Heat sink having locking device

Abstract

A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together.

1 . A heat sink adapted for cooling an electronic component, comprising:
 a lower plate comprising a panel, a pair of sidewalls extending upwardly from two opposite lateral sides of the panel, and a plurality of flanges extending upwardly from tops of the pair of sidewalls, respectively;   an upper plate defining a plurality of cutouts therein corresponding to the plurality of flanges; and   a plurality of heat pipes sandwiched between the lower plate and the upper plate, wherein the plurality of flanges of the lower plate fit into the plurality of cutouts of the upper plate so that the lower plate and the upper are mechanically connected together.   
   
   
       2 . The heat sink as described in  claim 1 , wherein each of the pair of sidewalls is oriented perpendicular to the panel and coplanar with the flanges located at the same lateral side of the panel. 
   
   
       3 . The heat sink as described in  claim 2 , wherein each of the sidewalls has three flanges formed thereon, two ones of the three flanges being located at two ends of each of the sidewalls and one of the three flanges being located at a middle of each of the sidewalls. 
   
   
       4 . The heat sink as described in  claim 2 , wherein each of the cutouts of the upper plate has a length identical to that of each of the plurality of flanges. 
   
   
       5 . The heat sink as described in  claim 2 , wherein the upper plate has a thickness identical to a height of the each of the plurality of flanges. 
   
   
       6 . The heat sink as described in  claim 2 , wherein a height of the each of the pair of sidewalls defines a thickness of each of the plurality of heat pipes. 
   
   
       7 . The heat sink as described in  claim 1 , wherein the plurality of heat pipes directly contact each other and are spaced from the pair of sidewalls of the lower plate. 
   
   
       8 . The heat sink as described in  claim 1 , wherein the plurality of heat pipes comprises two straight heat pipes and two bended heat pipes sandwiching the two straight heat pipes therebetween. 
   
   
       9 . The heat sink as described in  claim 8 , wherein each of the two bended heat pipes comprises a straight section juxtaposed and contact with a corresponding straight heat pipe, a pair of bended sections extending slantwise and outwardly from two opposite ends of the straight section, and an extremity end extending from one of the pair of bended sections. 
   
   
       10 . The heat sink as described in  claim 9 , wherein the pair of bended sections of each of the two bended heat pipes are inclinedly spaced from the two straight heat pipes, and the extremity end is spaced from and parallel to the two straight heat pipes. 
   
   
       11 . A heat sink for dissipating heat from an electronic component, comprising: an upper plate;
 a lower plate comprising a plurality of flanges inserted into the upper plate to connect with the upper plate; and   a plurality of heat pipes sandwiched between the upper plate and the lower plate, wherein the upper plate and the lower plate cooperatively construct a hollow cube and together define a rectangular airflow passage therebetween.   
   
   
       12 . The heat sink as described in  claim 11 , wherein the lower plate further comprising a panel connecting with the plurality of heat pipes, and a pair of sidewalls extending upwardly from two opposite lateral sides of the panel and spaced from the plurality of heat pipes. 
   
   
       13 . The heat sink as described in  claim 12 , wherein the plurality of flanges are extended upwardly from the pair of sidewalls, the flanges formed on one of the pair of sidewalls being coplanar with the one of the pair of sidewalls. 
   
   
       14 . The heat sink as described in  claim 9 , wherein the upper plate defines a plurality of cutouts corresponding to the flanges of the lower plate to receive the flanges therein. 
   
   
       15 . The heat sink as described in  claim 11 , wherein a height of each of the plurality of flanges is identical to a thickness of the upper plate. 
   
   
       16 . The heat sink as described in  claim 1 , wherein the plurality of heat pipes contact with each other at middle positions thereof, and are partially separated from each other at end positions thereof. 
   
   
       17 . A heat sink, comprising:
 a lower plate;   a upper plate parallel to the lower plate;   a plurality of heat pipes sandwiched between the lower and upper plates;   two groups of fins sandwiching the lower and upper plates therebetween; and   a locking device forming between the lower and upper plates.   
   
   
       18 . The heat sink as described in  claim 17 , wherein the locking device comprises a pair of sidewalls extending from the two lateral sides of the lower plate and toward the upper plate, and a plurality of spaced tabs extending from the sidewalls. 
   
   
       19 . The heat sink as described in  claim 18 , wherein the locking device further comprises a plurality of cutouts defining in two lateral sides of the upper plate and corresponding to the tabs of the lower plate, the tabs being engaged in the cutouts. 
   
   
       20 . The heat sink as described in  claim 19 , wherein the heat pipes contact with each other at middle positions thereof, and are partially separated from each other at end positions thereof.