Heat sink having bumps for positioning heat pipes therein

Abstract

A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a plurality of bumps projecting upwardly therefrom, which sandwich the heat pipes therebetween to position the heat pipes on the lower plate, wherein some of the heat pipes are bent and sandwiched between two bumps at each bended position, and some of the heat pipes are straight and located near one bump at each end portion thereof.

1 . A heat sink adapted for an electronic component, comprising:
 a lower plate; and   heat pipes fixed on the lower plate, wherein the lower plate forms a plurality of bumps according to peripheries of the heat pipes to position the heat pipes relative to the lower plate.   
   
   
       2 . The heat sink as claimed in  claim 1 , wherein the heat pipes comprises bended heat pipes, each of the bended heat pipes being sandwiched between two bumps at each bended position. 
   
   
       3 . The heat sink as claimed in  claim 2 , wherein the heat pipes comprises straight heat pipes sandwiched between the bended heat pipes, the straight heat pipes being juxtaposed and contacting with each other. 
   
   
       4 . The heat sink as claimed in  claim 3 , wherein each bended heat pipe comprises a straight section, a pair of bended sections extending slantwise and outwardly from the straight section, and an extremity end extending from one of the pair of bended sections, the straight sections of the bended heat pipes abutting side-by-side against the straight heat pipes. 
   
   
       5 . The heat sink as claimed in  claim 4 , wherein each of junctions of the straight sections and the bended sections of the bended heat pipes is sandwiched between and positioned by two bumps. 
   
   
       6 . The heat sink as claimed in  claim 4 , wherein at least one of the bended sections is located between two bumps, and at least one of the extremity ends of the bended sections is located adjacent to one bump. 
   
   
       7 . The heat sink as claimed in  claim 1 , wherein the lower plate forms a protrusion projecting downwardly therefrom and a trough defined in the protrusion and opened upwardly, the protrusion being adapted for contacting the electronic component. 
   
   
       8 . The heat sink as claimed in  claim 7 , wherein the heat pipes have a plurality of bulges projecting downwardly therefrom, the plurality of bulges being received in the cavity and abutting against the protrusion of the lower plate. 
   
   
       9 . The heat sink as claimed in  claim 1 , wherein the lower plate comprises a planar board, a pair of sidewalls extending upwardly from two opposite sides of the board, and a pair of flanges formed vertically from tops of the pair of sidewalls, the bumps being formed on the board. 
   
   
       10 . The heat sink as claimed in  claim 9  further comprising an upper plate fixed on the flanges of the lower plate, wherein the heat pipes are sandwiched between and directly contact the board and the upper plate, and spaced from the sidewalls of the lower plate. 
   
   
       11 . The heat sink as claimed in  claim 10  further comprising an upper fin arrangement fixed on the upper plate and a lower fin arrangement fixed on the board, wherein the upper fin arrangement occupies a total area of a top face of the upper plate and the lower fin arrangement occupies a half area of a bottom face of the board. 
   
   
       12 . A heat sink adapted for dissipating heat from an electronic component, comprising:
 a lower plate;   an upper plate fixed on the lower plate; and   a plurality of heat pipes sandwiched between the lower plate and the upper plate, wherein the lower plate has a plurality of embosses formed upwardly corresponding to shapes of the plurality of heat pipes, and wherein the plurality of heat pipes are sandwiched between the plurality of embosses to be positioned on the lower plate.   
   
   
       13 . The heat sink as claimed in  claim 12 , wherein the plurality of heat pipes comprises at least a bended heat pipe and at least a straight heat pipe, the at least a bended heat pipe being sandwiched between two embosses at each bended position, and the at least a straight heat pipe being located near one emboss at each end thereof. 
   
   
       14 . The heat sink as claimed in  claim 13 , wherein the at least a bended heat pipe comprises a straight portion parallel to and contacting the at least a straight heat pipe, a pair of bended portions extending slantwise from two ends of the straight portion, and an extremity end extending from one of the bended portions and parallel to the straight portion. 
   
   
       15 . The heat sink as claimed in  claim 14 , wherein one emboss is located adjacent to the end of the at least a straight heat pipe and sandwiches an junction of the straight portion and one of the pair of bended portions of the at least a bended heat pipe with another emboss. 
   
   
       16 . The heat sink as claimed in  claim 12  further comprising an upper fin arrangement fixed on the upper plate and a lower fin arrangement fixed on the lower plate, wherein each of the upper fin arrangement and the lower fin arrangement comprises a plurality of fins parallel to each other. 
   
   
       17 . The heat sink as claimed in  claim 12 , wherein a protrusion projects downwardly from a part of the lower plate and a trough is defined in the protrusion and opened upwardly, the heat pipes having at least a part received in the trough and contacting the protrusion. 
   
   
       18 . A heat sink for cooling an electronic component comprising:
 a lower plate;   a lower fin set fixed on the lower plate;   an upper plate;
 an upper fin set fixed on the upper plate; and 
   a plurality of heat pipes sandwiched between the lower plate and the upper plate comprising straight heat pipes and bended heat pipes, wherein a plurality of bumps projecting upwardly from the lower plate and sandwich the heat pipes therebetween to position the heat pipes on the lower plate, and wherein some of the bumps are located adjacent to ends of the straight heat pipes and other some of the bumps are located adjacent to the bended heat pipes at bended positions and still other some of the bumps are located adjacent to ends of the bended heat pipes.   
   
   
       19 . The heat sink as claimed in  claim 18 , wherein the upper fin set occupies a whole area of a top face of the upper plate and the lower fin set occupies a half area of a bottom face of the lower plate. 
   
   
       20 . The heat sink as claimed in  claim 18 , wherein the lower plate forms a protrusion projecting downwardly therefrom and adjacent to the lower fin set, and a trough defined in the protrusion and opened upwardly, the heat pipes having portions being received in the trough and contacting with the protrusion.