Multilayer printed circuit board

Abstract

The multilayer printed circuit board according to the present invention is a multilayer printed circuit board where at least one insulating layer, a conductor circuit and a plurality of optical circuits are formed and layered, wherein the optical circuits are formed and layered so as to be located in different layers.

1 . A multilayer printed circuit board where at least one insulating layer, a conductor circuit and a plurality of optical circuits are formed and layered,
 wherein   said optical circuits are formed and layered so as to be located in different layers.   
     
     
         2 . The multilayer printed circuit board according to  claim 1 ,
 wherein   an optical signal transmitting region is formed so as to penetrate through said at least one insulating layer, and   said optical circuit is optically coupled with at least one end of said optical signal transmitting region.   
     
     
         3 . The multilayer printed circuit board according to  claim 2 ,
 wherein   said optical signal transmitting region is formed of a resin composite.   
     
     
         4 . The multilayer printed circuit board according to  claim 1 ,
 wherein   it is visually confirmed that a portion of one optical circuit and a portion of another optical circuit from among optical circuits in different layers are superposed on one another when viewed in the direction perpendicular to one main surface of the multilayer printed circuit board.   
     
     
         5 . The multilayer printed circuit board according to  claim 1 ,
 wherein   an optical element and/or a package substrate on which an optical element is mounted are/is mounted independently on each of two surfaces.   
     
     
         6 . The multilayer printed circuit board according to  claim 1 ,
 wherein   a via hole for connecting conductor circuits sandwiching said insulating layer is formed, and   said via hole is a penetrating via hole and/or a non-penetrating via hole.   
     
     
         7 . The multilayer printed circuit board according to  claim 6 ,
 wherein   said optical circuits have a core and a clad, and   it is visually confirmed that said core and a portion of said non-penetrating via hole are superposed on one another when viewed in the direction perpendicular to one main surface of said printed circuit board.   
     
     
         8 . The multilayer printed circuit board according to  claim 1 ,
 wherein   at least two insulating layers are formed, and   an optical circuit is formed on an outer layer of one or both of two outermost insulating layers.   
     
     
         9 . The multilayer printed circuit board according to  claim 8 ,
 wherein   an optical circuit is further formed between said insulating layers.   
     
     
         10 . The multilayer printed circuit board according to  claim 1 ,
 wherein   at least two insulating layers are formed, and   the optical circuits are formed only between said insulating layers.   
     
     
         11 . The multilayer printed circuit board according to  claim 1 ,
 wherein   said optical circuits are optical waveguides or optical fiber sheets.   
     
     
         12 . The multilayer printed circuit board according to  claim 1 ,
 wherein   said optical circuits are organic optical waveguides.   
     
     
         13 . The multilayer printed circuit board according to  claim 12 ,
 wherein   particles are mixed in with said organic optical waveguides.   
     
     
         14 . The multilayer printed circuit board according to  claim 13 ,
 wherein   said organic optical waveguides are formed of a core and a clad, and   said particles are mixed in only with said clad.