Method for manufacturing magnetic head

Abstract

According to an aspect of an embodiment, a method for manufacturing a magnetic head includes: providing a substrate; forming a first magnetic layer having a pattern for forming a magnetic pole on the substrate; forming a stopper layer of non-magnetic material on the top and the sides of the first magnetic layer; reducing the thickness of the stopper layer on the top of the first magnetic layer; and forming a second magnetic layer on the stopper layer. The method further includes: polishing the second magnetic layer to expose the stopper layer on the top of the first magnetic layer; and removing the stopper layer on the top of the first magnetic layer, so as to expose the top of the first magnetic layer.

1 . A method for manufacturing a magnetic head comprising:
 providing a substrate;   forming a first magnetic layer having a pattern for forming a magnetic pole on the substrate;   forming a stopper layer of non-magnetic material on the top and the sides of the first magnetic layer;   reducing the thickness of the stopper layer on the top of the first magnetic layer;   forming a second magnetic layer on the stopper layer;   polishing the second magnetic layer to expose the stopper layer on the top of the first magnetic layer; and   removing the stopper layer on the top of the first magnetic layer, so as to expose the top of the first magnetic layer.   
   
   
       2 . The method according to  claim 1 , wherein the stopper is formed of tantalum. 
   
   
       3 . The method according to  claim 1 , wherein forming the first magnetic layer includes:
 forming a plating seed layer on the substrate;   forming a resist pattern on the plating seed layer, the resist pattern having an opening in which the plating seed layer is exposed at the bottom; and   electroplating by using the plating seed layer as a plating power supply layer so as to form the first magnetic layer on a part of the plating seed layer in the opening.   
   
   
       4 . The method according to  claim 1 , further comprising:
 etching the upper side of the substrate by using the first magnetic layer as a mask.   
   
   
       5 . The method according to  claim 3 , further comprising:
 etching the plating seed layer by using the first magnetic layer as a mask after forming the first magnetic layer.   
   
   
       6 . The method according to  claim 5 , further comprising:
 etching the upper side of the substrate by using the first magnetic layer as a mask.   
   
   
       7 . The method according to  claim 1 , further comprising:
 polishing the surface of the substrate to finish the surface after removing the stopper layer.   
   
   
       8 . The method according to  claim 1 , further comprising:
 forming on the stopper layer a resist pattern having an opening exposing a part of the stopper layer where the first magnetic layer is disposed, wherein the second magnetic layer is formed on the part of the stopper layer in the opening; and   removing the resist pattern after forming the second magnetic layer.   
   
   
       9 . The method according to  claim 1 , further comprising:
 forming an insulating layer on the second magnetic layer, wherein by polishing the second magnetic layer, the insulating layer is polished simultaneously with the second magnetic layer to form a common plane.   
   
   
       10 . A method for manufacturing a magnetic head comprising:
 providing a substrate;   forming a first magnetic layer having a pattern for forming a magnetic pole on the substrate on the substrate;   forming a stopper layer of non-magnetic material on the top of the first magnetic layer;   forming a first insulating layer on the top of the stopper layer and the sides of the first magnetic layer, the first insulating layer capable of being polished at a higher rate than the stopper layer;   reducing the thickness of the first insulating layer on the top of the stopper layer formed on the top of the first magnetic layer;   forming a second magnetic layer on the stopper layer;   polishing the second magnetic layer to expose the stopper layer on the top of the first magnetic layer; and   removing the stopper layer on the top of the first magnetic layer, so as to expose the top of the first magnetic layer.   
   
   
       11 . The method according to  claim 10 , wherein the first insulating layer is formed of alumina. 
   
   
       12 . The method according to  claim 10 , wherein the stopper is formed of tantalum. 
   
   
       13 . The method according to  claim 10 , wherein forming the first magnetic layer includes:
 forming a plating seed layer on the substrate;   forming a resist pattern on the plating seed layer, the resist pattern having an opening in which a part of the plating seed layer is exposed; and   electroplating by using the plating seed layer as a plating power supply layer so as to form the first magnetic layer on a part of the plating seed layer in the opening.   
   
   
       14 . The method according to  claim 10 , wherein the stopper layer of non-magnetic material is further formed on the side of the first magnetic layer. 
   
   
       15 . The method according to  claim 10 , further comprising:
 etching the upper side of the substrate by using the first magnetic layer as a mask.   
   
   
       16 . The method according to  claim 13 , further comprising:
 etching the plating seed layer by using the first magnetic layer as a mask after forming the first magnetic layer.   
   
   
       17 . The method according to  claim 16 , further comprising:
 etching the upper side of the substrate by using the first magnetic layer as a mask.   
   
   
       18 . The method according to  claim 10 , further comprising:
 polishing the surface of the substrate to finish the surface after removing the stopper layer.   
   
   
       19 . The method according to  claim 10 , further comprising:
 forming on the stopper layer a resist pattern having an opening exposing a part of the stopper layer where the first magnetic layer is disposed, wherein the second magnetic layer is formed on the part of the stopper layer in the opening; and   removing the resist pattern after forming the second magnetic layer.   
   
   
       20 . The method according to  claim 10 , further comprising:
 forming a second insulating layer wherein by polishing the second magnetic layer, the second insulating layer is polished simultaneously with the second magnetic layer to form a common plane.