Cooling apparatus for electronic devices

Abstract

In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core structure is at least partially elongated in the direction parallel to the mounting base toward outer extremities of the plurality of fins.

1 . A heat sink, comprising:
 a mounting base;   a core structure extending outwardly from the mounting base in a first direction; and   a plurality of fins extending outwardly from the core structure in a second direction along the mounting base and transverse to the first direction, wherein the core structure is at least partially elongated in the second direction toward outer extremities of the plurality of fins, and the second direction is oriented along a path of airflow into a first side, completely through the heat sink, and out through an opposite second side.   
   
   
       2 . The heat sink of  claim 1 , wherein the core structure becomes increasingly elongated in the second direction the farther the core structure extends from the mounting base in the first direction. 
   
   
       3 . The heat sink of  claim 1 , wherein the core structure comprises a longitudinal axis that is substantially perpendicular to the mounting base, and wherein the fins comprises a plurality of plates disposed one over the other in spaced relation above the mounting base and substantially parallel to a mounting surface of the mounting base. 
   
   
       4 . The heat sink of  claim 1 , wherein core structure has a curved geometry that becomes increasingly narrow in the second direction toward the outer extremities of the plurality of fins. 
   
   
       5 . The heat sink of  claim 1 , wherein the core structure comprises a hollow interior. 
   
   
       6 . The heat sink  claim 1 , wherein the core structure comprises an internal heat pipe or vapor chamber. 
   
   
       7 . The heat sink of  claim 1 , comprising a fan positioned to flow air through the plurality of fins in the second direction parallel to the mounting base. 
   
   
       8 . A system, comprising:
 a heat sink, comprising:
 a mounting surface; 
 a plurality of fins parallel to the mounting surface, wherein the fins are stacked one over another in spaced relation above the mounting surface, wherein an airflow path extends through spaces between the fins in a direction parallel to the mounting surface, and the airflow path extends into a first side, completely through the heat sink, and out through an opposite second side; and 
 a core perpendicular to the mounting surface and the plurality of fins, wherein the core has a curved exterior that is elongated in the direction of the airflow path. 
   
   
   
       9 . The system of  claim 8 , wherein the core has an airfoil shape aligned with the direction of the airflow path. 
   
   
       10 . The system of  claim 8 , wherein the core becomes increasingly aerodynamic and less resistive to airflow from the mounting surface toward an opposite top side of the heat sink. 
   
   
       11 . The system of  claim 8 , wherein the core has a cylindrical shape adjacent the mounting surface, and the cylindrical shape gradually becomes more oblong away from the mounting surface. 
   
   
       12 . The system of  claim 8 , comprising a processor configured to mount with the mounting surface of the heat sink. 
   
   
       13 . The system of  claim 8 , comprising a circuit board configured to receive the heat sink. 
   
   
       14 . The system of  claim 8 , comprising a computer having the heat sink. 
   
   
       15 . A system, comprising:
 a heat sink, comprising:
 a base; 
 a core extending outwardly from the base in a first direction; and 
 a plurality of fins extending outwardly from the core in a second direction that is transverse to the first direction, wherein the core has a curved geometry that becomes increasingly narrow in the second direction toward outer extremities of the plurality of fins, and the second direction is oriented along a path of airflow into a first side, completely through the heat sink, and out through an opposite second side. 
   
   
   
       16 . The system of  claim 15 , wherein the core becomes progressively more elongated in the second direction the further the core extends in the first direction away from the base. 
   
   
       17 . The system of  claim 15 , wherein the core progressively flares and thins away from the base. 
   
   
       18 . The system of  claim 15 , wherein the fins are positioned one over another in spaced relation above the base. 
   
   
       19 . The system of  claim 15 , comprising a processor, a circuit board, or a computer assembled with the heat sink. 
   
   
       20 . A heat sink, comprising:
 a core that thins and flares in a bell-shaped profile away from a mounting surface; and   a plurality of fins coupled to the core.   
   
   
       21 . A heat sink, comprising:
 a core that has an airfoil-shaped profile; and   a plurality of fins coupled to the core, wherein the fins define an airflow path about the airfoil-shaped profile in through a first side of the heat sink, completely through the heat sink, and out through an opposite second side of the heat sink.