Heat dissipation module and base and manufacturing method thereof

Abstract

The present invention provides a heat dissipation module, a base thereof and a manufacturing method thereof. The heat dissipation module includes the base having a bottom, a plurality of guiding columns and a plurality of fins. The bottom and the guiding columns are formed as a single piece, and the fins are tightly fitted on the guiding columns.

1 . A heat dissipation module, comprising:
 a base comprising a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece; and   at least one fin tightly fitted with the guiding column.   
   
   
       2 . The heat dissipation module as claimed in  claim 1 , wherein the bottom and the guiding column are formed by extrusion and crosscutting. 
   
   
       3 . The heat dissipation module as claimed in  claim 1 , wherein the guiding column has a cross section with a rectangular or polygonal shape. 
   
   
       4 . The heat dissipation module as claimed in  claim 1 , wherein the guiding column comprises a guiding angle located on a top of the guiding column. 
   
   
       5 . The heat dissipation module as claimed in  claim 1 , wherein the fin comprises aluminum, copper or other high thermo-conductive materials, and the fin is formed by punching or extrusion. 
   
   
       6 . The heat dissipation module as claimed in  claim 1 , wherein when the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other, and/or the fins are stacked on the bottom of the base in parallel. 
   
   
       7 . The heat dissipation module as claimed in  claim 1 , wherein the fin comprises at least one through hole for allowing the guiding column to be penetrated and mounted thereon. 
   
   
       8 . The heat dissipation module as claimed in  claim 7 , wherein a protrusion is formed on a periphery of each through hole for increasing contact areas between the fin and the guiding column. 
   
   
       9 . The heat dissipation module as claimed in  claim 8 , wherein when the fin is plural and an upper fin is stacked on a lower adjacent fin, a distance between the lower fin and the upper fin is greater than or equal to a height of the protrusion of the lower fin. 
   
   
       10 . The heat dissipation module as claimed in  claim 1 , wherein when the fin is plural, the sum of a height of the stacked fins is less than or equal to a height of the guiding column. 
   
   
       11 . The heat dissipation module as claimed in  claim 1 , wherein when the guiding column and the fin are plural, the heights of the some guiding columns are different, and the shapes of the some fins are different. 
   
   
       12 . A heat dissipating base, comprising:
 a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece.   
   
   
       13 . The heat dissipating base as claimed in  claim 12 , wherein the bottom and the guiding column are formed by extrusion and crosscutting, and the guiding column comprises a guiding angle located on a top of the guiding column. 
   
   
       14 . The heat dissipating base as claimed in  claim 12 , wherein the guiding column has a cross section with a rectangular or polygonal shape. 
   
   
       15 . A manufacturing method of a heat dissipation module, comprising steps of:
 integrally forming a base wherein the base comprises a bottom and at least one guiding column disposed on the bottom; and   tightly fitting at least one fin with the guiding column.   
   
   
       16 . The method as claimed in  claim 15 , wherein the bottom and the guiding column are formed by extrusion and further performing a crosscutting step to form the bottom and the guiding column. 
   
   
       17 . The method as claimed in  claim 15 , wherein a guiding angle is formed on a top of the guiding column of the base. 
   
   
       18 . The method as claimed in  claim 15 , wherein the fin comprises aluminum, copper or other high thermo-conductive materials, and the fin is formed by punching or extrusion. 
   
   
       19 . The method as claimed in  claim 15 , wherein when the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other, or the fins are stacked on the bottom of the base in parallel. 
   
   
       20 . The method as claimed in  claim 15 , wherein the fin comprises at least one through hole for allowing the guiding column to be penetrated and mounted thereon, and a protrusion is formed on a periphery of each through hole for increasing contact areas between the fin and the guiding column.