Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same

Abstract

A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.

1 . An integrated piping plate composed of two or more plates joined together, each plate having a back surface and an opposite joining surface, and in which
 an instrument and a component constituting an apparatus are disposed, or the instrument is disposed, or the component is disposed, on one of surfaces of the integrated piping plate,   grooves for serving as channels for fluids are formed in the joining surfaces of the plates, and   the instrument and the component are connected, or the instrument is connected, or the component is connected, by the grooves,   wherein a plurality of the integrated piping plates are provided, and the plurality of the integrated piping plates are integrally fixed, with the back surfaces of the plurality of the integrated piping plates being superposed, to constitute a three-dimensional module,   the instrument and the component constituting the apparatus are interposed, or the instrument is interposed, or the component is interposed, between the back surfaces of the plurality of the integrated piping plates, and   a heat insulator is interposed between the back surfaces of the plurality of the integrated piping plates and the instrument and the component, or the instrument, or the component interposed between the back surfaces.