US2009146101A1PendingUtilityA1
Etchant for metal alloy having hafnium and molybdenum
Est. expiryDec 7, 2027(~1.4 yrs left)· nominal 20-yr term from priority
H10P 50/667C23F 1/26
51
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
An etchant for etching a metal alloy having hafnium and molybdenum includes 20 to 80 percent by weight of nitric acid, 1 to 49 percent by weight of hydrofluoric acid, 1 to 96 percent by weight of sulfuric acid, and 1 to 30 percent by weight of water, based on the total weight of the etchant.
Claims
exact text as granted — not AI-modified1 . An etchant used for etching a metal alloy material having hafnium and molybdenum, the etchant comprising at least nitric acid, hydrofluoric acid and sulfuric acid.
2 . The etchant as claimed in claim 1 , wherein the etchant comprises 20-80 percent by weight of nitric acid.
3 . The etchant as claimed in claim 2 , wherein the etchant comprises 1-49 percent by weight of hydrofluoric acid.
4 . The etchant as claimed in claim 3 , wherein the etchant comprises 1-96 percent by weight of sulfuric acid.
5 . The etchant as claimed in claim 4 , wherein the metal alloy material having hafnium and molybdenum is hafnium-molybdenum alloy nitride.
6 . The etchant as claimed in claim 1 , wherein the metal alloy material having hafnium and molybdenum is hafnium-molybdenum alloy nitride.
7 . An etchant used for etching a hafnium-molybdenum alloy nitride, at least comprising:
nitric acid, 20-80 percent by weight; hydrofluoric acid, 1-49 percent by weight; sulfuric acid, 1-96 percent by weight; and water, 1-30 percent by weight.Join the waitlist — get patent alerts
Track US2009146101A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.