Polyimide film for metallizing, and metal-laminated polyimide film

Abstract

Disclosed is a polyimide film for metallizing, which has a polyimide layer (a) containing a surface treatment agent on one side or both sides of a polyimide layer (b). A metal layer may be directly formed on the surface of the polyimide film by a metallizing method, thereby providing a metal-laminated polyimide film with excellent adhesiveness.

1 . A polyimide film for metallizing, having a polymide layer (a) on one side or both sides of a polyimide layer (b),
 wherein the polyimide layer (a) contains a surface treatment agent.   
   
   
       2 . A polyimide film for metallizing, having a polyimide layer (a) on one side or both sides of a polyimide layer (b),
 wherein the polyimide layer (a) is subjected to a heat treatment at the highest heating temperature of from 350° C. to 600° C. in a state in which it contains a surface treatment agent.   
   
   
       3 . A polyimide film for metallizing, obtained by
 coating a self-supporting film of a polyimide precursor solution (b) to give a polyimide layer (b) with a polyimide precursor solution (a) containing a surface treatment agent to give a polyimide layer (a); and   heating the self-supporting film of the polyimide precursor solution (b) coated with the polyimide precursor solution (a) containing a surface treatment agent at the highest heating temperature of from 350° C. to 600° C.   
   
   
       4 . The polyimide film for metallizing as claimed in  claim 1 , wherein the polyimide layer (a) has a thickness of from 0.05 to 1 μm. 
   
   
       5 . The polyimide film for metallizing as claimed in  claim 1 , wherein the surface treatment agent is a component selected from the group consisting of an aminosilane compound and an epoxysilane compound. 
   
   
       6 . The polyimide film for metallizing as claimed in  claim 1 , wherein the polyimide layer (b) and the polyimide layer (a) are polyimides obtained from
 1) an acid component comprising at least one component selected from the group consisting of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, pyromellitic dianhydride, and 1,4-hydroquinone dibenzoate-3,3′,4,4′-tetracarboxylic dianhydride, and   2) a diamine component comprising at least one component selected from the group consisting of p-phenylenediamine, 4,4-diaminodiphenyl ether, o-tolidine, m-tolidine, and 4,4′ diaminobenzanilide.   
   
   
       7 . The polyimide film for metallizing as claimed in  claim 1 , wherein the polyimide layer (a) is a polyimide obtained from
 1) an acid component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and   2) a diamine component comprising at least one component selected from p-phenylenediamine and 4,4-diaminodiphenyl ether.   
   
   
       8 . A metal-laminated polyimide film, comprising a polyimide film for metallizing as claimed in  claim 1 ,
 wherein a metal layer is formed on the surface of the polyimide layer (a) of the polymide film for metallizing by a metallizing method.   
   
   
       9 . The metal-laminated polyimide film as claimed in  claim 8 , wherein the depth of a metal wiring buried in the polyimide film is 0.4 mm or less, and the metal-laminated polyimide film has a normal-state 90° peel strength of 0.08 N/mm or higher. 
   
   
       10 . A metal plating laminated polyimide film, comprising the metal-laminated polyimide film as claimed  claim 8 ,
 wherein a metal-plated layer is formed on the metal layer of the metal-laminated polyimide film by a metal plating method.