US2009139693A1PendingUtilityA1

Two phase micro-channel heat sink

Assignee: UNIV HAWAIIPriority: Nov 30, 2007Filed: Nov 21, 2008Published: Jun 4, 2009
Est. expiryNov 30, 2027(~1.3 yrs left)· nominal 20-yr term from priority
Inventors:Weilin Qu
H10W 40/73F28F 3/048
42
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Claims

Abstract

A method and system for providing a heat sink are described. The heat sink includes at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect channel. The plurality of flow micro-channels are defined by a plurality of channels walls, connect the inlet(s) with the outlet(s) and accommodate a flow of coolant between the at least one inlet and the at least one outlet. The at least one cross-connect channel is configured to connect at least a portion of the plurality of flow micro-channels. The cross-connect channel(s) also at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.

Claims

exact text as granted — not AI-modified
1 . A heat sink comprising:
 at least one inlet;   at least one outlet;   a plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of coolant between the at least one inlet and the at least one outlet; and   at least one cross-connect channel, each of the at least one cross-connect channel configured to connect at least a portion of the plurality of flow micro-channels and at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.   
   
   
       2 . The heat sink of  claim 1  further comprising at least one reservoir coupled with at least one of the plurality of flow micro-channels. 
   
   
       3 . The heat sink of  claim 1  wherein the plurality of channel walls correspond to at least one height and wherein the at least one cross-connect channel has at least one depth that is less than the height. 
   
   
       4 . The heat sink of  claim 3  wherein the plurality of channel walls include a plurality of depressions, the plurality of depressions having the at least one depth and corresponding to the at least one cross-connect channel. 
   
   
       5 . The heat sink of  claim 1  wherein the plurality of channel walls correspond to at least one height and wherein the at least one cross-connect has a depth that is substantially the same as the height. 
   
   
       6 . The heat sink of  claim 1  wherein the portion of the plurality of flow micro-channels includes each of the plurality of flow micro-channels. 
   
   
       7 . The heat sink of  claim 1  wherein the at least one cross-connect channel includes a plurality of cross-connect micro-channels. 
   
   
       8 . The heat sink of  claim 7  wherein the plurality of cross-connect micro-channels are at regular intervals between the at least one inlet and the at least one outlet. 
   
   
       9 . The heat sink of  claim 7  wherein the plurality of cross-connect micro-channels are non-uniformly spaced between the at least one inlet and the at least one outlet. 
   
   
       10 . The heat sink of  claim 1  wherein the plurality of flow micro-channels are parallel. 
   
   
       11 . The heat sink of  claim 1  wherein only a first portion of the plurality of flow micro-channels are parallel. 
   
   
       12 . The heat sink of  claim 1  wherein a first portion of the plurality of flow micro-channels are non-parallel. 
   
   
       13 . The heat sink of  claim 1  wherein the at least one cross-connect channel extends substantially between the at least one inlet and the at least one outlet and wherein the portion of the plurality of flow micro-channels includes each of the plurality of flow micro-channels. 
   
   
       14 . The heat sink of  claim 1  wherein the plurality of flow micro-channels are substantially symmetric. 
   
   
       15 . The heat sink of  claim 1  wherein the plurality of channels walls are substantially vertical. 
   
   
       16 . The heat sink of  claim 1  wherein the plurality of channel walls include a plurality of apertures therein, the plurality of apertures forming at least a portion of the at least one cross-connect channel. 
   
   
       17 . The heat sink of  claim 1  further comprising:
 a plate coupled to the plurality of channels walls, the plurality of flow micro-channels and the at least one cross-connect channel residing between the plurality of channel walls and the plate.   
   
   
       18 . The heat sink of  claim 17  wherein the at least one cross-connect channel extends substantially between the at least one inlet and the at least one outlet and between the plurality of channel walls and the plate. 
   
   
       19 . The heat sink of  claim 1  wherein each of the plurality of flow micro-channels has a width not greater than one thousand micrometers. 
   
   
       20 . The heat sink of  claim 1  wherein the plurality of flow micro-channels has a plurality of widths. 
   
   
       21 . The heat sink of  claim 1  wherein each of at least a first portion of the plurality of flow micro-channels has a varying width. 
   
   
       22 . The heat sink of  claim 1  wherein the at least one cross-connect channel includes a plurality of cross-connect micro-channels having a plurality of widths. 
   
   
       23 . The heat sink of  claim 1  wherein each of at least a first portion of the plurality of cross-connect channels has a varying width. 
   
   
       24 . A heat sink comprising:
 at least one inlet;   at least one outlet;   a plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of boiling coolant between the at least one inlet and the at least one outlet; and   a plurality of cross-connect micro-channels, each of the at plurality of cross-connect micro-channels configured to connect at least a portion of the plurality of flow micro-channels and extending substantially perpendicular to a flow direction in the portion of the plurality of flow micro-channels, the plurality of cross-connect micro-channels for providing a uniform pressure distribution field for the coolant across the portion of the plurality of flow micro-channels and residing at regular intervals between the at least one inlet and the at least one outlet.   
   
   
       25 . An electronic device comprising:
 at least one heat-dissipating device; and   a heat sink thermally coupled with the heat-dissipating device, the heat sink including at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect channel, the plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of coolant between the at least one inlet and the at least one outlet, the at least one cross-connect channel configured to connect at least a portion of the plurality of flow micro-channels and at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.   
   
   
       26 . A method for providing a heat sink comprising:
 at least one inlet;   at least one outlet;   a plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of coolant between the at least one inlet and the at least one outlet; and   at least one cross-connect channel, each of the at least one cross-connect channel configured to connect at least a portion of the plurality of flow micro-channels and at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.   
   
   
       27 . A method for dissipating heat of at least one electronic device comprising:
 thermally coupling a heat sink to the at least one electronic device, the heat sink including at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect channel, the plurality of flow micro-channels defined by a plurality of channels walls, the plurality of flow micro-channels connecting the at least one inlet with the at least one outlet and accommodating a flow of coolant between the at least one inlet and the at least one outlet, the at least one cross-connect channel configured to connect at least a portion of the plurality of flow micro-channels and at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels.

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