Compliant thermal interface design and assembly method

Abstract

A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one selected pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets, such that the sheets include both flat areas and spring elements; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.

1 . A method for producing a compliant thermal interface device for cooling an integrated circuit; the method comprising steps of:
 cutting a plurality of high thermal conductivity sheets according to at least one selected pattern; the high thermal conductivity sheets comprising a first material;   forming spring elements in at least one of the plurality of high thermal conductivity sheets, such that the sheets comprise flat areas and spring elements;   coating the high thermal conductivity sheets with a second material, wherein the second material is different from the first material;   stacking the high thermal conductivity sheets; and   bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.   
   
   
       2 . The method of  claim 1  further comprising a step of: machining the bonded at least one stacked sheet. 
   
   
       3 . The method of  claim 1  wherein the first material comprises copper. 
   
   
       4 . The method of  claim 1  further comprising a step of attaching at least one end cap to the at least one sheet. 
   
   
       5 . The method of  claim 1  wherein cutting the high thermal conductivity sheets comprises etching the high thermally conductive sheets. 
   
   
       6 . The method of  claim 1  wherein cutting the high thermal conductivity sheets comprises stamping the high thermal conductivity sheets. 
   
   
       7 . The method of  claim 1  wherein cutting the high thermal conductivity sheets comprises cutting at least one slot to allow relative movement of flat portions of the sheet. 
   
   
       8 . The method of  claim 1  wherein coating the stacked sheets comprises applying a second material comprising silver. 
   
   
       9 . The method of  claim 1  wherein coating comprises using a sputter method. 
   
   
       10 . The method of  claim 1  wherein coating comprises using a plating method. 
   
   
       11 . The method of  claim 1  wherein the pattern comprises holes for carrying fluid to or from a neighboring stacked sheet. 
   
   
       12 . The method of  claim 1  wherein the first material comprises silver-bearing copper. 
   
   
       13 . The method of  claim 1  further comprising: inserting at least one restricting strip into at least one slot to direct coolant flow. 
   
   
       14 . A compliant thermal interface device comprising:
 a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheets is cut according to at least one pattern;   a plurality of spring elements formed on at least one sheet;   a coating applied over at least two of the sheets; and   bonding of at least a portion of the coatings of the at least two sheets.   
   
   
       15 . The compliant thermal interface device of  claim 14 , wherein the coating comprises silver. 
   
   
       16 . The compliant thermal interface device of  claim 14 , further comprising an integrated circuit to be cooled. 
   
   
       17 . The compliant thermal interface device of  claim 16 , wherein the at least one pattern comprises cooling fins for fluid micro channels. 
   
   
       18 . The compliant thermal interface device of  claim 16 , wherein at least one of the plurality of spring elements comprise a cooling fin structure. 
   
   
       19 . The compliant thermal interface device of  claim 16 , wherein at least one of the plurality of spring elements is formed according to a bend different than another at least one of the plurality of spring elements. 
   
   
       20 . A compliant thermal interface device comprising:
 a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheets is cut according to at least one pattern;   a plurality of spring elements formed on at least one sheet; and   a plurality of cooling fin elements separate from the spring elements formed on the at least one sheet