High performance compliant thermal interface cooling structures

Abstract

A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding areas of the stacked sheets using thermo-compression bonding.

1 . A semiconductor cooling device comprising:
 a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheet is cut according to at least one pattern;   cooling structures cut into the at least one sheet, wherein the at least one sheet includes apertures for carrying coolant into and out of said cooling structure; and   at least one thermal isolation element positioned between at least one of the apertures for channeling coolant into the cooling structure and at least one of the apertures for channeling coolant out of the cooling structure.   
   
   
       2 . The device of  claim 1  further comprising an integrated circuit to be cooled. 
   
   
       3 . The device of  claim 1  wherein the thermal isolation element is a slot. 
   
   
       4 . The device of  claim 1  further comprising a first end cap disposed at a first end of the device. 
   
   
       5 . The device of  claim 4  further comprising a second end cap disposed at a second end of the device. 
   
   
       6 . The device of  claim 1  wherein the stacked sheets comprise a high thermal conductivity material. 
   
   
       7 . The device of  claim 1  wherein the stacked sheets comprise at least one flat portion of the sheet. 
   
   
       8 . The device of  claim 7  further comprising at least one slot cut into the sheet to allow relative movement of the flat portion of the sheet. 
   
   
       9 . The device of  claim 1  further comprising at least one restricting strip inserted into at least one slot to divert coolant flow. 
   
   
       10 . A compliant thermal interface device comprising:
 a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheet is cut according to at least one pattern;   a plurality of spring elements formed on at least one sheet; and   at least one flow restricting strip positioned between at least two spring elements.   
   
   
       11 . The device of  claim 10 , further comprising at least one end cap disposed at a first end of the device. 
   
   
       12 . The device of  claim 10 , further comprising an integrated circuit to be cooled. 
   
   
       13 . The device of  claim 10  further comprising at least one flow blocker for blocking coolant flow 
   
   
       14 . The device of  claim 10 , wherein at least one of the plurality of spring elements comprises a cooling fin structure. 
   
   
       15 . The device of  claim 14 , wherein at least one of the plurality of spring elements is formed according to a first bend different than a second bend of another at least one of the plurality of spring elements. 
   
   
       16 . The device of  claim 15  wherein the plurality of spring elements are formed such that the bends are in opposite directions when the plurality of sheets is stacked. 
   
   
       17 . A compliant thermal interface device comprising:
 a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheet is cut according to at least one pattern;   a plurality of spring elements formed on at least one sheet;   a plurality of cooling structures cut into at least one sheet, wherein the at least one sheet comprises a plurality of apertures for carrying coolant into and out of said cooling structures; and   at least one cross-tie element in at least one sheet positioned between at least one of said apertures and at least one cooling structure.   
   
   
       18 . The compliant thermal interface device of  claim 17 , wherein at least one of the plurality of spring elements comprises a cooling fin structure. 
   
   
       19 . The compliant thermal interface device of  claim 18 , wherein at least one of the plurality of spring elements is formed according to a first bend different than a second bend of another at least one of the plurality of spring elements. 
   
   
       20 . The compliant thermal interface device of  claim 19  wherein the first and second bends are in opposite directions when the plurality of sheets is stacked.