Method and apparatus for temperature change and control

Abstract

An apparatus for controlling the temperature of a substrate which includes a substrate table and a thermal assembly arranged in the substrate table and in thermal communication with a thermal surface of the substrate table. The thermal assembly includes a channel that carries a heat-transfer fluid. The apparatus further includes a fluid thermal unit which includes a first fluid unit configured to control the temperature of the heat-transfer fluid to a first temperature, a second fluid unit configured to control the temperature of the heat-transfer fluid to a second temperature, and an outlet flow control unit that is in fluid communication with the channel of the thermal assembly and the first and second fluid units. The outlet flow control unit is configured to supply the channel with a controlled heat transfer fluid, which includes at least one of the heat-transfer fluid having a first temperature, the heat transfer fluid having a second temperature or a combination thereof.

1 . A distributed temperature control system for controlling a temperature of a substrate, comprising:
 a substrate table having a thermal surface for supporting said substrate;   a plurality of thermal assemblies arranged in said substrate table and in thermal communication with said thermal surface, each of said plurality of thermal assemblies comprising a channel that carries heat transfer fluid; and   a fluid thermal unit constructed and arranged to adjust a temperature of said heat-transfer fluid, said fluid thermal unit comprising:
 a first fluid unit constructed and arranged to control the temperature of said heat-transfer fluid to a first temperature; 
 a second fluid unit constructed and arranged to control the temperature of said heat transfer fluid to a second temperature; and 
 an outlet flow control unit that is in fluid communication with each channel of said plurality of thermal assemblies and said first and second fluid units, said outlet flow control unit being constructed and arranged to supply each channel with a controlled heat transfer fluid comprising at least one of the heat-transfer fluid having a first temperature, the heat transfer fluid having a second temperature or a combination thereof. 
   
     
     
         2 . The distributed temperature control system of  claim 1 , wherein said outlet flow control unit comprises a mixing unit, said mixing unit comprises a mixing flow chamber having a mixing flow surface, and wherein the heat-transfer fluid having said first temperature and the heat transfer fluid having said second temperature are mechanically mixed within said mixing flow chamber. 
     
     
         3 . The distributed temperature control system of  claim 1 , further comprising:
 an inlet distribution unit that is in fluid communication with each channel of said plurality of thermal assemblies and said first and second fluid units, said inlet distribution unit being constructed and arranged to control a volume, a flow rate, or combination thereof of controlled heat transfer fluid flowing to said first fluid unit and a volume, a flow rate, or combination thereof of controlled heat transfer fluid flowing to said second fluid unit.   
     
     
         4 . The distributed temperature control system of  claim 1 , wherein said outlet flow control unit is in a cooperative relationship with said inlet distribution unit such that a volume of heat-transfer fluid located in each of said first and second fluid units is substantially constant. 
     
     
         5 . The distributed temperature control system of  claim 1 , wherein each of the first and second fluid units comprises a storage fluid tank, a pump, a heater and a cooler. 
     
     
         6 . The distributed temperature control system of  claim 1 , further comprising:
 a temperature control system constructed and arranged to control a supply of the controlled heat-transfer fluid based upon a temperature of one of the substrate surface, the thermal surface, and the controlled heat-transfer fluid in at least one channel of said plurality of thermal assemblies.   
     
     
         7 . The distributed temperature control system of  claim 1 , further comprising:
 a temperature sensor constructed and arranged to detect a temperature of one of the substrate surface, the thermal surface, and the controlled heat-transfer fluid in at least one channel of said plurality of thermal assemblies.   
     
     
         8 . The distributed temperature control system of  claim 1 , wherein one of said first fluid unit and said second fluid unit is located remotely from said substrate table. 
     
     
         9 . The distributed temperature control system of  claim 1 , further comprising:
 a resistive heater in thermal communication with the thermal surface.   
     
     
         10 . The distributed temperature control system of  claim 1 , further comprising:
 an electrode arranged in said substrate table and configured to electro-statically clamp said substrate to said thermal surface of said substrate table; and   a gas conduit passing through said substrate table and having a first end open to said thermal surface and a second end opposite said first end such that a gas can flow through said conduit and provide backside pressure to said substrate.   
     
