Interconnect Structures Incorporating Air-Gap Spacers
Abstract
A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.
Claims
exact text as granted — not AI-modified1 . A dual damascene article of manufacture comprising a trench containing a conductive metal column the trench and the conductive metal column extending down into and contiguous with a via, the trench and the conductive metal column and the via having a common axis, wherein the trench further comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via.
2 . The article of manufacture of claim 1 comprising a capped dual damascene article of manufacture.
3 . The article of manufacture of claim 1 wherein the dual damascene article of manufacture comprises a silicon compound ILD selected from a dense silica ILD, a porous silica ILD, a dense organosilicate ILD, or a porous organosilicate ILD
4 . A dual damascene article of manufacture comprising a trench containing a conductive metal column the trench and the conductive metal column extending down into and contiguous with a via, the trench and the conductive metal column and said via having a common axis, wherein said trench further comprises a sidewall air-gap immediately adjacent said side walls of said trench and said conductive metal column, said sidewall air-gap extending down to said via, wherein said width of said sidewall air-gap varies from about 1 Angstrom to about 1000 Angstroms, and said via does not have a sidewall air-gap.
5 . A capped dual damascene article of manufacture comprising a trench containing a conductive metal column said trench and said conductive metal column extending down into and contiguous with a via, said trench and said conductive metal column and said via having a common axis, wherein said trench further comprises a sidewall air-gap immediately adjacent said side walls of said trench and said conductive metal column, said sidewall air-gap extending down to said via, and further comprising a perforated pinched off cap operatively associated with said article, said perforated pinched off cap having seams in it.
6 . A capped dual damascene article of manufacture comprising a via and a trench containing a conductive metal column, said trench and said conductive metal column having a common axis, wherein said trench further comprises a sidewall air-gap immediately adjacent only to the side walls of said trench and said conductive metal column, and further comprising a perforated pinched off cap operatively associated with said article, said perforated pinched off cap having seams in it.
7 . The article of manufacture of any one of claims 1 to 6 wherein the width of said air-gap can vary from about 1 angstrom to about the largest diameter of said trench.
8 . The article of manufacture of claim 7 wherein said air-gap comprises an air gap no larger than about 0.5 microns
9 . The article of manufacture of one of claims 1 or 5 wherein the depth of said air-gap varies from about 1 Angstrom below the trench to the entire depth of the via.
10 . The article of manufacture of one of claims 4 or 6 wherein the depth of said air-gap varies from about 1 Angstrom below the top of said trench to the entire depth of said trench, with said air-gap still being formed adjacent; to said trench.Join the waitlist — get patent alerts
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