Method for forming a via in a substrate and substrate with a via

Abstract

The present invention relates to a method for forming a via in a substrate and a substrate with a via. The method for forming a via in a substrate includes the following steps: (a) providing a substrate having a first surface and a second surface; (b) forming a groove that has a side wall and a bottom wall on the first surface of the substrate; (c) forming a first conductive metal on the side wall and the bottom wall of the groove so as to form a central groove; (d) forming a center insulating material in the central groove; (e) forming an annular groove that surrounds the first conductive metal on the first surface of the substrate; (f) forming a first insulating material in the annular groove; and (g) removing part of the second surface of the substrate to expose the first conductive metal, the center insulating material and the first insulating material. As a result, thicker insulating material can be formed in the via, and the thickness of the insulating material in the via is even.

1 . A method for forming a via in a substrate, comprising:
 (a) providing a substrate having a first surface and a second surface;   (b) forming a groove that has a side wall and a bottom wall on the first surface of the substrate;   (c) forming a first conductive metal on the side wall and the bottom wall of the groove so as to form a central groove;   (d) forming a center insulating material in the central groove;   (e) forming an annular groove that surrounds the first conductive metal on the first surface of the substrate;   (f) forming a first insulating material in the annular groove; and   (g) removing part of the second surface of the substrate to expose the first conductive metal, the center insulating material and the first insulating material.   
   
   
       2 . The method as claimed in  claim 1 , wherein Step (b) comprises:
 (b1) forming a first photo resist layer on the first surface of the substrate;   (b2) forming a first opening on the first photo resist layer; and   (b3) forming the groove on the substrate according to the first opening.   
   
   
       3 . The method as claimed in  claim 1 , wherein Step (d) comprises:
 (d1) dispersing a polymer at a position corresponding to the central groove; and   (d2) impelling the polymer into the central groove by vacuuming so as to form the center insulating material.   
   
   
       4 . The method as claimed in  claim 1 , wherein Step (d) comprises:
 (d1) forming a plurality of first vents so as to connect the central groove to the second surface of the substrate;   (d2) dispersing a polymer at a position corresponding to the central groove; and   (d3) filling the central groove and the first vents with the polymer so as to form the center insulating material.   
   
   
       5 . The method as claimed in  claim 1 , wherein Step (e) comprises:
 (e1) forming a second photo resist layer on the first surface of the substrate;   (e2) forming a second opening on the second photo resist layer so that the position of the second opening corresponds to the groove, and the diameter of the second opening is larger than that of the groove; and   (e3) forming the annular groove on the substrate according to the second opening.   
   
   
       6 . The method as claimed in  claim 1 , wherein in Step (e), the annular groove does not penetrate the substrate. 
   
   
       7 . The method as claimed in  claim 1 , wherein Step (f) comprises:
 (f1) dispersing a polymer at a position corresponding to the annular groove; and   (f2) impelling the polymer into the annular groove by vacuuming so as to form the first insulating material.   
   
   
       8 . The method as claimed in  claim 1 , wherein Step (f) comprises:
 (f1) forming a plurality of second vents so as to connect the annular groove to the second surface of the substrate;   (f2) dispersing a polymer at a position corresponding to the annular groove; and   (d3) filling the annular groove and the second vents with the polymer so as to form the first insulating material.   
   
   
       9 . A method for forming a via in a substrate, comprising:
 (a) providing a substrate having a first surface and a second surface;   (b) forming an annular groove and a pillar on the first surface of the substrate so that the annular groove surrounds the pillar;   (c) forming a first insulating material in the annular groove;   (d) removing the pillar of the substrate so as to form a groove that has a side wall and a bottom wall on the substrate;   (e) forming a first conductive metal on the side wall and the bottom wall of the groove so as to form a central groove;   (f) forming a center insulating material in the central groove; and   (g) removing part of the second surface of the substrate to expose the first conductive metal, the first insulating material and the center insulating material.   
   
   
       10 . The method as claimed in  claim 9 , wherein Step (b) comprises:
 (b1) forming a first photo resist layer on the first surface of the substrate;   (b2) forming a first pattern on the first photo resist layer; and   (b3) forming the annular groove and the pillar on the substrate according to the first pattern.   
   
   
       11 . The method as claimed in  claim 9 , wherein Step (c) comprises:
 (c1) dispersing a polymer at a position corresponding to the annular groove;   (c2) impelling the polymer into the annular groove by vacuuming so as to form the first insulating material; and   (c3) removing the polymer which is outside the annular groove.   
   
