Mst device for attachment to surface with adhesive

Abstract

A micro-systems technology (MST) device for attachment to a surface with adhesive is provided. The MST device has a body, an array of fluid inlet apertures in the body, and an array of recesses interspersed with the array of inlet apertures to hold adhesive displaced from between the body and the surface when the MST device is attached with the adhesive such that the displaced adhesive does not block fluid flow within the inlet apertures.

1 . A micro-systems technology (MST) device for attachment to a surface with adhesive, the MST device comprising:
 a body;   an array of fluid inlet apertures in the body; and   an array of recesses interspersed with the array of inlet apertures to hold adhesive displaced from between the body and the surface when the MST device is attached with the adhesive such that the displaced adhesive does not block fluid flow within the inlet apertures.   
     
     
         2 . A micro-systems technology device according to  claim 1  wherein the array of inlet apertures is a series of open channels in the body. 
     
     
         3 . A micro-systems technology device according to  claim 2  wherein the array of recesses is an arrangement of pits in the body. 
     
     
         4 . A micro-systems technology device according to  claim 1  wherein the adhesive is a thermosetting adhesive that cures at a predetermined temperature. 
     
     
         5 . A micro-systems technology device according to  claim 1  configured as a printhead. 
     
     
         6 . A micro-systems technology device according to  claim 5  wherein the printhead comprises a printhead integrated circuit supported on a liquid crystal polymer surface, the liquid crystal polymer surface having said arrays of inlet apertures and recesses.