Heat sink

Abstract

A heat sink for dissipation heat for an electronic components ( 50 ) having a dual-in-line package comprises at least two fin units ( 20, 30, 40 ). Each of the fin units comprises a base ( 21, 31, 41 ) and a plurality of heat dissipation fins ( 23, 33, 43 ) extending upwardly from the base. At least one fixing hole ( 2314, 3314 ) is formed in one of the fin units. At least one fixing poles ( 3313, 4313 ) is formed in another neighboring fin unit. The two neighboring fin units are assembled together with the at least one fixing pole inserted in the at least one fixing hole. A receiving space is defined between the two neighboring fin units for receiving the electronic component therein.

1 . A heat sink for dissipation heat for at least an electronic component having a dual-in-line package, comprising at least two fin units, each of the fin units comprising a base and a plurality of heat dissipation fins extending from the base, at least one fixing hole defined in one of the at least two fin units, at least one fixing pole formed on another one of the at least two fin units, the at least one fixing hole and the at least one fixing pole facing towards and corresponding to each other, the at least two fin units being assembled together with the at least one fixing pole inserted into the at least one fixing pole, a receiving space defined between two neighboring fin units of the at least two fin units adapted for fittingly receiving one of the at least one electronic component therein. 
   
   
       2 . The heat sink as described in  claim 1 , wherein at least one sidewall is formed on a lateral side of each of the at least two fin units, the at least one sidewall of one of the two neighboring fin units abutting against the at least one sidewall of the other one of the two neighboring fin units, the receiving space defined between the sidewalls of the two neighboring fin units. 
   
   
       3 . The heat sink as described in  claim 1 , wherein the receiving space is connected to a bottom surface of the base of each of the two neighboring fin units. 
   
   
       4 . The heat sink as described in  claim 1 , wherein the heat sink further comprises a fixing frame, the fixing frame comprising a connecting wall and two connecting pins extending from the connecting wall, a groove defined in a bottom surface of the heat sink for receiving the connecting wall of the fixing frame therein. 
   
   
       5 . The heat sink as described in  claim 4 , wherein two clamping tabs are respectively formed on two opposite sides of the groove, the two clamping tabs extending horizontally from the two opposite sides of the groove toward a central portion of the groove. 
   
   
       6 . A heat sink for dissipating heat from at least one dual-in-line package electronic component comprising:
 a first fin unit comprising a sidewall and a plurality of heat dissipation fins thermally connected with the sidewall;   a second fin unit comprising a sidewall facing towards the sidewall of the first fin unit and a plurality of heat dissipation fins thermally connected with the sidewall of the second fin unit, the sidewall of the second fin unit abutting against the sidewall of the first fin unit; and   a receiving space defined between the sidewall of the first fin unit and the sidewall of the second fin unit adapted for receiving a dual-in-line package electronic component therein.   
   
   
       7 . The heat sink as described in  claim 6 , wherein a receiving recess is defined in the sidewall of the first fin unit and a receiving recess is defined in the sidewall of the second fin unit, the two receiving recesses cooperatively forming said receiving space. 
   
   
       8 . The heat sink as described in  claim 6 , wherein the heat sink further comprises a third fin unit connected to the second fin unit, the third fin unit comprising a sidewall located at a lateral side of the third fin unit, the second fin unit further including another sidewall facing towards the sidewall of the third fin unit, the sidewall of the third fin unit abutting against said another sidewall of the second fin unit, another receiving space defined between the sidewall of the third fin unit and said another sidewall of the second fin unit adapted for receiving another dual-in-line package electronic component therein. 
   
   
       9 . The heat sink as described in  claim 8 , wherein a receiving recess is defined in the sidewall of the third fin unit and a receiving recess is defined in said another sidewall of the second fin unit, the two receiving recesses cooperatively forming said another receiving space. 
   
   
       10 . The heat sink as described in  claim 6 , wherein the sidewall of each fin unit has a thicker thickness than each of the heat dissipation fins of the corresponding fin unit. 
   
   
       11 . The heat sink as described in  claim 6 , wherein the receiving space comprises a first portion adapted for receiving a main body of the dual-in-line package electronic component and a second portion located under the first portion and adapted for receiving two electrical pins of the dual-in-line package electronic component. 
   
   
       12 . A heat sink for dissipating heat from at least one dual-in-line package electronic component comprising a fin unit, the fin unit comprising at least a sidewall located at a lateral side thereof and a plurality of heat dissipation fins thermally connected to the at least a sidewall, a receiving recess defined in the at least a sidewall of the fin unit adapted for receiving a dual-in-line package electronic component therein. 
   
   
       13 . The heat sink as described in  claim 12 , wherein the at least a sidewall has two in number, the two sidewalls located at two opposite lateral sides of the fin unit respectively, the receiving recess defined in an outer surface of each of the sidewalls. 
   
   
       14 . The heat sink as described in  claim 12 , wherein the receiving recess comprises a first recess portion adapted for receiving a main body of the electronic component and a second recess portion located under the first recess portion and adapted for receiving two electrical pins of the electronic component.