     
         11 . The distributed temperature control system of  claim 10 , further comprising:
 a resistive heater arranged in said substrate table and in thermal communication with the thermal surface.   
     
     
         12 . The distributed temperature control system of  claim 1 , further comprising:
 an RF power plate arranged in said substrate table and an RF power connector that connects the RF power plate to an RF power supply.   
     
     
         13 . The distributed temperature control system of  claim 1 , wherein said thermal surface comprises a substantially planar surface. 
     
     
         14 . A distributed temperature control system for controlling a temperature of a substrate, comprising:
 a substrate table having a thermal surface for supporting said substrate;   a plurality of thermal assemblies arranged in said substrate table and in thermal communication with said thermal surface, each of said plurality of thermal assemblies comprising a channel that carries heat transfer fluid; and   a plurality of fluid thermal units, wherein each of said plurality of fluid thermal units is independently constructed and arranged to adjust a temperature of said heat-transfer fluid to one of said plurality of thermal assemblies, and wherein each of said plurality of fluid thermal units comprises:
 a first fluid unit constructed and arranged to control the temperature of said heat-transfer fluid to a first temperature; 
 a second fluid unit constructed and arranged to control the temperature of said heat transfer fluid to a second temperature; and 
 an outlet flow control unit that is in fluid communication with said channel of said one of said plurality of thermal assemblies and said first and second fluid units, said outlet flow control unit being constructed and arranged to supply said channel of said one of said plurality of thermal assemblies with a controlled heat transfer fluid comprising at least one of the heat-transfer fluid having a first temperature, the heat transfer fluid having a second temperature or a combination thereof. 
   
     
     
         15 . The distributed temperature control system of  claim 14 , wherein said outlet flow control unit comprises a mixing unit, said mixing unit comprises a mixing flow chamber having a mixing flow surface, and wherein the heat-transfer fluid having said first temperature and the heat transfer fluid having said second temperature are mechanically mixed within said mixing flow chamber. 
     
     
         16 . The distributed temperature control system of  claim 14 , wherein each of said plurality of fluid thermal units further comprises:
 an inlet distribution unit that is in fluid communication with said channel of said one of said plurality of thermal assemblies and said first and second fluid units, said inlet distribution unit being constructed and arranged to control a volume, a flow rate, or combination thereof of controlled heat transfer fluid flowing to said first fluid unit and a volume, a flow rate, or combination thereof of controlled heat transfer fluid flowing to said second fluid unit.   
     
     
         17 . The distributed temperature control system of  claim 14 , wherein said thermal surface comprises a substantially planar surface. 
     
     
         18 . A method of controlling a temperature of a substrate supported by a thermal surface of a substrate table, the substrate table including a fluid thermal assembly in thermal communication with the thermal surface, the method comprising:
 adjusting a heat-transfer fluid of a first source of heat-transfer fluid to a first temperature;   adjusting a heat-transfer fluid of a second source of heat-transfer fluid to a second temperature;   supplying said fluid thermal assembly with a controlled heat-transfer fluid comprising the heat transfer fluid from said first source for a first period of time; and   supplying said fluid thermal assembly with another controlled heat-transfer fluid comprising a combination of the heat transfer fluid from said first source and the heat transfer fluid from said second source for a second period of time.   
     
     
         19 . The method of  claim 18 , further comprising:
 adjusting an amount of the heat transfer fluid from said first source relative to another amount of the heat transfer fluid from said second source.   
     
     
         20 . The method of  claim 18 , wherein said first temperature is greater than said second temperature when heating said substrate. 
     
     
         21 . The method of  claim 18 , wherein said first temperature is less than said second temperature when cooling said substrate. 
     
     
         22 . The method of  claim 18 , further comprising:
 heating said substrate using a resistive heater.   
     
     
         23 . The method of  claim 18 , further comprising:
 clamping said substrate to said thermal surface of said substrate table; and   providing a backside pressure to said substrate by flowing a gas to a backside of said substrate.   
     
     
         24 . The method of  claim 18 , further comprising:
 mixing the heat transfer fluid from said first source and the heat transfer fluid from said second source when supplying another controlled heat-transfer fluid comprising the combination of the heat transfer fluid from said first source and the heat transfer fluid from said second source.   
     
