Two phase micro-channel heat sink
Abstract
A method and system for providing a heat sink are described. The heat sink includes at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect channel. The plurality of flow micro-channels are defined by a plurality of channels walls, connect the inlet(s) with the outlet(s) and accommodate a flow of coolant between the at least one inlet and the at least one outlet. The at least one cross-connect channel is configured to connect at least a portion of the plurality of flow micro-channels. The cross-connect channel(s) also at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.
Claims
exact text as granted — not AI-modified1 . A heat sink comprising:
at least one inlet; at least one outlet; a plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of coolant between the at least one inlet and the at least one outlet; and at least one cross-connect channel, each of the at least one cross-connect channel configured to connect at least a portion of the plurality of flow micro-channels and at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.
2 . The heat sink of claim 1 further comprising at least one reservoir coupled with at least one of the plurality of flow micro-channels.
3 . The heat sink of claim 1 wherein the plurality of channel walls correspond to at least one height and wherein the at least one cross-connect channel has at least one depth that is less than the height.
4 . The heat sink of claim 3 wherein the plurality of channel walls include a plurality of depressions, the plurality of depressions having the at least one depth and corresponding to the at least one cross-connect channel.
5 . The heat sink of claim 1 wherein the plurality of channel walls correspond to at least one height and wherein the at least one cross-connect has a depth that is substantially the same as the height.
6 . The heat sink of claim 1 wherein the portion of the plurality of flow micro-channels includes each of the plurality of flow micro-channels.
7 . The heat sink of claim 1 wherein the at least one cross-connect channel includes a plurality of cross-connect micro-channels.
8 . The heat sink of claim 7 wherein the plurality of cross-connect micro-channels are at regular intervals between the at least one inlet and the at least one outlet.
9 . The heat sink of claim 7 wherein the plurality of cross-connect micro-channels are non-uniformly spaced between the at least one inlet and the at least one outlet.
10 . The heat sink of claim 1 wherein the plurality of flow micro-channels are parallel.
11 . The heat sink of claim 1 wherein only a first portion of the plurality of flow micro-channels are parallel.
12 . The heat sink of claim 1 wherein a first portion of the plurality of flow micro-channels are non-parallel.
13 . The heat sink of claim 1 wherein the at least one cross-connect channel extends substantially between the at least one inlet and the at least one outlet and wherein the portion of the plurality of flow micro-channels includes each of the plurality of flow micro-channels.
14 . The heat sink of claim 1 wherein the plurality of flow micro-channels are substantially symmetric.
15 . The heat sink of claim 1 wherein the plurality of channels walls are substantially vertical.
16 . The heat sink of claim 1 wherein the plurality of channel walls include a plurality of apertures therein, the plurality of apertures forming at least a portion of the at least one cross-connect channel.
17 . The heat sink of claim 1 further comprising:
a plate coupled to the plurality of channels walls, the plurality of flow micro-channels and the at least one cross-connect channel residing between the plurality of channel walls and the plate.
18 . The heat sink of claim 17 wherein the at least one cross-connect channel extends substantially between the at least one inlet and the at least one outlet and between the plurality of channel walls and the plate.
19 . The heat sink of claim 1 wherein each of the plurality of flow micro-channels has a width not greater than one thousand micrometers.
20 . The heat sink of claim 1 wherein the plurality of flow micro-channels has a plurality of widths.
21 . The heat sink of claim 1 wherein each of at least a first portion of the plurality of flow micro-channels has a varying width.
22 . The heat sink of claim 1 wherein the at least one cross-connect channel includes a plurality of cross-connect micro-channels having a plurality of widths.
23 . The heat sink of claim 1 wherein each of at least a first portion of the plurality of cross-connect channels has a varying width.
24 . A heat sink comprising:
at least one inlet; at least one outlet; a plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of boiling coolant between the at least one inlet and the at least one outlet; and a plurality of cross-connect micro-channels, each of the at plurality of cross-connect micro-channels configured to connect at least a portion of the plurality of flow micro-channels and extending substantially perpendicular to a flow direction in the portion of the plurality of flow micro-channels, the plurality of cross-connect micro-channels for providing a uniform pressure distribution field for the coolant across the portion of the plurality of flow micro-channels and residing at regular intervals between the at least one inlet and the at least one outlet.
25 . An electronic device comprising:
at least one heat-dissipating device; and a heat sink thermally coupled with the heat-dissipating device, the heat sink including at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect channel, the plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of coolant between the at least one inlet and the at least one outlet, the at least one cross-connect channel configured to connect at least a portion of the plurality of flow micro-channels and at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.
26 . A method for providing a heat sink comprising:
at least one inlet; at least one outlet; a plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of coolant between the at least one inlet and the at least one outlet; and at least one cross-connect channel, each of the at least one cross-connect channel configured to connect at least a portion of the plurality of flow micro-channels and at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.
27 . A method for dissipating heat of at least one electronic device comprising:
thermally coupling a heat sink to the at least one electronic device, the heat sink including at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect channel, the plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of coolant between the at least one inlet and the at least one outlet, the at least one cross-connect channel configured to connect at least a portion of the plurality of flow micro-channels and at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.Join the waitlist — get patent alerts
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