Heat sink

Abstract

A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are juxtaposed with each other at a central position thereof, and partially spaced from each other at two opposite end positions thereof.

1 . A heat sink adapted for cooling an electronic component, comprising:
 a lower plate;   a lower fin set attached on a bottom face of the lower plate;   an upper plate;   an upper fin set attached on a top face of the upper plate; and   a plurality of heat pipes sandwiched between the lower plate and the upper plate.   
   
   
       2 . The heat sink as claimed in  claim 1 , wherein the upper plate is planar, and the lower plate comprises a planar panel, the heat pipes being sandwiched between the upper plate and the panel. 
   
   
       3 . The heat sink as claimed in  claim 2 , wherein the lower plate further comprises a pair of sidewalls extending upwardly from two opposite lateral sides of the panel, and a pair of flanges extending horizontally from tops of the pair of sidewalls respectively and are soldered on the upper plate. 
   
   
       4 . The heat sink as claimed in  claim 2  further comprising a pair of securing members inserted into the pair of sidewalls and the pair of flanges, wherein each of the pair of securing members has a rectangular configuration. 
   
   
       5 . The heat sink as claimed in  claim 4 , wherein the upper plate defines four cutouts at two lateral sides thereof and forms a pair of tabs between adjacent cutouts corresponding to the pair of securing members, the pair of tabs resiliently abutting against the securing members, respectively. 
   
   
       6 . The heat sink as claimed in  claim 3 , wherein the heat pipes are juxtaposed with each other and spaced from the pair of sidewalls of the lower plate to form air passages. 
   
   
       7 . The heat sink as claimed in  claim 2 , wherein the panel of the lower plate forms a protrusion projecting downwardly therefrom, and a cavity defined in the protrusion and opened upwardly. 
   
   
       8 . The heat sink as claimed in  claim 7 , wherein the upper fin set occupies a total area of a top face of the upper plate, and the lower fin set occupies a part of a bottom face of the panel and is located near the protrusion. 
   
   
       9 . The heat sink as claimed in  claim 7 , wherein corresponding parts of the heat pipes project downwardly to form chassises, the chassises being received in the cavity and contacting the protrusion directly. 
   
   
       10 . The heat sink as claimed in  claim 1 , wherein two middle ones of the heat pipes are straight, and two lateral ones of the heat pipes are partially bended and each has a straight section, a pair of bended sections extending slantwise from the straight section and an extremity end extending from one of the pair of bended sections. 
   
   
       11 . The heat sink as claimed in  claim 10 , wherein the two middle heat pipes and the straight sections of the two lateral heat pipes contact with each other, the bended sections are slantwise spaced from the two middle heat pipes, and the extremity ends are spaced from and parallel to the two middle heat pipes. 
   
   
       12 . A heat sink for dissipating heat from an electronic component, comprising:
 a lower plate comprising a planar panel;   a planar upper plate; and   a plurality of heat pipes substantially sandwiched between the panel and the upper plate;   wherein the heat pipes are straight and juxtaposed with each other and directly contact with each other at a first position, and are at least partially separated from each other at a second position and a third position, the first position is located between the second position and the third position.   
   
   
       13 . The heat sink as claimed in  claim 12 , wherein the first position is located at a central area of the heat pipes, the second position and the third position are located at two opposite ends of the heat pipes, respectively. 
   
   
       14 . The heat sink as claimed in  claim 12 , wherein two middle ones of the heat pipes are straight and parallel to and directly contact with each other from begin to end. 
   
   
       15 . The heat sink as claimed in  claim 14 , wherein two lateral ones of the heat pipes each have a middle section being straight, two bended sections extending slantwise and outwardly from two opposite ends of the middle section, and an extremity end extending parallel to the middle section from one of the two bended sections. 
   
   
       16 . The heat sink as claimed in  claim 15 , wherein the middle sections of the two lateral heat pipes contact with the two middle heat pipes at the first position, corresponding bended sections are separated from the two middle heat pipes at the second position, and the extremity ends are separated from the two middle heat pipes at the third position. 
   
   
       17 . The heat sink as claimed in  claim 12  further comprising an upper fin set arranged on the upper plate and a lower fin set arranged on the panel, wherein the upper fin set is located over the first position, the second position and the third position, and the lower fin set is located next to the third position. 
   
   
       18 . The heat sink as claimed in  claim 12 , wherein the panel has a protrusion formed downwardly therefrom and a cavity defined in the protrusion and opened upwardly, the protrusion being located adjacent to the second position. 
   
   
       19 . The heat sink as claimed in  claim 18 , wherein the heat pipes forms chassises on bottom faces thereof, the chassises being received in the cavity and contact the protrusion directly. 
   
   
       20 . The heat sink as claimed in  claim 12 , wherein the lower plate further comprises a pair of sidewalls extending upwardly from two lateral sides of the panel and two flanges extending horizontally and oppositely from tops of the pair of sidewalls, the pair of sidewalls being separated from the heat pipes and the two flanges are fixed on the upper plate.