Water-cooled cold plate with integrated pump

Abstract

Embodiments of the present invention provide a cooling apparatus for cooling an electronic component to which the cooling apparatus is attached. In one embodiment, an apparatus for cooling an electronic component comprises a pump; a cooling member configured to be disposed adjacent the electronic component, the cooling member including a plurality of protrusions over which a cooling fluid circulates to dissipate heat generated by the electronic component; a coolant flow control housing coupled to the cooling member, the coolant flow control housing including a distributed flow path over the plurality of protrusions for the cooling fluid to enter the cooling member in a distributed manner over the plurality of protrusions, and an exit path for the cooling fluid to exit the cooling member; and a serialization housing connected between the coolant flow control housing and the pump, the serialization housing including a pump inlet to direct the cooling fluid from the exit path of the coolant flow control housing to the pump for pumping the cooling fluid out of the apparatus.

1 . An apparatus for cooling an electronic component, the apparatus comprising:
 a pump;   a cooling member configured to be disposed adjacent the electronic component, the cooling member including a plurality of protrusions over which a cooling fluid circulates to dissipate heat generated by the electronic component;   a coolant flow control housing coupled to the cooling member, the coolant flow control housing including a distributed flow path for the cooling fluid to enter the cooling member in a distributed manner over the plurality of protrusions, and an exit path for the cooling fluid to exit the cooling member; and   a serialization housing connected between the coolant flow control housing and the pump, the serialization housing including a pump inlet to direct the cooling fluid from the exit path of the coolant flow control housing to the pump for pumping the cooling fluid out of the apparatus.   
   
   
       2 . The apparatus of  claim 1 , wherein the cooling member includes a flat surface on a back side of a surface containing the plurality of protrusions, the flat surface being configured to contact the electronic component to be cooled. 
   
   
       3 . The apparatus of  claim 1 , wherein the coolant flow control housing includes a retention mechanism to attach the apparatus to the electronic component. 
   
   
       4 . The apparatus of  claim 1 , wherein the serialization housing includes an inlet port to receive a cooling fluid into the apparatus and direct the cooling fluid to the distributed flow path of the coolant flow control housing, and an outlet port for the cooling fluid to exit the apparatus after circulating over the plurality of protrusions of the cooling member. 
   
   
       5 . The apparatus of  claim 1 , wherein the plurality of protrusions of the cooling member cover an area having a length and a width, said area being generally square with the length about equal to the width 
   
   
       6 . The apparatus of  claim 5 , wherein the coolant flow control housing includes a flow outlet port to provide the distributed flow path over the plurality of protrusions, the flow outlet port having a generally rectangular shape with a length that is at least about 50% of the length of the area of the plurality of protrusions. 
   
   
       7 . The apparatus of  claim 6 , wherein the coolant flow control housing includes a flow inlet port to provide the exit path for the cooling fluid to exit the cooling member, the flow inlet port having a generally rectangular shape with a length that is at least about 50% of the length of the area of the plurality of protrusions. 
   
   
       8 . The apparatus of  claim 7 , wherein the flow outlet port overlaps a first portion of the area of the plurality of protrusions on a first side and the flow inlet port overlaps a second portion of the area of the plurality of protrusions on a second side opposite from the first side. 
   
   
       9 . The apparatus of  claim 7 , wherein the coolant flow control housing includes a generally triangular flow inlet cavity with a vertex that is fluidly coupled to a cooling fluid inlet, and wherein the flow outlet port is disposed adjacent an edge of the generally triangular flow inlet cavity opposite from the vertex. 
   
   
       10 . The apparatus of  claim 7 , wherein the serialization housing further includes:
 a hydraulic cavity having a substantially convex shape, wherein the pump inlet is coupled to direct the cooling fluid from the exit path of the coolant flow control housing to the hydraulic cavity; and   an outlet port disposed generally tangential along the side of the hydraulic cavity.   
   
