Cooling Module

Abstract

A cooling module for using in a metal housing of a calculation processing apparatus is disclosed. The cooling module is adapted to cool at least one heat source inside the metal housing. The cooling module comprises a first heat conduction plate, a second heat conduction plate and a heat conduction device, wherein the first heat conduction plate covers the heat source, the second heat conduction plate connects to the metal housing, and the heat conduction device is adapted to connect the first heat conduction plate with the second heat conduction plate. After the heat generated by the heat source is absorbed by the first heat conduction plate, the heat is transmitted to the second heat conduction plate through the heat conduction device, and will be dissipated uniformly throughout the metal housing.

1 . A cooling module for cooling at least one heat source disposed inside a metal housing of a calculation processing apparatus, the cooling module comprising:
 a first heat conduction plate, disposed above the at least one heat source, wherein the first conduction plate has a shaping substantially complies with a top of the at least one heat source;   a second heat conduction plate, connected to the metal housing; and   a heat conduction device, connected to the first heat conduction plate and the second heat conduction plate so that heat generated from the at least one heat source is absorbed by the first heat conduction plate and transmitted to the second heat conduction plate through the heat conduction device, and then dissipated outside through the metal housing.   
   
   
       2 . The cooling module of  claim 1 , further comprising a first thermal medium, wherein the first thermal medium is disposed between the first heat conduction plate and the at least one heat source and transmits the heat which is absorbed from the at least one heat source, to the first heat conduction plate, and wherein the first thermal medium is selected from a group consisting of thermal grease, thermal glue, lead-free solder, a thermal pad, and the combination thereof. 
   
   
       3 . The cooling module of  claim 1 , further comprising a second thermal medium, wherein the second thermal medium is disposed between the second conduction plate and the metal housing for sticking the second heat conduction plate to the metal housing, and wherein the second thermal medium is selected from a group consisting of thermal grease, thermal glue, lead-free solder, a thermal pad, and the combination thereof. 
   
   
       4 . The cooling module of  claim 1 , wherein the at least one heat source comprises a plurality of heat sources, and the first conduction plate has a shaping substantially complies with a top of the heat sources. 
   
   
       5 . The cooling module of  claim 4 , wherein the thermal device comprises a plurality of first heat pipes, substantially arranged side by side. 
   
   
       6 . The cooling module of  claim 5 , wherein a surface area of the second heat conduction plate is not less than that of the first heat conduction plate. 
   
   
       7 . The cooling module of  claim 5 , further comprising a thermal assembly, attached to the metal housing, the thermal assembly comprising a third heat conduction plate disposed between the second heat conduction plate and the metal housing. 
   
   
       8 . The cooling module of  claim 7 , wherein the thermal assembly further comprises a plurality of metal thermal pieces and a plurality of second heat pipes, connected to the third heat conduction plate via the corresponding metal thermal pieces. 
   
   
       9 . The cooling module of  claim 8 , wherein the second heat conduction plate is adhered to the third heat conduction plate. 
   
   
       10 . The cooling module of  claim 9 , further comprising a second thermal medium, wherein the second thermal medium is disposed between the second heat conduction plate and the metal housing for sticking the second heat conduction plate to the metal housing, and wherein the second thermal medium is selected form a group consisting of thermal grease, thermal glue, lead-free solder, a thermal pad, and the combination thereof. 
   
   
       11 . The cooling module of  claim 8 , wherein the second heat conduction plate is fixed on the third heat conduction plate by fasteners. 
   
   
       12 . The cooling module of  claim 8 , wherein each of the first, the second and the third heat conduction plates is selected from a group consisting of copper, aluminum, and the combination thereof. 
   
   
       13 . The cooling module of  claim 1 , wherein the metal housing has a plurality of fins for increasing the heat-dissipation area of the metal housing. 
   
   
       14 . The cooling module of  claim 1 , wherein the metal housing has at least two openings, opposite with each other, disposed respectively on an upper and a lower opposite end portion of the calculation processing apparatus for heat convection. 
   
   
       15 . The cooling module of  claim 1 , wherein the calculation processing apparatus is a point on sale (POS). 
   
   
       16 . The cooling module of  claim 1 , wherein the total working power of the at least one heat source is substantially no less than 10 watts.