EFAB Methods and Apparatus Including Spray Metal or Powder Coating Processes

Abstract

Various embodiments of the invention present techniques for forming structures via a combined electrochemical fabrication process and a thermal spraying process or powder deposition processes. In a first set of embodiments, selective deposition occurs via masking processes (e.g. a contact masking process or adhered mask process) and thermal spraying or powder deposition is used in blanket deposition processes to fill in voids left by selective deposition processes. In a second set of embodiments, after selective deposition of a first material, a second material is blanket deposited to fill in the voids, the two depositions are planarized to a common level and then a portion of the first or second materials is removed (e.g. by etching) and a third material is sprayed into the voids left by the etching operation. In both embodiments the resulting depositions are planarized to a desired layer thickness in preparation for adding additional layers.

1 . A process for forming a multilayer three-dimensional structure, comprising:
 (a) forming and adhering a layer of material to a previously formed layer or to a substrate;   (b) repeating the forming and adhering operation of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;   wherein the formation of at least a plurality of layers, comprises:
 (1) obtaining a selective pattern of deposition of a first material having voids, comprising at least one of:
 (a) selectively depositing a first material onto a substrate or previously formed layer such that voids remain; or 
 (b) depositing a first material onto a substrate or previously formed layer and selectively etching the deposit of the first material to form voids therein; and 
 
 (2) depositing a second material into the voids; 
 (3) etching the deposit of the first material or second material to form second voids; and 
 (4) depositing a third material into the second voids via a thermal spraying process. 
   
   
   
       2 . The process of  claim 1  wherein the formation of the plurality of layers additionally comprises at least two planarization operations on each of at least a portion of the plurality of layers. 
   
   
       3 . The process of  claim 1  wherein the formation of the plurality of layers additionally comprises at least one planarization operation on each of at least a portion of the plurality of layers. 
   
   
       4 . The process of  claim 1  wherein the thermal spraying process comprises at least one of: (1) an arc wire spraying process, (2) a high velocity oxygen-fuel (HVOF) spraying process, (3) a plasma spraying process, (4) a plasma transferred arc (PTA) spraying process, (5) a vacuum or low pressure plasma spraying process, (6) a low velocity oxygen-fuel (LVOF) spraying process, (7) a detonation thermal spraying process, (8) a high velocity particle consolidation (HVPC) spraying process, (9) a wire spraying process, or (10) an ion plating process. 
   
   
       5 . The process of  claim 1  wherein after depositing via a thermal spraying process an infiltration process is used to fill any surface voids with a fourth material. 
   
   
       6 . The process of  claim 1  wherein after depositing via a thermal spraying process, at least one subsequent operation is used wherein modification of the third material occurs or wherein adhesion between the third material deposited in association with one layer and material deposited in association with another layer is enhanced. 
   
   
       7 . A process for forming a multilayer three-dimensional structure, comprising:
 (a) forming and adhering a layer of material to a previously formed layer or to a substrate;   (b) repeating the forming and adhering operation of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;   wherein the formation of at least a plurality of layers, comprises:
 (1) obtaining a selective pattern of deposition of a first material having voids, comprising at least one of:
 (a) selectively depositing a first material onto a substrate or previously formed layer such that voids remain; or 
 (b) depositing a first material onto a substrate or previously formed layer and selectively etching the deposit of the first material to form voids therein; and 
 
 (2) depositing a second material into the voids wherein the second material prior to deposition comprises a powder. 
   
   
   
       8 . The process of  claim 7  wherein the formation of the plurality of layers additionally comprises at least one planarization operation on each of at least a portion of the plurality of layers. 
   
   
       9 . The process of  claim 7  wherein the material comprising the powder, further comprises at least one of (1) at least two powders of different materials, (2) at least two powders with different particle size distributions, (3) a liquid carrier for the powder, (4) a transformable binder that can be used to bind the powder particles, or (5) a liquid carrier that can be transformed by radiation, heat, pressure, or chemical means to bind the powder particles. 
   
   
       10 . The process of  claim 7  wherein after depositing the powder an infiltration process is used to fill any surface voids with a third material. 
   
   
       11 . The process of  claim 7  wherein after depositing the powder, at least one subsequent operation is used wherein modification of the second material occurs or wherein adhesion between the second material deposited in association with one layer and material deposited in association with another layer is enhanced. 
   
   
       12 . A process for forming a multilayer three-dimensional structure, comprising:
 (a) forming and adhering a layer of material to a previously formed layer or to a substrate;   (b) repeating the forming and adhering operation of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;   wherein the formation of at least a plurality of layers, comprise:
 (1) obtaining a selective pattern of deposition of a first material having voids, comprising at least one of:
 (a) selectively depositing a first material onto a substrate or previously formed layer such that voids remain; or 
 (b) depositing a first material onto a substrate or previously formed layer and selectively etching the deposit of the first material to form voids therein; and 
 
 (2) depositing a second material into the voids; 
 (3) etching the deposit of the first material or second material to form second voids; and 
 (4) depositing a third material into the second voids, wherein the third material prior to deposition comprises a powder. 
   
   
   
       13 . The process of  claim 12  wherein the formation of the plurality of layers additionally comprises at least two planarization operations on each of at least a portion of the plurality of layers. 
   
   
       14 . The process of  claim 12  wherein the formation of the plurality of layers additionally comprises at least one planarization operation on each of at least a portion of the plurality of layers. 
   
   
       15 . The process of  claim 12  wherein the material comprising the powder, further comprises at least one of (1) at least two powders of different materials, (2) at least two powders with different particle size distributions, (3) a liquid carrier for the powder, (4) a transformable binder that can be used to bind the powder particles, or (5) a liquid carrier that can be transformed by radiation, heat, pressure, or chemical means to bind the powder particles. 
   
   
       16 . The process of  claim 12  wherein after depositing the powder an infiltration process is used to fill any surface voids with a third material. 
   
   
       17 . The process of  claim 12  wherein after depositing the powder, at least one subsequent operation is used wherein modification of the second material occurs or wherein adhesion between the second material deposited in association with one layer and material deposited in association with another.