   
       11 . An apparatus for coupling a pump with a cooling member for cooling an electronic component to form an integrated cooling device, the apparatus comprising:
 a coolant flow control housing configured to be coupled to the cooling member, the coolant flow control housing including a distributed flow path for providing cooling fluid to the cooling member and an exit path for the cooling fluid to exit the cooling member; and   a serialization housing configured to be connected between the coolant flow control housing and the pump, the serialization housing including a pump inlet to direct the cooling fluid from the exit path of the coolant flow control housing to the pump for pumping the cooling fluid out of the apparatus.   
   
   
       12 . The apparatus of  claim 11  wherein the distribution flow path of the coolant flow control housing includes a flow inlet cavity which diverges from a vertex to an opposite edge disposed opposite from the vertex, the vertex being fluidly coupled to a cooling fluid inlet, the opposite edge having a length substantially larger than a size of the cooling fluid inlet 
   
   
       13 . The apparatus of  claim 12 , wherein the flow inlet cavity is generally triangular in shape with the vertex disposed at a first corner and the opposite edge disposed on a side opposite from the vertex. 
   
   
       13 . The apparatus of  claim 11 , wherein the coolant flow control housing includes a generally rectangular flow inlet port to provide the exit path for the cooling fluid to exit the cooling member. 
   
   
       14 . The apparatus of  claim 11 , wherein the coolant flow control housing includes a retention mechanism to attach the integrated cooling device to the electronic component. 
   
   
       15 . The apparatus of  claim 11 , wherein the serialization housing further includes:
 an inlet port to receive a cooling fluid into the integrated cooling device and direct the cooling fluid to the vertex of the flow inlet cavity of the coolant flow control housing, and   an outlet port for the cooling fluid to exit the integrated cooling device after circulating over the cooling member.   
   
   
       16 . The apparatus of  claim 15 , wherein the serialization housing includes a hydraulic cavity having a curved wall, wherein the outlet port of the serialization housing is disposed generally tangential to the curved wall of the hydraulic cavity. 
   
   
       17 . An apparatus for coupling a pump with a cooling member for cooling an electronic component to form an integrated cooling device:
 a coolant flow control housing configured to be coupled to the cooling member, the coolant flow control housing including a generally rectangular flow outlet port to provide a distributed flow path for a cooling fluid to enter the cooling member in a distributed manner and an exit path for the cooling fluid to exit the cooling member; and   a serialization housing configured to be connected between the coolant flow control housing and the pump, the serialization housing including a pump inlet to direct the cooling fluid from the exit path of the coolant flow control housing to the pump for pumping the cooling fluid out of the apparatus.   
   
   
       18 . The apparatus of  claim 17 , wherein the cooling member is configured to be disposed adjacent the electronic component, the cooling member including a plurality of protrusions over which the cooling fluid circulates to dissipate heat generated by the electronic component. 
   
   
       19 . The apparatus of  claim 17 , wherein the coolant flow control housing includes a retention mechanism to attach the integrated cooling device to the electronic component. 
   
   
       20 . The apparatus of  claim 17 , wherein the serialization housing includes an outlet port which directs cooling fluid out from the apparatus towards a heat exchanger. 
   
   
       21 . The apparatus of  claim 20 , wherein the serialization housing includes a hydraulic cavity having a curved wall, and wherein the outlet port of the serialization housing is disposed generally tangential to the curved wall of the hydraulic cavity. 
   
   
       22 . The apparatus of  claim 17 , wherein the coolant flow control housing includes a generally triangular flow inlet cavity with a vertex that is fluidly coupled to a cooling fluid inlet, and wherein the generally rectangular flow outlet port is disposed adjacent an edge of the generally triangular flow inlet cavity opposite from the vertex to provide a distributed flow path over the cooling member. 
   
   
       23 . The apparatus of  claim 22 , wherein the serialization housing includes an inlet port to receive a cooling fluid into the integrated cooling device and direct the cooling fluid to the vertex of the generally triangular flow inlet cavity of the coolant flow control housing, and an outlet port for the cooling fluid to exit the integrated cooling device after circulating over the cooling member.