Heat dissipation device

Abstract

A heat dissipation device includes a base, a fin group located at a top of the base, a heat pipe connecting with the base and the fin group, a fan located at a top of the fin group, and a fan holder. The fan holder includes a securing portion mounted between the base and the fin group, a mounting portion extending from the securing portion. The mounting portion of the fan holder is located at a top of and spaced from the fin group and the fan is mounted on the mounting portion.

1 . A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board, comprising:
 a base thermally contacting with the electronic component;   a fin group located at a top of the base;   a heat pipe connecting with the base and the fin group;   a fan located at a top of the fin group; and   a fan holder comprising a securing portion mounted between the base and the fin group, a mounting portion extending from the securing portion;   wherein the mounting portion of the fan holder is located at a top of and spaced from the fin group and the fan is mounted on the mounting portion.   
   
   
       2 . The heat dissipation device as claimed in  claim 1 , wherein the fan holder comprises a pair of supporting portions extending slantwise and outwardly from two sides of the securing portion and connecting with the mounting portion and the supporting portion is located at an outside of the fin group. 
   
   
       3 . The heat dissipation device as claimed in  claim 2 , wherein the supporting portion defines a cutout thereof. 
   
   
       4 . The heat dissipation device as claimed in  claim 1 , wherein the mounting portion comprises two connecting plates and two mounting legs extending from the connecting plates, two through holes defined at free ends of the mounting legs to mount the fan thereon. 
   
   
       5 . The heat dissipation device as claimed in  claim 1 , wherein the heat pipe comprises a condensing portion received in the base and an evaporating portion extending trough the fin group and supporting the fin group. 
   
   
       6 . The heat dissipation device as claimed in  claim 1 , wherein the fin group is spaced from the base. 
   
   
       7 . The heat dissipation device as claimed in  claim 1 , further comprising a clip spanning across the base. 
   
   
       8 . The heat dissipation device as claimed in  claim 7 , wherein the securing portion defines an elongated cutout therein and the base defines two grooves therein corresponding to the cutout of the securing portion, and a bottom portion of the clip extends through the cutout of the securing portion and is received in the grooves of the base. 
   
   
       9 . The heat dissipation device as claimed in  claim 7 , wherein the fin group comprises a plurality of fins and the fins are parallel to each other and spaced from each other with predetermined distance. 
   
   
       10 . The heat dissipation device as claimed in  claim 7 , wherein the fin group has an arc-shaped top surface and an arc-shaped bottom surface, the clip is located at a bottom of the arc-shaped bottom surface. 
   
   
       11 . A heat dissipation device, comprising:
 a heat sink having a base adapted for contacting with a heat-generating electronic component and a plurality of fins mounted above the base and spaced from the base, the fins having a concaved top surface;   a fan holder having a securing portion sandwiched between the base and the fins, and a pair of supporting portions extending upwardly and slantwise from two opposite sides of the securing portion and surrounding the fins therebetween, and a pair of legs formed ends of the supporting portions and located above and spaced from the top surface of the fins; and   a fan mounted on the legs of the fan holder.   
   
   
       12 . The heat dissipation device as claimed in  claim 11 , wherein a cutout is defined in each of supporting portions of the fan holder for providing passage of airflow generated by the fan. 
   
   
       13 . The heat dissipation device as claimed in  claim 12 , wherein a bottom portion of the fins is arced upwardly to define a space between the securing portion of the fan holder and the bottom portion of the fins. 
   
   
       14 . The heat dissipation device as claimed in  claim 13 , wherein a clip spans across the space and extends through the securing portion to be engaged in the base. 
   
   
       15 . The heat dissipation device as claimed in  claim 1 , wherein a heat pipe thermally connects the base and the fins.