Cooling System for Electronic Substrates

Abstract

The present invention relates to a cooling system for an electronic substrate comprising a heat transfer fluid ( 4, 10 ). The heat transfer fluid ( 4, 10 ) is arranged to flow along a path ( 5, 11, 12 ) by capillary force.

1 . A cooling system for an electronic substrate comprising a heat transfer fluid ( 4 ,  10 ), characterized in that the heat transfer fluid ( 4 ,  10 ) is arranged to flow along a path ( 5 ,  11 ,  12 ) by capillary force. 
   
   
       2 . A cooling system according to  claim 1 , wherein the system further comprises
 an electrode ( 6 ) arranged for applying a voltage to the heat transfer fluid ( 4 ,  10 ) for changing the surface tension of the heat transfer fluid ( 4 ,  10 ).   
   
   
       3 . A cooling system according to  claim 1 , wherein at least one micro channel ( 5 ,  11 ,  12 ) is connected to a heat transfer fluid reservoir ( 3 ). 
   
   
       4 . A cooling system according to  claim 2 , wherein the electrode ( 6 ) is situated outside the heated region ( 7 ). 
   
   
       5 . A cooling system according to  claim 1 , wherein the fluid system is a closed system. 
   
   
       6 . A cooling system according to  claim 1 , wherein the cooling system comprises two immiscible fluids ( 9 ,  10 ). 
   
   
       7 . A cooling system according to  claim 1 , wherein the system is arranged such that the fluid ( 4 ,  10 ) is actuated in a bi-directional manner. 
   
   
       8 . A cooling system according to  claim 1 , wherein the system comprises two sets of micro channels ( 11 ) arranged in a counter flow relationship. 
   
   
       9 . A method for cooling an electronic substrate using a system according to  claim 1 , by applying a voltage to micro channels ( 5 ,  11 ,  12 ) comprising a heat transfer fluid ( 4 ,  10 ) such that the surface tension of the heat transfer fluid ( 4 ,  10 ) is changed. 
   
   
       10 . A method according to  claim 9 , wherein a pulsating voltage is applied.