Semiconductor device

Abstract

A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

1 . A semiconductor device comprising:
 a substrate having a rectangular shape and at least an upper surface;   a semiconductor sensor chip having a diaphragm for detecting pressure variations based on displacement thereof, the semiconductor sensor chip being fixed onto the upper surface of the substrate;   a cover member covering the semiconductor sensor chip so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member;   resin sealing the substrate;   a plurality of chip connection leads partially exposed externally of the resin, the plurality of chip connection leads being electrically connected to the semiconductor sensor chip and are disposed in line along only one side of the semiconductor sensor chip; and   a plurality of packaging leads partially exposed externally of the resin, the plurality of packaging leads being positioned opposite the plurality of chip connection leads relative to the semiconductor sensor chip.   
   
   
       2 . A semiconductor device comprising:
 a substrate having a rectangular shape and at least an upper surface;   a semiconductor sensor chip having a diaphragm for detecting pressure variations based on displacement thereof, the semiconductor sensor chip being fixed onto the upper surface of the substrate;   a cover member covering the semiconductor sensor chip so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member;   resin sealing the substrate;   a plurality of chip connection leads partially exposed externally of the resin, the plurality of chip connection leads being electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and   a plurality of packaging leads partially exposed externally of the resin, the plurality of packaging leads being positioned opposite the plurality of chip connection leads relative to the semiconductor sensor chip and being aligned in a line.   
   
   
       3 . The semiconductor device according to  claim 2 , wherein at least one of the packaging leads is a ground lead. 
   
   
       4 . The semiconductor device according to  claim 2 , further comprising cover connection leads, wherein the cover member is fixed to the cover connection leads. 
   
   
       5 . The semiconductor device according to  claim 4 , wherein the substrate comprises a stage and wherein the cover connection leads are formed as part of the stage. 
   
   
       6 . The semiconductor device according to  claim 2 , wherein the substrate comprises a stage, the semiconductor device further comprising interconnection leads connecting the stage to the packaging leads. 
   
   
       7 . The semiconductor device according to  claim 6  wherein at least one of the packaging leads is a ground lead. 
   
   
       8 . The semiconductor device according to  claim 6  wherein the interconnection leads are subjected to half-etching. 
   
   
       9 . The semiconductor device according to  claim 2 , wherein the substrate comprises a stage, the semiconductor device further comprising cover connection leads, wherein the cover member, the stage and the cover connection leads are electrically connected.