     
         25 . A method of controlling a temperature profile of a substrate supported by a thermal surface of a substrate table, the substrate table including a plurality of fluid thermal assemblies in thermal communication with the thermal surface, the method comprising:
 adjusting a heat-transfer fluid of a first source of heat-transfer fluid to a first temperature;   adjusting a heat-transfer fluid of a second source of heat-transfer fluid to a second temperature;   supplying each of said plurality of fluid thermal assemblies with a controlled heat-transfer fluid comprising the heat transfer fluid from said first source for a first period of time; and   supplying each of said plurality of fluid thermal assemblies with a controlled heat-transfer fluid comprising a combination of the heat transfer fluid from said first source and the heat transfer fluid from said second source for a second period of time.   
     
     
         26 . The method of  claim 25 , further comprising:
 adjusting an amount of the heat transfer fluid from said first source relative to another amount of the heat transfer fluid from said second source for each of said plurality of fluid thermal assemblies.   
     
     
         27 . A method for processing a substrate within a plasma processing system, the plasma processing system comprising: a substrate table having a thermal surface for supporting said substrate; a thermal assembly arranged in said substrate table and in thermal communication with said thermal surface, the thermal assembly comprising a channel that carries a heat transfer fluid, and a fluid thermal unit constructed and arranged to adjust a control temperature of said heat-transfer fluid, said fluid thermal unit comprising: a first fluid unit constructed and arranged to control the temperature of said heat-transfer fluid to a first temperature; a second fluid unit constructed and arranged to control the temperature of said heat transfer fluid to a second temperature; an outlet flow control unit that is in fluid communication with said channel of said thermal assembly and said first and second fluid units, said outlet flow control unit being constructed and arranged to supply said channel with a controlled heat transfer fluid at said control temperature comprising at least one of the heat-transfer fluid having said first temperature, the heat transfer fluid having said second temperature or a combination thereof, wherein said outlet flow control unit comprises a mixing unit, said mixing unit comprises a mixing flow chamber having a mixing flow surface, and wherein the heat-transfer fluid having said first temperature and the heat transfer fluid having said second temperature are mechanically mixed within said mixing flow chamber; an inlet distribution unit that is in fluid communication with said channel of said plurality of thermal assemblies and said first and second fluid units, said inlet distribution unit being constructed and arranged to control a volume, a flow rate, or combination thereof of controlled heat transfer fluid flowing to said first fluid unit and a volume, a flow rate, or combination thereof of controlled heat transfer fluid flowing to said second fluid unit; and a plurality of temperature sensors operatively coupled to a temperature control system to report at least a temperature of said thermal surface or said substrate, maintain an optimized temperature profile at a desired temperature of said substrate disposed on said thermal surface, the method comprising:
 setting said first temperature;   setting said second temperature, wherein said first temperature is greater than said second temperature;   setting a first control temperature of said controlled heat transfer fluid by setting a first flow rate of said heat transfer fluid at said first temperature and setting a first flow rate of said heat transfer fluid at said second temperature;   mixing said first flow rate of said heat transfer fluid at said first temperature and said first flow rate of said heat transfer fluid at said second temperature;   supplying said controlled heat transfer fluid at said first control temperature to said thermal assembly; and   processing said substrate during said supply of said controlled heat transfer fluid at said first control temperature to said thermal assembly.   
     
     
         28 . The method of  claim 27 , further comprising:
 adjusting said first control temperature.   
     
     
         29 . The method of  claim 27 , further comprising:
 setting a second control temperature of said controlled heat transfer fluid by setting a second flow rate of said heat transfer fluid at said first temperature and setting a second flow rate of said heat transfer fluid at said second temperature;   mixing said second flow rate of said heat transfer fluid at said first temperature and said second flow rate of said heat transfer fluid at said second temperature;   supplying said controlled heat transfer fluid at said second control temperature to said thermal assembly; and   processing said substrate during said supply of said controlled heat transfer fluid at said second control temperature to said thermal assembly.   
     
     
         30 . The method of  claim 29 , further comprising:
 adjusting said second control temperature.