Apparatuses and methods for cleaning test probes

Abstract

Apparatuses and methods for cleaning test probes used in a semiconductor testing machine of the type having a plurality of test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon. In one embodiment, the apparatus includes a roller-support arm and a cylindrical roller supported by the roller-support arm. The roller has an outer surface comprising a sticky material. Debris on the probes will adhere to the sticky material as roller is rolled across tips of the probes. The probes are thereby cleaned.

1 - 18 . (canceled) 
   
   
       19 . An apparatus for cleaning tips of probes used for testing dies of a semiconductor wafer, comprising:
 a roller having a sticky outer surface; and   an arm for supporting the roller and for engaging the roller against the tips of the probes,   wherein debris adhering to the tips of the probes is transferred to the sticky outer surface of the roller as it is rolled along the tips of the probes.   
   
   
       20 . An apparatus for cleaning tips of probes used for testing dies of a semiconductor wafer, comprising:
 a roller having an electrostatic outer surface; and   an arm for supporting the roller and for engaging the roller against the tips of the probes,   wherein debris adhering to the tips of the probes is transferred to the electrostatic outer surface of the roller as it is rolled along the tips of the probes.   
   
   
       21 . An apparatus for cleaning tips of probes used for testing dies of a semiconductor wafer, comprising:
 a roller having an outer surface including micro-pores, said micro-pores containing a cleaning agent; and   an arm for supporting the roller and for engaging the roller against the tips of the probes,   wherein the tips of the probes are cleaned by said cleaning agent as the outer surface of the roller is rolled along the tips of the probes.   
   
   
       22 - 33 . (canceled) 
   
   
       34 . An apparatus for cleaning tips of probes used for testing dies of a semiconductor wafer, comprising:
 a roller having an outer surface; and   an arm for supporting the roller and for engaging the roller against the tips of the probes,   wherein the tips of the probes are cleaned when the outer surface of the roller as is rolled along the tips of the probes.   
   
   
       35 . (canceled) 
   
   
       36 . An apparatus for cleaning tips of probes used for testing dies of a semiconductor wafer, comprising:
 first and second rollers for supporting a sheet of material there-between, wherein the sheet of material has a sticky outer surface; and   a maneuvering mechanism to maneuver the first and second rollers such that the sticky outer surface faces the tips of the probes,   whereby debris is transferred from the tips of the probes to the sticky surface of the sheet of material when the maneuvering mechanism moves the sheet of material toward and against the tips of the probes, and   whereby a previously unexposed portion of the sheet of material is rolled from one of the first and second rollers when a previously exposed portion of the sheet of material is rolled about the other one of the first and second rollers.   
   
   
       37 - 38 . (canceled)