Diagnostic Methods During CMP Pad Dressing and Associated Systems

Abstract

A system for in-situ monitoring at least one aspect of a chemical mechanical planarization process can include a CMP pad, CMP pad dresser with at least a translucent portion, and an optical sensor. The optical sensor can be configured to optically engage the CMP pad through the translucent portion of the CMP pad dresser. Methods of monitoring chemical mechanical planarization processes can include using such CMP pad dresser to view a performance characteristic through the CMP pad dresser.

1 . A system for in-situ monitoring at least one aspect of a chemical mechanical planarization process, comprising:
 a CMP pad;   a CMP pad dresser having at least a translucent portion; and   an optical sensor configured to optically engage the CMP pad through the translucent portion of the CMP pad dresser.   
   
   
       2 . The system of  claim 1 , wherein the CMP pad dresser is substantially translucent. 
   
   
       3 . The system of  claim 1 , wherein the CMP pad dresser is solid. 
   
   
       4 . The system of  claim 1 , wherein the CMP pad dresser comprises solidified organic material. 
   
   
       5 . The system of  claim 1 , wherein the optical sensor is configured to sense slurry patterns when the CMP pad dresser is engaged with the CMP pad and at least one of the CMP pad or the CMP pad dresser is rotating. 
   
   
       6 . The system of  claim 1 , wherein the optical sensor is configured to sense slough patterns when the CMP pad dresser is engaged with the CMP pad and at least one of the CMP pad or the CMP pad dresser is rotating. 
   
   
       7 . The system of  claim 1 , wherein the system is configured to monitor a performance aspect of the CMP pad. 
   
   
       8 . The system of  claim 1 , wherein the system is configured to monitor a performance aspect of the CMP pad dresser. 
   
   
       9 . The system of  claim 1 , wherein the optical sensor is configured to relay data to a controller. 
   
   
       10 . The system of  claim 1 , wherein the optical sensor is selected from the group comprising IR sensors, pulsating light sensors, laser sensors, fiber optic sensors, and combinations thereof. 
   
   
       11 . The system of  claim 1 , comprising a plurality of optical sensors configured to optically engage the CMP pad through the CMP pad dresser. 
   
   
       12 . A method of in-situ monitoring of at least one aspect of a chemical mechanical planarization process, comprising:
 dressing a CMP pad with a CMP pad dresser, said CMP pad dresser having at least a translucent portion; and   viewing a performance characteristic of the chemical mechanical planarization through the CMP pad dresser.   
   
   
       13 . The method of  claim 12 , further comprising adjusting an operating parameter during chemical mechanical planarization in response to the viewed performance characteristic. 
   
   
       14 . The method of  claim 13 , wherein the adjusting is automated. 
   
   
       15 . The method of  claim 12 , wherein the performance characteristic is a physical characteristic of the CMP pad. 
   
   
       16 . The method of  claim 15 , wherein the performance characteristic of the CMP pad is selected from presence of particles imbedded in the CMP pad, retention of imbedded particles in the CMP pad, wear condition of imbedded particles in the CMP pad, wear condition of the CMP pad overall, exhaustion of CMP pad, and combinations thereof. 
   
   
       17 . The method of  claim 16 , wherein the performance characteristic is retention of imbedded particles in the CMP pad. 
   
   
       18 . The method of  claim 12 , wherein the performance characteristic is a physical characteristic of the CMP pad dresser. 
   
   
       19 . The method of  claim 17 , wherein the performance characteristic of the CMP pad dresser is selected from presence of particles imbedded in the CMP pad dresser, retention of imbedded particles in the CMP pad dresser, wear condition of imbedded particles in the CMP pad dresser, wear condition of the CMP pad dresser overall, exhaustion of CMP pad dresser, and combinations thereof. 
   
   
       20 . The method of  claim 19 , wherein the performance characteristic is wear condition of imbedded particles in the CMP pad dresser.