Method of forming passage in substrate for mems module

Abstract

A method of forming a passage in a substrate for a MEMS module is disclosed to include the steps of respectively forming a first support layer and a second support layer in a first space and a second space, which are respectively formed in a bottom side and a top side of a substrate by etching, by injection molding to define a sacrifice portion between the first and second support layers, and removing the sacrifice portion from the substrate by etching to form a passage defined between the first support layer and the second support layer in the substrate with two ends in communication with ambient atmosphere.

1 . A method of forming a passage in a substrate for a MEMS module, comprising the steps of:
 a) etching a substrate having a thickness smaller than 0.30 mm to form a first space in a bottom side of the substrate;   b) forming a first support layer in first space of the substrate by means of injection molding;   c) etching the substrate to form a second space in a top side of the substrate to define a sacrifice portion between the second space and the first support layer;   d) forming a second support layer in the second space of the substrate by means of injection molding; and   e) removing the sacrifice portion from the substrate by etching to form a passage defined between the first support layer and the second support layer in the substrate with two ends in communication with ambient atmosphere.   
   
   
       2 . The method as claimed in  claim 1 , wherein the substrate is made form a material selected form the group consisting of glass fiber-contained resin, epoxy, polyimide resin, FR4 resin, and bismaleimide-triazine resin. 
   
   
       3 . The method as claimed in  claim 1 , wherein the first support layer is formed by a thermal setting resin having an anti-etching coefficient greater than the substrate. 
   
   
       4 . The method as claimed in  claim 1 , wherein the second support layer is formed by a thermal setting resin having an anti-etching coefficient greater than the substrate. 
   
   
       5 . A method of forming a passage in a substrate for a MEMS module, comprising the steps of:
 a) etching a substrate having a thickness smaller than 0.30 mm to form a first space in a bottom side of the substrate;   b) etching the substrate to form a second space in a top side of the substrate to define a sacrifice portion between the first space and the second space;   c) forming a first support layer in the first space of the substrate by means of injection molding;   d) forming a second support layer in second space of the substrate by means of injection molding; and   e) removing the sacrifice portion from the substrate by etching to form a passage defined between the first support layer and the second support layer in the substrate with two ends in communication with ambient atmosphere.   
   
   
       6 . The method as claimed in  claim 5 , wherein the substrate is made form a material selected form the group consisting of glass fiber-contained resin, epoxy, polyimide resin, FR4 resin, and bismaleimide-triazine resin. 
   
   
       7 . The method as claimed in  claim 5 , wherein the first support layer is formed by a thermal setting resin having an anti-etching coefficient greater than the substrate. 
   
   
       8 . The method as claimed in  claim 5 , wherein the second support layer is formed by a thermal setting resin having an anti-etching coefficient greater than the substrate.