Printed circuit board having chip package mounted thereon and method of fabricating same

Abstract

Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.

1 . A printed circuit board having a chip package mounted thereon, comprising:
 a substrate having a plurality of electric contact portions formed on an upper side thereof and acting as a core;   bumps connecting to the electric contact portions of the chip package mounted on the substrate; and   an insulating layer laminated on the substrate and having a hole in which the chip package is mounted.   
   
   
       2 . The printed circuit board as set forth in  claim 1 , further comprising a circuit layer wherein a circuit pattern is formed laminated on the insulating layer. 
   
   
       3 . The printed circuit board as set forth in  claim 1 , further comprising a conductive material interposed between the electric contact portions and the bumps. 
   
   
       4 . The printed circuit board as set forth in  claim 2 , further comprising a conductive material interposed between the electric contact portions and the bumps. 
   
   
       5 . The printed circuit board as set forth in  claim 1 , further comprising a lead frame electrically connecting a side wall of the chip package to the circuit layer to provide a signal to the chip package. 
   
   
       6 . The printed circuit board as set forth in  claim 1 , further comprising a solder resistor applied on portions of an outermost layer other than the electric contact portions.