Heat dissipation device

Abstract

A heat dissipation device for removing heat from a heat generating-component mounted on a printed circuit board includes a heat sink and two heat pipes. The heat sink comprises a base plate in contact with the heat-generating component, two conducting arms extending upwardly and obliquely from two opposite ends of the base plate, a plurality of first fins extending upwardly from top surfaces of the base plate and the two conducting arms, and a plurality of second fins extending downwardly from bottoms surfaces of the conducting arms. The two heat pipes each comprise an evaporating section received in the base plate, at least a condensing section received in one of the conducting arms and at least a connecting section connecting at least an end of the evaporating section and the at least a condensing section.

1 . A heat dissipation device adapted for removing heat from a heat generating-component mounted on a printed circuit board comprising:
 a first heat sink comprising a first plate having a first horizontal part in contact with the heat generating-component and two oblique parts integrally extending obliquely from two opposite ends of the first horizontal part, a plurality of first fins extending downwardly from bottom surfaces of the two oblique parts;   a second heat sink in complementary with the first heat sink, comprising a second plate having a second horizontal part and two oblique parts integrally extending obliquely from two opposite ends of the first horizontal part, a plurality of second fins extending upwardly from top surfaces of the second plate;   two heat pipes each comprising an evaporating section, two condensing sections, two connecting sections connecting two opposite ends of the evaporating section with the two condensing sections;   wherein the two evaporating sections of two heat pipes are sandwiched between two horizontal parts of the first and second plates, the condensing sections of one of the two heat pipes are sandwiched between the corresponding oblique parts of the first and second plates and the two connecting sections are located beyond the first and second heat sinks.   
   
   
       2 . The heat dissipation device as claimed in  claim 1 , wherein the condensing sections of the heat pipes are parallel to the evaporating sections and perpendicular to the connecting sections, and the condensing sections of the heat pipes are located at a same side of the evaporating sections. 
   
   
       3 . The heat dissipation device as claimed in  claim 1 , wherein the two connecting sections are located to two lateral sides of the oblique parts of the first and second plates. 
   
   
       4 . The heat dissipation device as claimed in  claim 1 , wherein receiving grooves are correspondingly defined in a top surface of the first plate and in a bottom surface of the second plate, and cooperate with one another to form receiving through holes to receive the evaporating sections and the condensing sections of the heat pipes. 
   
   
       5 . The heat dissipation device as claimed in  claim 4 , wherein the through holes extending in a direction parallel to that of the first and second fins, and perpendicular to two lateral sides of the first and second plates. 
   
   
       6 . The heat dissipation device as claimed in  claim 1 , wherein the two oblique parts of the first or second plates are symmetrical to each other relative to a midline of the horizontal part of the first or two plate. 
   
   
       7 . The heat dissipation device as claimed in  claim 1 , wherein the first and second fins are perpendicular to the horizontal parts of the first and second plates. 
   
   
       8 . The heat dissipation device as claimed in  claim 1 , wherein bottom ends of the first fins level with each other. 
   
   
       9 . The heat dissipation device as claimed in  claim 1 , wherein top ends of the second fins are coplanar. 
   
   
       10 . The heat dissipation device as claimed in  claim 9 , wherein heights of the first fins at the oblique parts increase gradually toward a lateral direction from the horizontal part to the oblique parts of the first heat sink, heights of the second fins arranged on the oblique parts decrease gradually toward a lateral direction from the horizontal part toward the oblique parts of the second heat sink. 
   
   
       11 . A heat dissipation device for removing heat from a heat generating-component mounted on a printed circuit board comprising:
 a heat sink comprising a base plate in contact with the heat-generating component, two conducting arms extending upwardly and obliquely from two opposite ends of the base plate, a plurality of first fins extending upwardly from top surfaces of the base plate and the two conducting arms, and a plurality of second fins extending downwardly from bottoms surfaces of the conducting arms; and   two heat pipes each comprising an evaporating section received in the base plate, at least a condensing section received in one of the conducting arms and at least a connecting section connecting at least an end of the evaporating section and the at least a condensing section.   
   
   
       12 . The heat dissipation device as claimed in  claim 11 , wherein the base plate and the conducting arms therein defines through holes receiving the corresponding evaporating and condensing sections. 
   
   
       13 . The heat dissipation device as claimed in  claim 12 , wherein the through holes extend in a direction parallel to the first and second fins, and perpendicular to two lateral sides of the base plate and the conducting arms. 
   
   
       14 . The heat dissipation device as claimed in  claim 11 , wherein the two conducting arms plates are symmetrical to each other relative to a midline of the base plate. 
   
   
       15 . The heat dissipation device as claimed in  claim 11 , wherein the first and second fins are perpendicular to the base plates. 
   
   
       16 . The heat dissipation device as claimed in  claim 11 , wherein bottom ends of the first fins level with each other and top ends of the second fins are coplanar. 
   
   
       17 . A heat dissipation device comprising:
 a first heat sink having a first base plate and a pair of first wings slantwise extending outwardly and upwardly from two opposite free ends of the first base plate, a plurality of first fins extending vertically and downwardly from a bottom surface of each first wing;   a second heat sink having a second base plate parallel and corresponding to the first base plate of the first heat sink and a pair of second wings slantwise extending outwardly and upwardly from two opposite free ends of the second base plate, a plurality of second fins extending vertically and upwardly from top surfaces of the second base plate and the second wings; and   first and second heat pipes sandwiched between the first and second heat sinks, the first and second heat pipes each having an evaporating section sandwiched between the first and second base plates, and a condensing section interconnecting the evaporating section via a connecting section;   wherein the condensing sections of the first and second heat pipes are embedded in the first and second wings, the connecting sections of the first and second heat pipes are exposed out of the first and second wings.   
   
   
       18 . The heat dissipation device as claimed in  claim 17 , wherein a bottom surface of the first fins is coplanar with a bottom surface of the first base plate of the first heat sink, a bottom surface of the second fins is coplanar. 
   
   
       19 . The heat dissipation device as claimed in  claim 18 , wherein the evaporating sections of the first and second heat pipes are parallel to the condensing sections of the first and second heat pipes. 
   
   
       20 . The heat dissipation device as claimed in  claim 19 , wherein the first and second heat pipes each comprise another condensing section parallel to the evaporating sections and another connecting section parallel to said connecting sections.