Cooling facility for an electronic component

Abstract

Cooling facilities for an electronic component provide a cooling device that occupies a small volume, requires only a relatively low operating voltage, and operates in any orientation. The cooling facility consists of a body defining a coolant passage including an inlet and an outlet, a pumping chamber with a variable volume changeable from a greater volume to a lesser volume in fluid communication with the inlet and the outlet, and a flow restriction facility in fluid communication with the inlet and the outlet. The flow restriction facility provides limited flow resistance to coolant flow in a first direction from the inlet to the outlet and provides increased resistance to coolant flow in the opposite direction from the outlet to the inlet. Therefore, repeated reciprocation of the pumping chamber between a greater volume and a lesser volume generates a net fluid flow from the inlet to the outlet.

1 . A cooling facility for an electronic component, the facility comprising:
 a body defining a coolant passage, wherein the coolant passage includes an inlet and an outlet;   a pumping chamber in fluid communication with the inlet and the outlet, wherein the pumping chamber has a variable volume changeable from a greater volume to a lesser volume; and   a flow restriction facility in fluid communication with the inlet and the outlet, wherein the flow restriction facility is operable to provide limited flow resistance to coolant flow in a first direction from the inlet to the outlet and to provide greater resistance to coolant flow in the opposite direction from the outlet to the inlet, such that repeated reciprocation of the pumping chamber between a greater volume and a lesser volume generates a net fluid flow from the inlet to the outlet.   
   
   
       2 . The cooling facility for an electronic component as defined in  claim 1 , wherein at least a portion of the coolant passage is defined in the body of an electronic component. 
   
   
       3 . The cooling facility for an electronic component as defined in  claim 1 , wherein the flow restriction facility is located between the inlet and the pumping chamber. 
   
   
       4 . The cooling facility for an electronic component as defined in  claim 3 , further comprising a second flow restriction facility between the pumping chamber and the outlet. 
   
   
       5 . The cooling facility for an electronic component as defined in  claim 1 , wherein the inlet and the outlet are defined in a first planar layer. 
   
   
       6 . The cooling facility for an electronic component as defined in  claim 5 , wherein the pumping chamber is defined in a second planar layer. 
   
   
       7 . The cooling facility for an electronic component as defined in  claim 6 , wherein the flow restriction facility as defined in a third planar layer between the first and second planar layers, wherein the third planar layer defines a first aperture between the inlet and the pumping chamber and a second aperture between the pumping chamber and the outlet. 
   
   
       8 . The cooling facility for an electronic component as defined in  claim 7 , wherein the first and second apertures are tapered in opposite directions. 
   
   
       9 . The cooling facility for an electronic component as defined in  claim 1 , wherein the pumping chamber includes a movable diaphragm. 
   
   
       10 . The cooling facility for an electronic component as defined in  claim 9 , wherein the diaphragm is piezoelectrically activated. 
   
   
       11 . The cooling facility for an electronic component as defined in  claim 1 , wherein at least a portion of the flow restriction facility is overlaid by the pumping chamber. 
   
   
       12 . The cooling facility for an electronic component as defined in  claim 1 , wherein the cooling facility for an electronic component is of limited size having dimensions no greater than about 0.25″ in length, 0.10″ in width, and 0.25″ in height. 
   
   
       13 . The cooling facility for an electronic component as defined in  claim 11 , wherein the flow restriction facility is completely overlaid by the pumping chamber. 
   
   
       14 . A method of cooling an electronic component comprising the steps of:
 providing the cooling facility for an electronic component as defined in  claim 9 ;   attaching the cooling facility to an electronic component to be cooled, wherein the coolant passage is in thermal communication with the electronic component;   heating a fluid to a second temperature by drawing a fluid at a first temperature into a compression chamber through the inlet and the flow restriction facility by applying an electrical charge to the movable diaphragm, thereby causing the movable diaphragm to deform upwards and define the compression chamber, wherein the coolant passage and flow restriction facility are at a third temperature that is higher than the first temperature; and   expelling the fluid at a greater second temperature through the flow restriction facility and the outlet by removing the electrical charge from the movable diaphragm, thereby causing the movable diaphragm to spring back against the flow restriction facility and collapse the compression chamber.   
   
   
       15 . A method of manufacturing a cooling facility for an electronic component comprising the steps of:
 obtaining a first planar layer;   defining a coolant passage having an inlet and outlet in the first planar layer;   obtaining a third planar layer;   defining first and second apertures tapered in opposite directions in the third planar layer;   affixing the third planar layer over the coolant passage such that the first aperture is in fluid communication with the inlet and the second aperture is in fluid communication with the outlet; and   obtaining a movable diaphragm and affixing the movable diaphragm over the first and second apertures to form a second planar layer.