Cooler

Abstract

A cooler includes a substrate for disposing a semiconductor device thereon, a plate member fixed to a back surface of the substrate, a primary pipe, and a secondary pipe. A space sandwiched between the substrate and the primary pipe defines a first flow path for a coolant. The primary pipe and the secondary pipe configure a second flow path for a coolant. The secondary pipe is positioned to jet a coolant toward a region opposite to that having the semiconductor device disposed therein. The second flow path is separated from the first flow path.

1 . A cooler comprising:
 a substrate for disposing a heat generating element on one surface thereof;   a heat radiating member fixed to an other surface of said substrate;   a first flow path configuring member configuring a first flow path formed to allow a coolant to contact said heat radiating member; and   a second flow path configuring member configuring a second flow path formed to jet a coolant toward said other surface at a region opposite to a region having said heat generating element disposed therein, said second flow path being separated from said first flow path.   
   
   
       2 . The cooler according to  claim 1 , wherein said heat radiating member includes at least one of a plate member and a bar member. 
   
   
       3 . The cooler according to  claim 1 , wherein:
 said heat radiating member surrounds said region opposite to said region having said heat generating element disposed therein;   said second flow path configuring member includes a primary pipe remote from said other surface of said substrate, and a secondary pipe projecting from said primary pipe toward said substrate;   said secondary pipe is opposite to said region of said substrates having said heat generating element disposed therein; and   said first flow path includes a space sandwiched between said primary pipe and said substrate.   
   
   
       4 . The cooler according to  claim 3 , wherein:
 said secondary pipe has an end surface opposite to said substrate; and   said end surface inclines to provide a larger flow path in a direction in which said coolant flows along said first flow path configuring member.   
   
   
       5 . The cooler according to  claim 3 , wherein said secondary pipe is tapered to be narrower toward said substrate. 
   
   
       6 . The cooler according to  claim 3 , further comprising a third flow path configuring member for discharging said coolant flowing through said second flow path, wherein:
 said third flow path configuring member includes a diaphragm between said primary pipe and said substrate;   said secondary pipe penetrates said diaphragm; and   said secondary pipe is fixed to said diaphragm without a gap.   
   
   
       7 . The cooler according to  claim 1 , wherein said substrate has said one surface extending in one of a vertical direction and a direction inclined relative to said vertical direction. 
   
   
       8 . The cooler according to  claim 1 , wherein said substrate has said one surface facing downward in a vertical direction. 
   
   
       9 . A cooler comprising:
 a substrate for disposing a heat generating element on one surface thereof;   a heat radiating member fixed to an other surface of said substrate;   first flow path configuring means for configuring a first flow path formed to allow a coolant to contact said heat radiating member; and   second flow path configuring means for configuring a second flow path formed to jet a coolant toward said other surface at a region opposite to a region having said heat generating element disposed therein, said second flow path being separated from said first flow path.   
   
   
       10 . The cooler according to  claim 9 , wherein said heat radiating member includes at least one of a plate member and a bar member. 
   
   
       11 . The cooler according to  claim 9 , wherein:
 said heat radiating member surrounds said region opposite to said region having said heat generating element disposed therein;   said second flow path configuring means includes a primary pipe remote from said other surface of said substrate, and a secondary pipe projecting from said primary pipe toward said substrate;   said secondary pipe is opposite to said region of said substrate having said heat generating element disposed therein; and   said first flow path includes a space sandwiched between said primary pipe and said substrate.   
   
   
       12 . The cooler according to  claim 11 , wherein:
 said secondary pipe has an end surface opposite to said substrate; and   said end surface inclines to provide a larger flow path in a direction in which said coolant flows along said first flow path configuring means.   
   
   
       13 . The cooler according to  claim 11 , wherein said secondary pipe is tapered to be narrower toward said substrate. 
   
   
       14 . The cooler according to  claim 11 , further comprising third flow path configuring means for discharging said coolant flowing through said second flow path, wherein:
 said third flow path configuring means includes a diaphragm between said primary pipe and said substrate;   said secondary pipe penetrates said diaphragm; and   said secondary pipe is fixed to said diaphragm without a gap.   
   
   
       15 . The cooler according to  claim 9 , wherein said substrate has said one surface extending in one of a vertical direction and a direction inclined relative to said vertical direction. 
   
   
       16 . The cooler according to  claim 9 , wherein said substrate has said one surface facing downward in a vertical direction.