Nano shower for chip-scale cooling

Abstract

A nano shower cools a chip when a coolant sprays onto the chip package from an array of electro spray nozzles. Ideally, the coolant is not conductive and otherwise not harmful to electronics. As such, perfluorocarbons are ideal coolants. Distilled water also works in certain applications. A voltage difference between the coolant and chip package causes the coolant to spray from the electro spray nozzles onto the chip package. The coolant cools the chip package by evaporating or by absorbing heat and flowing away.

1 . A system comprising:
 a plurality of electrospray nozzles;   a coolant; and   a means of creating a voltage difference between the coolant and a chip package wherein the chip package comprises a chip;   wherein the potential difference drives the coolant through the electro spray nozzles and onto the chip package to thereby cool the chip.   
   
   
       2 . The system of  claim 1  wherein the coolant cools the chip by evaporating. 
   
   
       3 . The system of  claim 1  wherein the coolant cools the chip by absorbing heat and flowing away from the chip. 
   
   
       4 . The system of  claim 1  wherein the coolant comprises a perfluorocarbon. 
   
   
       5 . The system of  claim 1  wherein the coolant comprises water. 
   
   
       6 . The system of  claim 1  wherein the means of creating a voltage potential difference is a power supply. 
   
   
       7 . A system comprising:
 a plurality of electrospray nozzles;   a coolant reservoir wherein a coolant in the reservoir passes to the electrospray nozzles; and   a means of creating a voltage difference between the coolant and a chip package comprising a chip;   wherein the potential difference causes the coolant to spray onto the chip package to thereby cool the chip; and   wherein the chip is a powered semiconductor chip.   
   
   
       8 . The system of  claim 7  wherein the coolant cools the chip by evaporating. 
   
   
       9 . The system of  claim 7  wherein the coolant cools the chip by absorbing heat and flowing away from the chip. 
   
   
       10 . The system of  claim 7  wherein the coolant comprises a perfluorocarbon. 
   
   
       11 . The system of  claim 7  wherein the coolant comprises water. 
   
   
       12 . The system of  claim 7  wherein the means of creating the voltage potential difference is a power supply. 
   
   
       13 . The system of  claim 7  wherein the coolant cools the chip by evaporating, wherein the coolant comprises a perfluorocarbon, wherein the coolant comprises water, and wherein the means of creating the voltage potential difference is a power supply. 
   
   
       14 . A method comprising:
 creating a voltage difference between a coolant and a chip package comprising a chip;   wherein the coolant passes into a plurality of electrospray nozzles;   wherein the voltage difference causes the coolant to spray from the electrospray nozzles onto the chip package; and   wherein the chip is a powered semiconductor chip.   
   
   
       15 . The system of  claim 14  wherein the coolant cools the chip by evaporating. 
   
   
       16 . The system of  claim 14  wherein the coolant cools the chip by absorbing heat and flowing away from the chip. 
   
   
       17 . The system of  claim 14  wherein the coolant comprises a perfluorocarbon. 
   
   
       18 . The system of  claim 14  wherein the coolant comprises water. 
   
   
       19 . The system of  claim 14  wherein the means of creating the voltage potential difference is a power supply. 
   
   
       20 . The system of  claim 14  wherein the coolant cools the chip by evaporating, wherein the coolant comprises a perfluorocarbon, wherein the coolant comprises water, and wherein the means of creating the voltage potential difference is a power supply.