   
       12 . The method as claimed in  claim 9 , wherein Step (c) comprises:
 (c1) forming a plurality of first vents so as to connect the annular groove to the second surface of the substrate;   (c2) dispersing a polymer at a position corresponding to the annular groove;   (c3) filling the annular groove and the first vents with the polymer so as to form the first insulating material; and   (c4) removing the polymer which is outside the annular groove and the first vents.   
   
   
       13 . The method as claimed in  claim 9 , wherein Step (c) comprises:
 (c1) atomizing and depositing a polymer in the annular groove by spray coating so as to form the first insulating material; and   (c2) removing the polymer which is outside the annular groove.   
   
   
       14 . The method as claimed in  claim 9 , wherein Step (d) comprises:
 (d1) forming a second photo resist layer on the first surface of the substrate;   (d2) forming a second opening on the second photo resist layer so that the position of the second opening corresponds to the pillar; and   (d3) removing the pillar according to the second opening so as to form the groove.   
   
   
       15 . The method as claimed in  claim 9 , wherein Step (f) comprises:
 (f1) dispersing a polymer at a position corresponding to the central groove; and   (f2) impelling the polymer into the central groove by vacuuming so as to form the center insulating material.   
   
   
       16 . The method as claimed in  claim 9 , wherein Step (f) comprises:
 (f1) forming a plurality of second vents so as to connect the central groove to the second surface of the substrate;   (f2) dispersing a polymer at a position corresponding to the central groove; and   (f3) filling the central groove and the second vents with the polymer so as to form the center insulating material.   
   
   
       17 . A substrate with a via, comprising:
 a substrate, having a first surface, a second surface and a via that penetrates the substrate and has an inner side wall;   a first insulating material, which is a hollow pillar, disposed on the inner side wall of the via;   a center insulating material disposed at the center of the via, and the center insulating material is a solid pillar spaced from the first insulating material; and   a first conductive metal, disposed between the first insulating material and the center insulating material, and the first conductive metal surrounds the center insulating material so as to form a hollow pillar.   
   
   
       18 . The substrate as claimed in  claim 17 , wherein the first insulating material contacts the first conductive metal, and the center insulating material contacts the first conductive metal. 
   
   
       19 . The substrate as claimed in  claim 17 , further comprising a second insulating material and a second conductive metal, disposed between the first conductive metal and the first insulating material, so that the second insulating material surrounds the first conductive metal, and the second conductive metal surrounds the second insulating material. 
   
   
       20 . The substrate as claimed in  claim 19 , wherein the second insulating material contacts the first conductive metal, the second conductive metal contacts the second insulating material, and the second conductive metal contacts the first insulating material. 
   
   
       21 . The substrate as claimed in  claim 17 , further comprising a passivation layer and a conducting layer, and the passivation layer is disposed on the first surface or the second surface of the substrate, and has an opening, so as to cover part of the first insulating material and expose part of the first insulating material, and the conducting layer is disposed on the passivation layer, and covers part of the first insulating material, the first conductive metal and the center insulating material. 
   
   
       22 . A substrate with a via, comprising:
 a substrate, having a first surface, a second surface and a via that penetrates the substrate and has an inner side wall;   a first insulating material, disposed in the via, and attached to the inner side wall of the via; and   a plurality of grooves, disposed in the first insulating material, so that each of the grooves penetrates the first insulating material, and comprises a third insulating material and a third conductive metal, and the third insulating material is a solid pillar disposed at the center of the grooves, and the third conductive metal surrounds the third insulating material.   
   
   
       23 . The substrate as claimed in  claim 22 , wherein the third conductive metal contacts the third insulating material, and the third conductive metal contacts the first insulating material. 
   
   
       24 . The substrate as claimed in  claim 22 , further comprising a passivation layer and a conducting layer, and the passivation layer is disposed on the first surface or the second surface of the substrate, and has a plurality of openings; the position of each of the openings of the passivation layer corresponds to each of the grooves, the diameter of each of the openings of the passivation layer is larger than that of each of the grooves, so that the passivation layer covers part of the first insulating material and exposes part of the first insulating material; the conducting layer is disposed on the passivation layer, and covers part of the first insulating material, the third conductive metal and the third insulating material.