Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method

Abstract

A polishing method configured to simultaneously polish both surfaces of a work includes the steps of inserting the work into a hole in a carrier and fixing the work with a fixing member, attaching the carrier to a polishing apparatus, polishing both surfaces of the work simultaneously, and detaching the carrier from the polishing apparatus after the polishing step, and attaching the carrier to an immediate cleaning apparatus.

1 . A polishing method configured to simultaneously polish both surfaces of a work, said polishing method comprising the steps of:
 inserting the work into a hole in a carrier and fixing the work with a fixing member;   attaching the carrier to a polishing apparatus;   polishing both surfaces of the work simultaneously; and   detaching the carrier from the polishing apparatus after the polishing step, and attaching the carrier to an immediate cleaning apparatus.   
     
     
         2 . The polishing method according to  claim 1 , further comprising the step of installing the carrier into a stocker that stores water or a solution after immediate cleansing by the immediate cleaning apparatus, so as to sink the carrier in the water or the solution. 
     
     
         3 . The polishing method according to  claim 1 , further comprising the step of attaching the carrier to a main cleaning apparatus after immediate cleaning by the immediate cleaning apparatus. 
     
     
         4 . The polishing method according to  claim 1 , wherein the fixing member includes an adhesive that bonds the carrier to the work in the hole. 
     
     
         5 . The polishing method according to  claim 1 , wherein the fixing member includes an elastic member that applies an elastic force to the work in the hole. 
     
     
         6 . The polishing method according to  claim 1 , wherein the polishing apparatus polishes the work by chemical mechanical polishing. 
     
     
         7 . A polishing method comprising the steps of:
 making a spacer contact a carrier so that the work can project from both surfaces of the carrier, the carrier having a hole configured to house the work;   inserting an adhesive into a clearance between the work and the carrier; and   detaching the carrier from the spacer and attaching the carrier to a polishing apparatus.   
     
     
         8 . A substrate manufacturing method comprising the steps of making a substrate, and processing the substrate,
 wherein the making step includes a rough lapping step of lapping a work, and a super finishing step of chemically and mechanically polishing the work, and   wherein at least one of the rough lapping step and the super finishing step uses the polishing method according to  claim 1 .   
     
     
         9 . A substrate manufacturing method comprising the steps of making a substrate, processing the substrate, and planarizing the substrate,
 wherein at least one of the making step and the planarizing step include a rough lapping step of lapping a work, and a super finishing step of chemically and mechanically polishing the work, and   wherein at least one of the rough lapping step and the super finishing step uses the polishing method according to  claim 1 .   
     
     
         10 . An electronic apparatus manufacturing method comprising the steps of:
 manufacturing the substrate using a substrate manufacturing method according to  claim 8 ;   manufacturing an electronic component; and   manufacturing an electronic apparatus from the substrate and the electronic component.