US2009151909A1PendingUtilityA1

Heat-Dissipating Unit

33
Assignee: ASIA VITAL COMPONENTS CO LTDPriority: Dec 13, 2007Filed: Apr 11, 2008Published: Jun 18, 2009
Est. expiryDec 13, 2027(~1.4 yrs left)· nominal 20-yr term from priority
Inventors:Hsiuwei Yang
H10W 40/43H10W 40/226F28F 2215/00
33
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Claims

Abstract

A heat-dissipating unit is provided. The heat-dissipating unit includes a board. The board is thermally conductive and includes a contact portion planar in shape. The contact portion is in immediate contact with a heat-generating source for the sake of heat transfer. An integrally formed branch portion extends outward from at least one end of the contact portion. With the contact portion being in immediate contact with the heat-generating source, heat is transferred from the heat-generating source to a remote end via the branch portion, thereby enhancing heat dissipation.

Claims

exact text as granted — not AI-modified
1 . A heat-dissipating unit, comprising:
 a board being thermally conductive and defined with a plane;   a contact portion formed on said plane of said board, said contact portion being in immediate contact with a heat-generating source; and   at least one branch portion extending outward from at least one end of said contact portion;   wherein heat is transferred to a remote end via said branch portion, thereby enabling heat dissipation.   
   
   
       2 . The heat-dissipating unit of  claim 1 , wherein said branch portion is coupled to heat-dissipating fins. 
   
   
       3 . The heat-dissipating unit of  claim 2 , wherein said heat-dissipating fins are further provided with a fan for cooling, to enhance heat dissipation.

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