US2009092762A1PendingUtilityA1

Method of manufacturing a metallic layer on a non-metallic surface

Assignee: SOONG TZU-WENPriority: Oct 4, 2007Filed: Feb 11, 2008Published: Apr 9, 2009
Est. expiryOct 4, 2027(~1.2 yrs left)· nominal 20-yr term from priority
Inventors:Tzu-Wen Soong
C23C 4/131
52
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Claims

Abstract

A method of manufacturing a metallic layer on a non-metallic surface is disclosed. The method of manufacturing a metallic layer on a non-metallic surface includes the steps of: roughening the non-metallic surface; continuously feeding a first metallic wire and a second metallic wire above the non-metallic surface; positioning the first metallic wire and the second metallic wire so that the first metallic wire and the second metallic wire are in contact with each other at one end; applying a first voltage to the first metallic wire and applying a second voltage to the second metallic wire, wherein a voltage difference between the first voltage and the second voltage is large enough to produce an electric arc; melting the first and second metallic wire with the electric arc so as to form the metallic layer on the non-metallic surface; and forming a protection layer on the metallic layer to avoid the metallic layer from peeling off the non-metallic surface.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a metallic layer on a non-metallic surface, comprising the steps of:
 roughening said non-metallic surface;   continuously feeding a first metallic wire and a second metallic wire above said non-metallic surface;   positioning said first metallic wire and said second metallic wire so that said first metallic wire and said second metallic wire are in contact with each other at one end;   applying a first voltage to said first metallic wire and applying a second voltage to said second metallic wire, wherein a voltage difference between the first voltage and the second voltage is large enough to produce an electric arc;   melting said first and second metallic wire with said electric arc so as to form said metallic layer on said non-metallic surface; and   forming a protection layer on said metallic layer to avoid said metallic layer from peeling off said non-metallic surface.   
   
   
       2 . The method according to  claim 1 , wherein said first and second metallic wire form a metallic coating material after being melted. 
   
   
       3 . The method according to  claim 2 , further comprising a step of atomizing said metallic coating material. 
   
   
       4 . The method according to  claim 3 , wherein said atomizing step is achieved by blowing a gas flow to said metallic coating material. 
   
   
       5 . The method according to  claim 4 , wherein said gas flow has a pressure of approximately 3˜20 bar. 
   
   
       6 . The method according to  claim 4 , wherein said gas flow is compressed air or inert gas. 
   
   
       7 . The method according to  claim 3 , further comprising a step of spreading said atomized metallic coating material onto said non-metallic surface to form said metallic layer. 
   
   
       8 . The method according to  claim 1 , wherein said non-metallic surface has a roughness larger than 4 nanometers after the roughening step. 
   
   
       9 . The method according to  claim 7 , further comprising a step of hardening said metallic coating material on said non-metallic surface. 
   
   
       10 . The method according to  claim 1 , wherein said voltage difference is approximately between 10˜40 volts. 
   
   
       11 . The method according to  claim 7 , wherein said non-metallic surface has a temperature range from 5° C. to 90° C. after said atomized metallic coating material is being spread onto said non-metallic surface. 
   
   
       12 . The method according to  claim 1 , wherein said first metallic wire and said second metallic wire each has a diameter of approximately 0.5˜2.5 mm. 
   
   
       13 . The method according to  claim 1 , wherein a current of 70˜350 A is generated between said first metallic wire and said second metallic wire while continuously feeding said first and second metallic wires and applying said first and second voltages on said first and second metallic wires. 
   
   
       14 . The method according to  claim 1 , wherein said first metallic wire and said second metallic wire are made of an identical material. 
   
   
       15 . The method according to  claim 1 , wherein said first metallic wire and said second metallic wire are made of different materials. 
   
   
       16 . The method according to  claim 1 , wherein said first metallic wire and said second metallic wire comprises Zn, Pb, Al, Cu, Mn, Zr, Ti, Ag, Fe, Be, Au, or an alloy thereof. 
   
   
       17 . The method according to  claim 1 , wherein said protection layer comprises polyvinyl butyral resin, poly-urethane, polyester resin, vinyl-ester resin, unsaturated poly vinyl-ester resin, epoxy resin, or ultra-violet curing paint. 
   
   
       18 . The method according to  claim 17 , wherein said protection layer further comprises C, Zn, Pb, Al, Cu, Mg, Zr, Ti, Fe, Be, Ag, Au, or an alloy thereof. 
   
   
       19 . The method according to  claim 1 , wherein said protection layer is formed by sputtering. 
   
   
       20 . The method according to  claim 19 , wherein said protection layer comprises Zn, Cr, Ni, Ti, Zr, or stainless steel. 
   
   
       21 . The method according to  claim 1 , wherein said metallic layer has a thickness of approximately 0.5˜3000 μm on substrate exterior surface or 0.5˜25 μm on substrate interior surface. 
   
   
       22 . The method according to  claim 1 , wherein said metallic layer has a roughness of approximately 0.4˜500 μm. 
   
   
       23 . The method according to  claim 1 , wherein said non-metallic surface comprises polyethylene (PE), polyimide (PI), polyamide (PA), acrylonitrile-butadiene-styrene (ABS), polycarbonate (PC), polyvinyl chloride (PVC), polyphenylene ether (PPE), polystyrene (PS), polyetherimide (PEI), polybutylene terephathalate (PBT), polyethylene terephathalate (PET), acrylic resin (PMMA), polymethacrylate (PMA), polyurethane (PU), polyolefin, polysulfone (PSF), liquid crystalline polymer (LCP), polyarylate (PAR), polyether ether ketone (PEEK), polytetrafluorcethylene (PTFE), polyoxybenzylene (POB), polyphenylene sulphide (PPS), polyphenylene oxide (PPO), Polyphthalamide (PPA), polyoxy methylene (POM), polyphenylene sulfide (PES), carbon fiber, glass fiber, boron fiber, or paper.

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