Semiconductor device and method for manufacturing the same, and electric device
Abstract
It is an object of the present invention to simplify steps needed to process a wiring in forming a multilayer wiring. In addition, when a droplet discharging technique or a nanoimprint technique is used to form a wiring in a contact hole having a comparatively long diameter, the wiring in accordance with the shape of the contact hole is formed, and the wiring portion of the contact hole is likely to have a depression compared with other portions. A penetrating opening is formed by irradiating a light-transmitting insulating film with laser light having high intensity and a pulse high in repetition frequency. A plurality of openings having a minute contact area is provided instead of forming one penetrating opening having a large contact area to have an even thickness of a wiring by reducing a partial depression and also to ensure contact resistance.
Claims
exact text as granted — not AI-modified1 . A active matrix display device comprising:
a thin film transistor formed over a substrate, the thin film transistor comprising a semiconductor layer wherein the semiconductor layer comprises a metal oxide including at least indium; and a pixel electrode formed over the substrate and electrically connected to the thin film transistor.
2 . The active matrix display device according to claim 1 , wherein the metal oxide includes zinc, gallium, and indium.
3 . The active matrix display device according to claim 1 , wherein the thin film transistor is a bottom gate thin film transistor.
4 . The active matrix display device according to claim 1 , wherein the thin film transistor is a top gate thin film transistor.
5 . The active matrix display device according to claim 1 , wherein the active matrix display device is a liquid crystal display device.
6 . The active matrix display device according to claim 1 , wherein the active matrix display device is an EL display device.
7 . The active matrix display device according to claim 1 , wherein the substrate is a plastic substrate.
8 . The active matrix display device according to claim 1 , further comprising an interlayer insulating film formed over the thin film transistor wherein the pixel electrode is electrically connected to the thin film transistor though a plurality of openings formed in the interlayer insulating film.
9 . An active matrix display device comprising:
a thin film transistor formed over a substrate; and a pixel electrode formed over the substrate and electrically connected to the thin film transistor, the thin film transistor including:
at least two gate electrodes electrically connected to each other;
a gate insulating film formed over at least the two gate electrodes; and
a semiconductor layer formed over the gate insulating film so as to overlap the two gate electrodes wherein the semiconductor layer comprises a metal oxide including at least indium.
10 . The active matrix display device according to claim 9 , wherein the metal oxide includes zinc, gallium, and indium.
11 . The active matrix display device according to claim 9 , further comprising a wiring over the semiconductor layer wherein the pixel electrode is connected to the wiring.
12 . The active matrix display device according to claim 9 , wherein the thin film transistor is a top gate thin film transistor.
13 . The active matrix display device according to claim 9 , wherein the active matrix display device is a liquid crystal display device.
14 . The active matrix display device according to claim 9 , wherein the active matrix display device is an EL display device.
15 . The active matrix display device according to claim 9 , wherein the substrate is a plastic substrate.
16 . The active matrix display device according to claim 9 , further comprising an interlayer insulating film formed over the thin film transistor wherein the pixel electrode is electrically connected to the thin film transistor through a plurality of openings formed in the interlayer insulating film.
17 . A television device comprising:
a tuner for receiving a video signal; a video signal processing circuit operationally connected to the tuner; and an active matrix display device operationally connected to the video signal processing circuit, the active matrix display device comprising:
a thin film transistor formed over a substrate, the thin film transistor comprising a semiconductor layer wherein the semiconductor layer comprises a metal oxide including at least indium; and
a pixel electrode formed over the substrate and electrically connected to the thin film transistor.
18 . The television device according to claim 17 , wherein the metal oxide includes zinc, gallium, and indium.
19 . The television device according to claim 17 , wherein the thin film transistor is a bottom gate thin film transistor.
20 . The television device according to claim 17 , wherein the thin film transistor is a top gate thin film transistor.
21 . The television device according to claim 17 , wherein the active matrix display device is a liquid crystal display device.
22 . The television device according to claim 17 , wherein the active matrix display device is an EL display device.
23 . The television device according to claim 17 , wherein the substrate is a plastic substrate.
24 . The television device according to claim 17 , further comprising an interlayer insulating film formed over the thin film transistor wherein the pixel electrode is electrically connected to the thin film transistor though a plurality of openings formed in the interlayer insulating film.
25 . A television device comprising:
a tuner for receiving a video signal; a video signal processing circuit operationally connected to the tuner; and an active matrix display device operationally connected to the video signal processing circuit, the active matrix display device comprising:
a thin film transistor formed over a substrate, and
a pixel electrode formed over the substrate and electrically connected to the thin film transistor,
the thin film transistor including:
at least two gate electrodes electrically connected to each other;
a gate insulating film formed over at least the two gate electrodes; and
a semiconductor layer formed over the gate insulating film so as to overlap the two gate electrodes wherein the semiconductor layer comprises a metal oxide including at least indium.
26 . The television device according to claim 25 , wherein the metal oxide includes zinc, gallium, and indium.
27 . The television device according to claim 25 , further comprising a wiring over the semiconductor layer wherein the pixel electrode is connected to the wiring.
28 . The television device according to claim 25 , wherein the thin film transistor is a top gate thin film transistor.
29 . The television device according to claim 25 , wherein the active matrix display device is a liquid crystal display device.
30 . The television device according to claim 25 , wherein the active matrix display device is an EL display device.
31 . The television device according to claim 25 , wherein the substrate is a plastic substrate.
32 . The television device according to claim 25 , further comprising an interlayer insulating film formed over the thin film transistor wherein the pixel electrode is electrically connected to the thin film transistor through a plurality of openings formed in the interlayer insulating film.
33 . A active matrix display device comprising:
a bottom gate type thin film transistor formed over a substrate, the bottom gate type thin film transistor comprising a semiconductor layer wherein the semiconductor layer comprises a metal oxide including zinc, gallium, and indium; and a pixel electrode formed over the substrate and electrically connected to the thin film transistor.
34 . The active matrix display device according to claim 33 , wherein the active matrix display device is a liquid crystal display device.
35 . The active matrix display device according to claim 33 , wherein the active matrix display device is an EL display device.
36 . The active matrix display device according to claim 33 , wherein the substrate is a plastic substrate.
37 . A active matrix display device comprising:
a thin film transistor formed over a substrate, the thin film transistor comprising a semiconductor layer wherein the semiconductor layer comprises a metal oxide including at least indium; a pixel electrode formed over the substrate and electrically connected to the thin film transistor; and a driver circuit comprising an IC chip operationally connected to the thin film transistor.
38 . The active matrix display device according to claim 37 , wherein the metal oxide includes zinc, gallium, and indium.
39 . The active matrix display device according to claim 37 , wherein the active matrix display device is a liquid crystal display device.
40 . The active matrix display device according to claim 37 , wherein the active matrix display device is an EL display device.
41 . The active matrix display device according to claim 37 , wherein the substrate is a plastic substrate.
42 . The active matrix display device according to claim 37 , wherein the IC chip is mounted on the substrate.
43 . The active matrix display device according to claim 37 , wherein the driver circuit is a scanning-line driver circuit.
44 . The active matrix display device according to claim 37 , wherein the driver circuit is a signal-line driver circuit.Join the waitlist — get patent alerts
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