Light reflecting material, package for light emitting element accommodation, light emitting device and process for producing package for light emitting element accomodation

Abstract

[Problems] To provide a package for light emitting element accommodation that realizes enhanced reflectance without application of a metal plating onto a ceramic. [Means for Solving Problems] There is provided a package for light emitting element accommodation comprising ceramic substrate ( 2 ) having conductor mounting region ( 8 ) for mounting of light emitting element ( 1 ) on its upper surface; frame ( 4 ) of a light reflecting material containing 74.6 mass % or more of alumina whose average particle diameter after sintering is 2.5 μm or less, the frame ( 4 ) disposed on an upper surface of the substrate ( 2 ) in such a fashion that internal circumferential surface ( 7 ) of through-hole ( 3 ) expands outward; and light emitting element ( 1 ) mounted on the conductor mounting region ( 8 ) of the substrate ( 2 ). Thus, the reflectance of the frame ( 4 ) is enhanced without application of a metal plating thereonto.

1 . A light reflecting material containing alumina whose particle diameter after sintering is not more that 25 μm at not less than 74.6 mass %. 
   
   
       2 . The light reflecting material according to  claim 1 ,
 wherein the light reflecting material contains a barium element.   
   
   
       3 . The light reflecting material according to  claim 2 ,
 wherein the light reflecting material contains the barium element at 0.698 mass %-22.4 mass %.   
   
   
       4 . A package for a light emitting element accommodation comprising:
 a substrate comprising of ceramic; and   a frame body which is formed on an upper surface of the substrate and contains a light reflecting material including alumina whose average particle diameter after sintering is not more than 2.5 μm at not less than 74.6 mass %.   
   
   
       5 . The package for a light emitting element accommodation according to  claim 4 ,
 wherein the frame body contains a barium element.   
   
   
       6 . The package for a light emitting element accommodation according to  claim 5 ,
 wherein the frame body contains the barium element at 0.698 mass %-22.4 mass %.   
   
   
       7 . The package for a light emitting element accommodation according to  claim 6 ,
 wherein the substrate has a conductor mounted portion which mounts a light emitting element on an upper surface.   
   
   
       8 . A light emitting device comprising:
 a substrate which has a conductor mounted portion mounting a light emitting element on an upper surface and comprises of ceramic;   a frame body which is formed on an upper surface of the substrate for surrounding the conductor mounted portion and contains a light reflecting material including alumina whose average particle diameter after sintering is not more than 2.5 μm at not less than 74.6 mass %; and   an emitting element mounted on the conductor mounted portion of the substrate.   
   
   
       9 . The light emitting device according to  claim 8 ,
 wherein the frame body contains a barium element.   
   
   
       10 . The light emitting device according to  claim 9 ,
 wherein the frame body contains a barium element at 0.698 mass %-22.4 mass %.   
   
   
       11 . A method of manufacturing a package for a light emitting element wherein the package comprises a substrate comprising of ceramic and a frame body formed on an upper surface of the substrate, comprising:
 making a raw powder including an alumina particle;   making a frame shaped object by shaping the raw powder; and   obtaining the frame body including alumina whose average particle diameter after sintering is not more than 2.5 μm at not less than 74.6 mass % by sintering the frame shaped object.   
   
   
       12 . The method of manufacturing a package for a light emitting element according to  claim 11 ,
 obtaining the frame body containing a barium element.   
   
   
       13 . The method of manufacturing a package for a light emitting element according to  claim 12 ,
 obtaining the frame body containing a barium element at 0.698 mass %-22.4 mass %.   
   
   
       14 . The method of manufacturing a package for a light emitting element according to  claim 11 ,
 obtaining the frame body at a sintering temperature of 1350 degrees C.-1650 degrees C.   
   
   
       15 . The method of manufacturing a package for a light emitting element according to  claim 14 ,
 the raw powder contains barium carbonate.   
   
   
       16 . The method of manufacturing a package for a light emitting element according to  claim 11 ,
 making the frame shaped object by pressing the raw powder in a mold.   
   
   
       17 . The method of manufacturing a package for a light emitting element according to  claim 11 ,
 making the frame shaped object by punching a green sheet at a predetermined shape after making the green sheet from the raw powder.   
   
   
       18 . The method of manufacturing a package for a light emitting element according to  claim 15 , making the frame shaped object by pressing the raw powder in a mold. 
   
   
       19 . The method of manufacturing a package for a light emitting element according to  claim 15 , making the frame shaped object by punching a green sheet at a predetermined shape after making the green sheet from the raw powder.