral walls. 
   
   
       19 . A heat dissipation device comprising:
 a base adapted for attaching to a heat-generating component;   a heat sink including a bottom portion and a top portion, the base thermally attached to the bottom portion, the top portion having a W-shaped configuration and including two platforms at opposite sides thereof, a crest at a middle thereof and two troughs each between the crest and a corresponding platform;   a fan supported on the platforms of the top portion, two plenum chambers defined under the fan by the troughs, respectively; and   at least a heat pipe thermally connecting the base with the top portion of the heat sink.   
   
   
       20 . The heat dissipation device as described in  claim 19 , wherein the base has a trapeziform cross section with two sloped side surfaces attached to the bottom portion of the heat sink for guiding an airflow generated by the fan.